CPU, APU & Chipsets Posts - Page 1
A slew of new leaks are teasing that AMD's next-gen Zen 3 architecture, Ryzen 4000-series CPUs, and new 600-series chipset are all ramping to launch towards the tail end of 2020.
Electronic Times is reporting that AMD's new 600-series chipset will support both USB 3.2 and USB 4.0, with AMD's new chipset designed to support the next-gen Zen 3 architecture and Ryzen 4000 series processors. We should expect large IPC gains with the new Zen 3 processors, which will continue to see AMD excel in the CPU market.
AMD will have a flagship X670 chipset, something that will continue to support he AM4 socket and PCIe 4.0 standard, but we could also see native Thunderbolt 3 support included. Other rumors do state that AMD could shift away from the AM4 socket, but that would be a big shift -- it would end backwards compatibility, but it could introduce new tech like DDR5 and PCIe 5.0 standards going forward.
Intel is reportedly preparing a monster new HEDT processor on its 10th-gen Copper Lake family of CPUs, but this is heavy rumor territory folks.
The new CPU would be a monster 22-core/44-thread processor with an even more monstrous 380W TDP, with ComputerBase reporting from their sources that Intel is considering the use of XCC-Die on the LGA2066 socket (Xtreme Core Count).
LGA2066 has (at least until this new mysterious CPU arrives) had HCC (High Core Count) dies, but this could all change with a huge 22C/44T chip. Motherboard manufacturers also reportedly confirmed the rumors on the show floor of CES 2020, but once again -- this is all just rumor mill chatter, for now.
It looks like Intel will be finding itself in some (extremely) hot water with its upcoming Comet Lake-S family of CPUs with the new flagship 10-core/20-thread model packing some heat.
ComputerBase sat down with motherboard makers on the CES show floor, talking about Intel's upcoming 14nm-based Comet Lake-S processors. The site was told that motherboard makers have their Z490 boards ready to go, but Intel is holding everything back.
Intel's new Comet Lake-S will span an entire range of processors from Core i3, Core i5, Core i7, and the flagship Core i9. But it's the high-end model that might be in serious trouble, with ComputerBase: "Several motherboard manufacturers revealed that the 10-core breaks the 300-watt mark at maximum load. Not surprisingly, the 9900KS already exceeded the 250-watt mark in scenarios of this kind".
CES 2020 - Intel didn't have too much to show during its CES 2020 keynote compared to AMD, which came out swinging with its 64-core/128-thread Ryzen Threadripper 3990X processor, super-powered Ryzen 4000 series mobile CPUs, and the new mid-range Radeon RX 5600 XT graphics card.
But what Intel did have to show off was a new range of next-gen Tiger Lake CPUs, new chips that will be made on the 10nm node and pack twice the graphics power of the previous-gen offerings from Intel. Intel teased a Tiger Lake-powered thin-and-light gaming laptop playing some games, but weren't detailed in what resolution, or detail level it was playing in.
We do know that Tiger Lake CPUs will have Intel Xe GPU cores -- and while we're talking about Xe, Intel showed off some Destiny 2 gameplay on its DG1 discrete graphics card. It was very brief, and had even less detail than the Tiger Lake show off -- but there we have it. Tiger Lake CPUs teased for later this year, and our first 'demo' of DG1 at CES 2020.
CES 2020 - AMD unleashed its new Ryzen 4000 series mobile CPUs today at CES 2020, with teh flagship Ryzen 7 4800H and new Ryzen 7 4800U offerings.
AMD CEO Dr. Lisa Su promised that there are over 100 new systems and designs coming in 2020, all powered with AMD's new Ryzen 4000 series mobile offerings. There are over 12 new designs coming in Q1 2020 alone for the new U-series processors.
The first AMD Ryzen 4000 series laptop offerings will drop in the coming months, while higher-end gaming rigs will follow.
CES 2020 - We knew it was coming, but now it is official -- AMD's new kick ass flagship Zen 2-based Ryzen Threadripper 3990X is real and boy, is it a beast.
