CPU, APU & Chipsets News - Page 1

NVIDIA is expanding its CPU business with the announcement of a new CPU group in Israel, which will help NVIDIA continue to dominate the HPC market.

It was only in April 2021 that NVIDIA CEO Jensen Huang announced their next-gen ARM-based "Grace" CPU, which will be released in early 2023. The new CPU group will be working with other teams in Israel that are already working on high-speed networking, HPC technologies, and NVIDIA's own Data Processing Units.

NVIDIA CTO Michael Kagan said: "Israel, with its unique wealth of talent, is a key player in the global tech ecosystem, and we are excited to be creating a new CPU group here. We look forward to further growing our local R&D activities both in this area and in our extensive work supporting the local ecosystem through unique programs for startups and developers".

Intel CEO Pat Gelsinger posted a video he made for the end of 2021, providing some of his thoughts on many topics -- but the biggest one was about Intel's new Alder Lake CPUs -- and how AMD is now finished.

Well, kinda -- Gelsinger joined Intel as its freshly-minted CEO in January 2021 in a very tumulous time for the company. In his video, Gelsinger said: "Alder Lake. All of a sudden...Boom! We are back in the game. AMD in the rearview mirror in clients [consumer market], and never again will they be in the windshield; we are just leading the market".

AMD was fighting the good fight with its new Zen 3-powered Ryzen 5000 series desktop CPUs, but Intel really did deliver in strides with its new Alder Lake-powered 12th Gen Core CPUs. Not only are the CPUs the very best you can buy right now, but they also have both DDR5 memory and PCIe 5.0 support. AMD is in the rearview mirror with performance, DDR4 only, and PCIe 4.0 only -- that is, until Zen 4 is here with the Ryzen 7000 series desktop CPUs later this year.

Well, well, well... Intel's new mid-range Alder Lake-based Core i5-12400 processor has just been used by overclocker Der8auer, and pushed to a huge 5.3GHz -- resulting in up to 33% more performance.

In what feels like the Intel Celeron 300A days are back (hey, Der8auer, do you have a Golden Orb cooler lying around?), Intel's new Core i5-12400 is a non-K series CPU -- meaning it can't be overclocked -- but when Der8auer installed it into a high-end Z690 motherboard, the OC was ready to go.

He thinks that the higher-end Z690 motherboards might be able to unlocked the previously locked non-K series CPU, at least with the Core i5-12400 and Core i5-12600 processors that Der8auer tested, since they have an external clock generator. Flagship motherboards from ASUS and ASRock in the Z690 ROG Maximus and Z690 Aqua are both such boards.

Intel's new Alder Lake CPU architecture is here and while you might be drooling over the flagship Core i9-12900K processor, the dual-core Celeron G6900 processor is a freaking amazing CPU.

The new Intel Celeron G6900 processor is a 2C/2T chip based on the 10nm ESF Golden Cove architecture, with its dual CPU cores clocked at up to 3.4GHz. Intel packs in 4MB of L3 cache, 2.5MB of L2 cache, and has it all for 46W TDP -- but the price, man the price -- is just $42.

At this cost, it's an amazing CPU for an entry-level gaming PC that doesn't require a ton of multi-threaded CPU grunt. Well, Intel's new Celeron G6900 processor installed into an ASRock Z690M Phantom Gaming 4 motherboard and CPU clocks of up to 4.4GHz -- obviously overclocked -- and it beats the two-gen previous flagship Intel Core i9-10900K (with up to 5.3GHz CPU clocks) in single-threaded performance.

Intel's next-gen Xeon "Sapphire Rapids" CPU has been pulled apart, delidded by professional German overclocker and modder "Der8auer".

The Intel Xeon "Sapphire Rapids" CPU was purchased from eBay, and once the overclocker had it in his hands he does what he does best: rip it apart. The sample was labeled "Xeon vPRO XCC QWP3" and is an unreleased server CPU that rocks up to 56 cores and 112 threads.

There's no way to know, as the Sapphire Rapids CPU can't be used because there's no way to buy a motherboard that works with the Intel Xeon "Sapphire Rapids" CPU, period. The sample was pulled apart, delidded, but we don't know the configuration of this chip in question. We can see that there are 4 compute dies on the chip, connected through EMIB technology which der8auer took some beautiful photos under a microscope.

