Processors - Page 66

Well, well, well... Intel's new mid-range Alder Lake-based Core i5-12400 processor has just been used by overclocker Der8auer, and pushed to a huge 5.3GHz -- resulting in up to 33% more performance.

In what feels like the Intel Celeron 300A days are back (hey, Der8auer, do you have a Golden Orb cooler lying around?), Intel's new Core i5-12400 is a non-K series CPU -- meaning it can't be overclocked -- but when Der8auer installed it into a high-end Z690 motherboard, the OC was ready to go.

He thinks that the higher-end Z690 motherboards might be able to unlocked the previously locked non-K series CPU, at least with the Core i5-12400 and Core i5-12600 processors that Der8auer tested, since they have an external clock generator. Flagship motherboards from ASUS and ASRock in the Z690 ROG Maximus and Z690 Aqua are both such boards.

Intel's new Alder Lake CPU architecture is here and while you might be drooling over the flagship Core i9-12900K processor, the dual-core Celeron G6900 processor is a freaking amazing CPU.

The new Intel Celeron G6900 processor is a 2C/2T chip based on the 10nm ESF Golden Cove architecture, with its dual CPU cores clocked at up to 3.4GHz. Intel packs in 4MB of L3 cache, 2.5MB of L2 cache, and has it all for 46W TDP -- but the price, man the price -- is just $42.

At this cost, it's an amazing CPU for an entry-level gaming PC that doesn't require a ton of multi-threaded CPU grunt. Well, Intel's new Celeron G6900 processor installed into an ASRock Z690M Phantom Gaming 4 motherboard and CPU clocks of up to 4.4GHz -- obviously overclocked -- and it beats the two-gen previous flagship Intel Core i9-10900K (with up to 5.3GHz CPU clocks) in single-threaded performance.

Intel's next-gen Xeon "Sapphire Rapids" CPU has been pulled apart, delidded by professional German overclocker and modder "Der8auer".

The Intel Xeon "Sapphire Rapids" CPU was purchased from eBay, and once the overclocker had it in his hands he does what he does best: rip it apart. The sample was labeled "Xeon vPRO XCC QWP3" and is an unreleased server CPU that rocks up to 56 cores and 112 threads.

There's no way to know, as the Sapphire Rapids CPU can't be used because there's no way to buy a motherboard that works with the Intel Xeon "Sapphire Rapids" CPU, period. The sample was pulled apart, delidded, but we don't know the configuration of this chip in question. We can see that there are 4 compute dies on the chip, connected through EMIB technology which der8auer took some beautiful photos under a microscope.

Samsung was meant to unveil its next-gen Exynos 2200 SoC which has a custom AMD RDNA 2-based GPU, but the event was canceled out of nowhere and looks to be coming in the next few weeks.

The company teased it would be unveiling its new Exynos SoC with the "new GPU born from RDNA 2" that would make the gaming marketplace "get serious" -- yeah, serious enough to pull out at the last second, Samsung -- and even launched a social media campaign with a dedicated site for the RDNA 2-based Exynos SoC.

Just 24 hours later, Samsung rescheduled the event and didn't say why... but a company representative did say: "We are planning to unveil the new application processor at the time of launching a new Samsung smartphone. There are no problems with the AP's production and performance".

AMD will be unleashing its next-gen Zen 4 architecture later this year, with the new CPU architecture powering the company's next-gen Ryzen 7000 series processors.

The new AMD Ryzen 7000 series "Raphael" CPUs will be based on the Zen 4 CPU architecture and will be using the new AM5 platform and flashy new LGA 1718 socket we've been hearing more and more about lately. But in a new interview with AnandTech, AMD CEO Dr. Lisa Su talked about the new 5nm process node from TSMC that the company is building its new Zen 4 chips on.

AMD will be tapping a "specially optimized variant" of TSMC's new 5nm process node, which has been designed for high-performance computing. The interview with AT reads: "Dr. Su stated that AMD is continuing to innovate in all areas. For AMD it seems, leading the chiplet technology has helped to bring the package together".

AMD has one of the most interesting processors with some of the most bleeding-edge technology inside with its upcoming Ryzen 7 5800X3D CPU, rocking its flashy new 3D V-Cache technology... but there are issues, which should come at no surprise at this point.