The new AMD Ryzen Threadripper 3990X offers up an insane 64 cores and 128 threads of CPU power on the new TRX40 platform, with the 64C/128T chip having a base CPU clock of 2.9GHz, and boost CPU clock of 4.3GHz. AMD says that its new Ryzen Threadripper 3990X processor hits 25,000 points in the Cinebench R20 benchmark.
AMD teased a V-Ray benchmark load of a scene from Terminator: Dark Fate, rendering on the competitors best -- dual Intel Xeon Platinum 8280 processors (combined 56C/112T) in 1 hour 30 minutes... but on the new Ryzen Threadripper 3990X it takes just 1 hour 3 minutes in comparison. Better yet, a $3990 processor versus $20,000 -- a gigantic difference.
CES 2020 - AMD has just made its new Ryzen 7 4800H processor official, with the Ryzen 7 4800H being a powerhouse laptop CPU that even kicks the ass of Intel's desktop CPU in the Core i7-9700K.
AMD's new Ryzen 7 4800H processor has desktop-class performance on-the-go, with it coming in as an 8C/16T processor with 2.9GHz base and up to 4.2GHz boost CPU clocks on a 45W TDP. AMD built the new Ryzen 7 4800H processor for the most demanding workloads, and is a gigantic step ahead of its previous mobile designs.
The company compared the new AMD Ryzen 7 4800H processor against Intel's own Core i7-9750H processor (6C/12T @ 45W) and the desktop Core i7-9700K (8C/16T @ 95W) where it beat both of these CPUs easily. Hell, the new Ryzen 7 4800H is 13% faster than the desktop-bound Core i7-9700K and that is a hugely impressive thing to see.
CES 2020 - AMD has just taken their wraps off of the industry-changing Ryzen 4000 series mobile CPUs, with the flagship Ryzen 7 4800U processor announced.
AMD's new Ryzen 7 4800U processor is the world's highest-performing ultra-thin laptop processor, throwing up a huge 8C/16T of processing grunt at 1.8GHz base CPU clock and up to 4.2GHz boost clocks. We have 8 Radeon GPU cores based on the Vega GPU architecture, with just a 15W TDP.
We were told by AMD CEO Dr. Lisa Su on stage that the new Ryzen 4000 series mobile CPUs will offer great performance and all-day battery life through 2020.
CES 2020 - Intel has come out swinging at CES 2020 this year, revealing its new 10th-gen Comet Lake-H family of CPUs that will continue on the 14nm+++ node, but will pack architectural improvements the company has made since Skylake.
Intel has something truly exciting on offer with its 10th-gen Comet Lake-H family of CPUs, with a new flagship chip that will offer up 8C/16T at over 5GHz. There will be Core i5, Core i7, and Core i9 models that will feature 4C/8T, 6C/12T, and 8C/16T respectively.
The company teased just before CES 2020 kicks off that its new Core i9 series processors will offer the full 8 cores and 16 threads at over 5GHz, all inside of a notebook. This will come down to the thermal design and cooling technology used by gaming notebooks like ASUS, Razer, and others -- but it will be powered by Intel's own Thermal Velocity Boost technology that will offer crazy boost CPU clocks when possible.
Samsung has kicked off the new decade in a big way, with the South Korean giant making major progress in its pursuits to become the #1 semiconductor manufacturer by 2030. Samsung has just made a prototype 3nm process using GAAFET technology.
Gate All Around (GAAFET) technology is different to the widely-used and known FinFET standard, with GAAFET seeing a reduction in the total silicon size by around 35%, while consuming 50% less power. This blend can see a 33% performance increase over the still-yet-released 5nm FinFET process.
The design of GAAFET is much different to Planar FET and FinFET designs, with 4 Gates on channel compared to just 1 Gate and 3 Gates, respectively. This means power leakage is kept to a minimum, with control over the channel improved the shrinking of the node process becomes easier. This paves the way for more efficient transistor design, even at its teeny-tiny size -- ushering in a huge performance-per-watt jump over the 5nm FinFET process.