Samsung was meant to unveil its next-gen Exynos 2200 SoC which has a custom AMD RDNA 2-based GPU, but the event was canceled out of nowhere and looks to be coming in the next few weeks.

The company teased it would be unveiling its new Exynos SoC with the "new GPU born from RDNA 2" that would make the gaming marketplace "get serious" -- yeah, serious enough to pull out at the last second, Samsung -- and even launched a social media campaign with a dedicated site for the RDNA 2-based Exynos SoC.

Just 24 hours later, Samsung rescheduled the event and didn't say why... but a company representative did say: "We are planning to unveil the new application processor at the time of launching a new Samsung smartphone. There are no problems with the AP's production and performance".

AMD will be unleashing its next-gen Zen 4 architecture later this year, with the new CPU architecture powering the company's next-gen Ryzen 7000 series processors.

The new AMD Ryzen 7000 series "Raphael" CPUs will be based on the Zen 4 CPU architecture and will be using the new AM5 platform and flashy new LGA 1718 socket we've been hearing more and more about lately. But in a new interview with AnandTech, AMD CEO Dr. Lisa Su talked about the new 5nm process node from TSMC that the company is building its new Zen 4 chips on.

AMD will be tapping a "specially optimized variant" of TSMC's new 5nm process node, which has been designed for high-performance computing. The interview with AT reads: "Dr. Su stated that AMD is continuing to innovate in all areas. For AMD it seems, leading the chiplet technology has helped to bring the package together".

AMD has one of the most interesting processors with some of the most bleeding-edge technology inside with its upcoming Ryzen 7 5800X3D CPU, rocking its flashy new 3D V-Cache technology... but there are issues, which should come at no surprise at this point.

The new AMD Ryzen 7 5800X3D processor will be made on TSMC's current 7nm process node, just like the other Ryzen 5000 series desktop CPUs -- but adding in AMD's exciting new 3D V-Cache is proving to be a problem. DigiTimes is reporting that the 3D SoIC technology from TSMC uses is very new, and isn't at volume production.

3D packaging technology is very new, and with AMD set to launch its new Ryzen 7 5800X3D processor in spring 2022 -- production issues could spell disaster. We are already in an everything shortage, so with one of the most exotic processors ever made using the very latest 3D packaging technology -- AMD's debut of the first processor with 3D V-Cache technology -- it'll be like finding a needle in a haystack while Leonardo DiCaprio looks at his spinning top.

TSMC will be making Intel's next-gen processors in the coming years, with new reports suggesting TSMC will be building the bleeding edge chips at its latest facility in Baoshan, north of Hsinchu.

Intel's next-gen 3nm processors will be built by TSMC at this new facility, where Baoshan has access to a reservoir of water that these massive fabs require. TSMC is in Taiwan and while it's surrounded by water, water shortages across the country have been wreaking havoc at multiple chip-making facilities.

Making the next-gen 3nm chips at this new facility means TSMC can handle the production volume required, as it will have no shortages of water. The Baoshan facility is also close to the main TSMC campus, which is another tick in the box for 'positives' for TSMC to make this move. Intel will have its future-gen Core i3 processors built on the new 3nm process node at TSMC -- as TSMC has its facility gearing to go, while Intel would take many more years to have a next-gen 3nm fabrication plant on US soil.

AMD's next-gen AM5 socket has been teased, which will be the heart and soul of the new Zen 4-powered Ryzen 7000 series CPUs dropping later this year, with this representing AMD's first LGA socket for Ryzen CPUs.

Igor's Lab is behind the leak, with new drawings of AMD's new AM5 mounting system -- and while Igor didn't reveal who was behind the leak -- the new renders show a very Intel-like locking mechanism. We can see a lever that forces a frame onto the socket, making sure that the pressure is equally distributed, and is easy for the user to do.

There are some changes between the LGA 1718 socket here for AM5 and Intel's new LGA 1700 socket for its 12th Gen Core "Alder Lake" CPUs. The new LGA 1718 socket in AM5 form will see the backplate attached to the Socket Actuation Mechanism (SAM) by 4 additional screws, which will make sure the cooler assembly is aligned with the socket, instead of just the backplate.