The new AMD Ryzen 7 5800X3D processor will be made on TSMC's current 7nm process node, just like the other Ryzen 5000 series desktop CPUs -- but adding in AMD's exciting new 3D V-Cache is proving to be a problem. DigiTimes is reporting that the 3D SoIC technology from TSMC uses is very new, and isn't at volume production.

3D packaging technology is very new, and with AMD set to launch its new Ryzen 7 5800X3D processor in spring 2022 -- production issues could spell disaster. We are already in an everything shortage, so with one of the most exotic processors ever made using the very latest 3D packaging technology -- AMD's debut of the first processor with 3D V-Cache technology -- it'll be like finding a needle in a haystack while Leonardo DiCaprio looks at his spinning top.

TSMC will be making Intel's next-gen processors in the coming years, with new reports suggesting TSMC will be building the bleeding edge chips at its latest facility in Baoshan, north of Hsinchu.

Intel's next-gen 3nm processors will be built by TSMC at this new facility, where Baoshan has access to a reservoir of water that these massive fabs require. TSMC is in Taiwan and while it's surrounded by water, water shortages across the country have been wreaking havoc at multiple chip-making facilities.

Making the next-gen 3nm chips at this new facility means TSMC can handle the production volume required, as it will have no shortages of water. The Baoshan facility is also close to the main TSMC campus, which is another tick in the box for 'positives' for TSMC to make this move. Intel will have its future-gen Core i3 processors built on the new 3nm process node at TSMC -- as TSMC has its facility gearing to go, while Intel would take many more years to have a next-gen 3nm fabrication plant on US soil.

AMD's next-gen AM5 socket has been teased, which will be the heart and soul of the new Zen 4-powered Ryzen 7000 series CPUs dropping later this year, with this representing AMD's first LGA socket for Ryzen CPUs.

Igor's Lab is behind the leak, with new drawings of AMD's new AM5 mounting system -- and while Igor didn't reveal who was behind the leak -- the new renders show a very Intel-like locking mechanism. We can see a lever that forces a frame onto the socket, making sure that the pressure is equally distributed, and is easy for the user to do.

There are some changes between the LGA 1718 socket here for AM5 and Intel's new LGA 1700 socket for its 12th Gen Core "Alder Lake" CPUs. The new LGA 1718 socket in AM5 form will see the backplate attached to the Socket Actuation Mechanism (SAM) by 4 additional screws, which will make sure the cooler assembly is aligned with the socket, instead of just the backplate.

AMD's new flagship EPYC 7773X "Milan-X" processor is now out in the wild, with dual-socket configurations benchmarked and some truly glorious results to drool over.

The new AMD EPYC 7773X "Milan-X" CPU has 64 cores and 128 threads on the new Zen 3 architecture, with up to a 280W TDP. Inside, the CPU clocks are at 2.2GHz base and 3.5GHz boost, with a truly huge 768MB of L3 cache. This includes 256MB of regular L3 cache, joined by 512MB of cache delivered by the stacked L3 SRAM -- a 3x increase in L3 cache over the previous-gen EPYC "Milan" CPU.

In the new dual-socket configuration, the EPYC 7773X "Milan-X" "100-000000504-04_34/21_N" processor was used, which is a QS/ES (qualifying sample, engineering sample). This CPU has a base clock of 1.8GHz and boost clock of up to 2.9GHz, lower than the flagship EPYC 7773X -- but as a QS/ES sample, this makes sense.

AMD's next-gen AM5 socket will be here later this year, with the new AM5 socket taking AMD's next-gen Zen 4-based Ryzen 7000 series CPUs made on TSMC's new 5nm process node.

In a recent interview with AMD CEO Dr. Lisa Su said that the company has plans to keep the new AM5 platform around for a very long time, just like its AM4 socket has now -- which then had new technologies like faster DDR4 and PCIe 4.0 standards -- AM5 will be the same.

AMD CEO Dr. Lisa Su explains: "Well, we've been extremely pleased with how AM4 has evolved....we said we would keep that socket for a long time and we have. We continue to believe that it has been good for the community and frankly, it's been good for us as well. As we bring things along, it was time to do a socket transition for the new I/O in the new technology, but I think strategy-wise, it should be similar".

