RAM - Page 12

G.SKILL is set to make another big splash in extreme overclocking at Computex 2024. Its booth will host the 10th Annual OC World Record Stage 2024, where high-end Intel motherboards from ASRock, ASUS, GIGABYTE, and MSI will be paired with G.SKILL DDR5 memory and plenty of liquid nitrogen (LN2).

The world's top overclockers will do their thing in front of a live audience (we'll be there!), attempting to achieve as many overclocking records as possible. G.SKILL has released the 10th Annual OC World Record Stage 2024 schedule (see it above), which kicks off on June 4 and runs through to June 7.

Each motherboard maker and a group of overclockers will be given their day in the sun (or is that LN2 fog), with OC legends like HiCookie and Splave set to appear. The 8th Annual OC World Cup 2024 Competition will also take place live at the G.SKILL Computex 2024 booth, with overclockers going head-to-head with G.SKILL DDR5 memory and 14th Gen Intel Core processors - and yes, even more LN2.

Samsung is speeding into the world of next-gen 3D RAM, the future of compact RAM, something we're learning from its presentation during IMW 2024 this week.

VCT (vertical channel transistor) DRAM is one of the first achievements towards this goal, with Samsung expected to complete the initial development of VCT DRAM in 2025, with 3D DRAM hitting the market by 2030. IWM 2024 is an international conference for computer memory companies, where Samsung teased its developments in DRAM innovation.

ZDNet Korea reported on the story, with Samsung Vice President, Lee Si-woo, speaking during Samsung's research in 4F Square VCT DRAM and 3D DRAM. Lee said: "Industrial developments such as hyperscaler AI and on-demand AI require a lot of memory processing ability. On the other hand, the microprocessing technology of existing DRAM is limited". While, in the future, Lee predicts "new innovations are expected to occur in the structure of cells".

Just as the PC market is pushing heavily into DDR5 memory, we're hearing more about both DDR6 and LPDDR6 memory.

In a new JEDEC presentation, we're hearing about DDR6, LPDDR6, and new CAMM standards for memory. LPDDR5 for example is already 5 years old, and while we've seen mid-product update refreshes including LPDDR5X and LPDDR5T, they won't be good enough for the years to come.

DDR6 memory will reportedly start off at 8800MT/s of bandwidth, up to a huge 17,600MT/s of bandwidth with a "possible extension" to an incredible 21,000MT/s of bandwidth. Keep in mind that DDR5 ranges from between 4000MT/s and 8400MT/s, while DDR4 was stuck down at 1600MT/s through to 3200MT/s.

It seems Microsoft is finally testing the display of memory speeds as MT/s (mega-transfers per second) over the traditional MHz (megahertz) in the Windows 11 Task Manager.

PhantomOcean3, a self-proclaimed Windows sleuth, noticed that Microsoft is now testing showing MT/s for RAM instead of MHz in the Windows 11 Task Manager performance tab. Why is this important?

We see the data transfer speed of computer memory (RAM) advertised with the MHz metric, which represents how many millions of cycles per second the memory module can perform, with each of those cycles being an action on the memory module itself, like storing and retrieving data.

The HBM market is unstoppable right now, attached to the insatiable AI demand that is fueling SK hynix and Micron to sell all of their HBM memory allocation for 2024, and 2025.

In a new report from TrendForce, Senior Research Vice President Avril Wu says that the HBM market is poised for robust growth, "driven by significant premiums and increased capacity needs for AI chips". HBM unit sales are multiple times higher than conventional DRAM, and about 5x higher than DDR5.

Wu explains: "This pricing, combined with product iterations in AI chip technology that increase single-device HBM capacity, is expected to dramatically raise HBM's share in both the capacity and market value of the DRAM market from 2023 to 2025. Specifically, HBM's share of total DRAM bit capacity is estimated to rise from 2% in 2023 to 5% in 2024 and surpass 10% by 2025. In terms of market value, HBM is projected to account for more than 20% of the total DRAM market value starting in 2024, potentially exceeding 30% by 2025".

A new type of memory has been tested running at a blistering 600C for over 60 hours by researchers at the University of Pennsylvania.

The researchers have used non-volatile ferroelectric diode (ferrodiode) memory that has absolutely astonishing heat resistance and other properties that allow cutting-edge data and extreme environment computing to breathe a little, pun intended.

Ferrodiode memory devices use a 45nm thin layer of a synthesized AIScN (I0.68Sc0.32N) because of its ability to retain electric states "after an external electric field is removed".

Micron has released the industry's first high-end 128GB DDR5 RDIMM memory that's destined for AI data centers, with speeds of up to 8000MT/s.

Micron announced today that it has validated and shipped its high-capacity monolithic 32Gb DRAM die-based 128GB DDR5 RDIMM memory with speeds starting at 5600MT/s on all leading server platforms. The company explains that its new memory modules are powered by Micron's in-house, industry-leading 1-beta technology, with 45% improved bit density, up to 22% improved energy efficiency, and up to 16% lower latency over competitive through silicon via (TSV) products.

Micron's new high-capacity 128GB DDR5 RDIMMs deliver up to 28% faster performance for AI training, while the 16% less latency is important for memory-bound workloads including generative AI, in-memory databases, and real-time data analytics, where high capacity is needed, and prompt response times are critical for real-time inference.

Samsung has just announced that it has developed the industry's first LPDDR5X memory, supporting the industry's highest performance at up to 10.7Gbps.