Intel told the world that its new Arc GPUs were shipping to OEMs and that they were "coming in Q1 2022" -- all said at CES 2022 -- and now, as CES 2022 is wrapping up Intel has removed any mention of "Q1 2022" from the Intel Arc website.

In its place, Intel now says that its Arc GPUs are "coming 2022" and any mention of Q1 has been wiped. This isn't a traditional mistake as it clearly said "Q1 2022" on the website, and has been clearly changed. There is a photo of Intel at CES 2022 with "Intel ARC" and then drum roll place "Coming Q1 2022".

Curtains down, edits to the website, and voila -- we have the mess that is the Intel Arc GPU launch. Intel could've -- no, should've -- been much clearer with the press and customers about Arc, not like this. We might see a trickle of mobile-focused Arc GPUs debuting inside of laptops in a few months time, but it looks like the Arc can is being kicked down the road a little further.

AMD's next-gen EPYC "Genoa" CPU has been spotted in the flesh, and the handful-of-CPU rocks AMD's next-gen Zen 4 CPU cores -- and up to a huge 96 cores and 192 threads of it -- on the new LGA 6096 socket.

The new CPU will rock up to 96 cores in its first form, with up to 12 CCDs on a single package -- AMD will have support for a huge 12-channel DDR5 memory that will support up to 12TB of DDR5 in total. We're also going to have PCIe 5.0 support, with AMD EPYC "Genoa" CPUs supported with up to 400W TDP.

The new SP5 socket is a big deal, but man the AMD EPYC "Genoa" CPU is a big boi CPU... the next-gen LGA 6096 socket will handle the huge 6096 pins that the new EPYC "Genoa" CPUs will have. TSMC will handle fabbing the new EPYC "Genoa" CPUs on their new 5nm process node, while the new Zen 4 CPU architecture will be spinning around inside of the next-gen silicon.

AMD teased its next-gen Zen 4 architecture and upcoming Ryzen 7000 series CPU at CES 2022, with a test of Halo: Infinite running on an undisclosed Zen 4-based CPU.

Halo: Infinite was run at 1080p on NVIDIA's GeForce RTX 3080 graphics card, alongside a Zen 4-based Ryzen 7000 series CPU which will feature a built-in RDNA 2-based GPU. The new Ryzen 7000 series CPU was installed into a next-gen AM5 motherboard with the new prototype LGA1718 socket.

AMD says that it was hitting 5.0GHz on all of those next-gen Zen 4 cores, so we should see peak CPU clocks boosting over 5.0GHz -- especially with Intel at AMD's heels with its new Core i9-12900KS processor hitting 5.2GHz on all P-cores. The race of 5GHz and beyond is now here, I guess.

AMD has kicked off CES 2022 with its huge press conference, unveiling its new Ryzen 7 5800X3D processor -- packing its exciting new 3D V-Cache technology -- which AMD CEO Dr. Lisa Su says "once again makes Ryzen the fastest gaming CPU in the world".

The new AMD Ryzen 7 5800X3D processor is the first to market with stacked memory technology, and works similar to how the RDNA 2-powered Infinity Cache does on the Radeon RX 6000 series GPUs, and has enough faster L3 cache that it actually beats Intel's just-released flagship Alder Lake-based processor in the Core i9-12900K.

AMD is expecting around 15% more performance thanks to the stacked memory, which means the new Ryzen 7 5800X3D processor is actually faster than AMD's higher-end Ryzen 9 5900X in gaming. Not only that, but the new 5800X3D beats the Core i9-12900K in gaming which is what really matters.

AMD kicks off its huge CES 2022 press conference in a couple of hours, but ahead of that, we have some juicy leaks about their next-gen Zen 4 CPU architecture.

The new AMD Zen 4 CPU architecture will power the next-gen Ryzen 7000 series desktop processors, which will be based on Zen 4-based chiplets on TSMC's exciting new 5nm process node. We should see CPU designs packing 16 Zen 4 cores on their Raphael chiplets, while 8 of them would be "Priority" cores.

The difference there would be that the "Priority" cores would run at full TDP mode, while the other Zen 4 cores would be Low-TDP optimized cores and would operate at a combined 30W TDP. We should see AMD's Zen 4-powered Ryzen 7000 series desktop CPUs will ship with up to 170W TDP, so there should be a lot of fun in between.

Intel has started teasing its new pre-binned Core i9-12900KS processor, which is the first CPU to be thrown all the way up to a 5.5GHz boost clock and up to 5.2GHz on all P-cores.

In a tweet from Intel Technology, we are being teased with an HWiNFO screenshot that shows us a 16-core (8+8) processor that looks to be the pre-binned Core i9-12900KS we've been hearing about. The new "S" version of the CPU will be the Special Edition of the Core i9-12900K like the Core i9-9900KS was to the Core i9-9900K.

Intel has an MSRP of $589 on its Core i9-12900K processor, so we should expect the pre-binned Core i9-12900KS processor to cost even more -- especially if it going to be a stellar overclocker. Even more so now that Silicon Lottery has shut down, with the website previously offering pre-binned CPUs, it seems Intel is just going to do it themselves with the 12900KS.

AMD is readying a new Athlon CPU for the Asian Pacific market, with the introduction of the new Athlon Gold PRO 4150GE APU.

The new AMD Athlon Gold PRO 4150GE APU packs Zen 2 cores for its 4C processor, since it's an entry-level processor and not a higher-end Ryzen CPU. There is no HT here so it's just a 4C/4T processor with a base CPU clock of 3.3GHz, and boost CPU clock of up to 3.7GHz. There's 4MB of L2 cache, and a 35W TDP.

AMD is making use of its 3rd Gen Vega GPU cores, packing in 5 Compute Units (320 cores) with the GPU clocking in at up to 1.5GHz. This is a big upgrade over the previous-gen Athlon Gold PRO 3150GE processor, with 3 CUs and GPU clocks of up to 1.1GHz.

Intel's new NUC 12 Extreme has been a little more detailed thanks to a new photo from HXL leaked onto the internet, teasing that Intel is using a desktop version of its 12th Gen Core "Alder Lake" CPU inside.

Why is this notable? Well, we thought Intel would be using a mobile version of its CPU inside of the NUC 12 Extreme -- but no, it seems they'll be using a desktop version -- meaning it will be even more powerful this generation around. Intel's new NUC 12 Extreme has a desktop LGA 1700 socket, which means you can buy any Alder Lake CPU and use it in the PC.

This means that the Intel NUC 12 Extreme can have the flagship Intel Core i9-12900K/KF processor (with, without the integrated GPU) installed offering up to 8 cores, and 16 threads. Intel's mobile-focused Alder Lake-P processors will tap out at 14 threads, while the Intel NUC 12 Extreme will offer NVMe PCIe 4.0 and DDR4 memory support.

Samsung's next-gen Exynos 2200 SoC will be unveiled on January 11, courtesy of an official tease of the announcement by Samsung.

The new Samsung Exynos 2200 SoC will have an AMD RDNA 2-based GPU inside and will power new Samsung-built smartphones and tablets of 2022 and beyond. We should expect large CPU and GPU improvements over previous Exynos designs, but we'll have to wait and see actual real-world performance numbers first.

We should see Samsung use its new Exynos 2200 SoC inside of its next-gen Galaxy S22 family of smartphones, while the US-based versions of the Galaxy S22 handsets will use Qualcomm's freshly-minted Snapdragon 8 Gen1 SoC. We don't have much longer to wait until the big reveal, with Samsung to detail its new RDNA 2-powered Exynos 22 on January 11, 2022.

AMD is gearing up for a gigantic CES 2022 this week and ahead of the big show we have an "official" photo of their next-gen codename "Rembrandt" APU, freshly minted on TSMC's new 6nm process node.

The new AMD "Rembrandt" APU will become the heart of the new Ryzen 6000 series mobile CPUs, with the new flagship Ryzen 9 6980HX processor smiling for the camera. A couple of new photos of the motherboard from inside of an Alienware m17 R5 gaming laptop, that is powered by AMD's new flagship Ryzen 9 6980HX processor.

This new Alienware m17 R5 gaming laptop will be one of the fastest laptops that AMD has under its AMD Advantage program, and will offer 8 cores and 16 threads with support for both DDR5 RAM and PCIe 4.0 connectivity. There's a built-in GPU powered by the RDNA 2 architecture, with 6 Workgroup Processors inside of the APU.