The South Korean giant uses 12nm-class process technology, with Samsung achieving the smallest chip size among existing LPDDR memory, which the company says solidifies its technological leadership in the low-power DRAM market. We have all seen the insatiable demand for AI, with on-device AI being a big future for processing AI workloads on devices, which is where low-power, high-performance LPDDR memory steps in.

YongCheol Bae, Executive Vice President of Memory Product Planning of the Memory Business at Samsung Electronics, said: "As demand for low-power, high-performance memory increases, LPDDR DRAM is expected to expand its applications from mainly mobile to other areas that traditionally require higher performance and reliability such as PCs, accelerators, servers and automobiles. Samsung will continue to innovate and deliver optimized products for the upcoming on-device AI era through close collaboration with customers".

Corsair has just announced that it has entered the DDR5 workstation memory market, with the introduction of its new WS DDR5 RDIMM memory kits.

The new Corsair WS DDR5 RDIMM memory kits have been engineered to offer uncompromising performance and reliability. They are compatible with Intel's new 4th Gen Xeon and AMD Ryzen Threadripper 7000 series CPUs. If you want to fill every DIMM slot of your motherboard, they come in huge 256 GB DDR5 memory kits.

Corsair says that with its memory kits coming in huge 256GB capacities, it will set a new standard for memory-intensive tasks like high-resolution media editing, 3D rendering, and of course, AI training. Corsair has carefully screened each DIMM, with the modules passing JEDEC specifications with higher timings and higher speeds, making sure you get the optimal performance for the huge workloads these DIMMs will crush.

V-Color has revealed some seriously speedy DDR5 system RAM which is getting on towards the 9GHz milestone for overclocking.

The new Manta XFinity RGB DDR5 memory modules are made in collaboration with MSI, and support being overclocked to a blistering 8600MHz (via Intel's XMP profile).

As V-Color observes, the RAM has been tested and verified on ASRock Phantom Gaming Z790I Lightning Wi-Fi (and Phantom Gaming B760I) motherboards, and it's turning the heads of some expert overclockers already.

Corsair has teamed with Chinese company Yeston on some new Sakura-themed Vengeance DDR5 memory, check it out:

The new Corsair Vengeance DDR5 memory was spotted on Corsair's China Weibo account, showing off the new DDR5 memory modules with Sakura-themed flowers and anime-inspired characters dressed in beautiful bridal gowns. Each side of the Sakura-themed Vengeance DDR5 memory is styled differently, with one side featuring chibi stylings and the other having a more typical Japanese animation.

Inside, they're regular Corsair Vengeance DDR5 memory that will work with either AMD Ryzen 7000 series "Zen 4" processors or Intel 12th Gen, 13th Gen, and 14th Gen CPUs if you've got the right motherboard ready for DDR5 memory. Corsair's new Sakura-themed Vengeance DDR5 memory seems only available in China for now, but hopefully, they make it across the pond.

Patriot has just teased that it partnered with MSI on some new Viper DDR5 memory, themed with a gorgeous all-white design and RGB lighting strip at the top. Check it out:

Patriot's Viper memory account on X said that this is NOT an April Fool's joke and that the MSI x Patriot Viper DDR5 memory was "coming soon." The new all-white DDR5 memory will be part of the Viper Extreme 5 RAM family, but we don't know how high the speeds will be.

MSI replied to Patriot Viper's tweet, saying, "That's exactly what someone doing an April Fool's Day would say," but this isn't an April Fool's Day joke; it's real.

Micron teased some incredible new 256GB MCR DIMM memory modules at NVIDIA's recent GPU Technology Conference (GTC) last week.

The new Micron 256GB DDR5-8800 MCRDIMMs have been designed for next-generation servers, and being at GTC 2024, you'd think they're being aimed at AI systems and servers, including Intel's new Xeon Scalable "Granite Rapids" processors, with Micron already sampling the new 256GB modules to customers.

Micron's new 256GB MCRDIMM in DDR5-8800 spec at GTC, as pictured by Tom's Hardware, was in tall form factor, but the company plans to offer its new MCRDIMMs in standard height for 1U servers and more. Micron is using monolithic 32Gb DDR5 ICs, but the tall form factor module uses 2-Hi stacked packages, meaning it will run a little hotter because there's less space for thermal dissipation.

ASUS has just announced that all of its Intel 700 and 600 series and its entire fleet of AMD AM5 socket motherboards, support up to 256GB of DDR5 memory.

The only exception to the new 256GB DDR5 RAM support upgrade to ASUS' fleet of motherboards is that they'll need to have 4 x DIMMs to have 64GB sticks in each of them for a total of 256GB. Motherboards with only two DIMM slots will now support up to 128GB of DDR5 memory.

64GB DDR5 memory modules are now out in the market, with ASUS updating its motherboard family to support these 64GB sticks for a total of 256GB memory. If you own an Intel motherboard based on the Intel 700 or 600 series chipset by ASUS, you'll need to update your BIOS to support 256GB of DDR5 memory. AMD users might not need to update their BIOS, but if there's a new one, you'll probably want to update just to be sure.

Crucial has just announced its new 12GB DDR5 memory DIMMs for both desktop PCs and laptops, which sits between 8GB and 16GB DIMMs.

We already have the usual 8GB, 16GB, and 32GB memory sticks, but also 24GB, 48GB, and 64GB DIMMs if you want oodles of RAM. Crucial's introduction of 12GB DDR5 memory DIMMs offers a 50% capacity boost over 8GB, offering 24GB in dual-channel DDR5 configurations (versus 16GB if you used 2 x 8GB sticks).

Crucial's new 12GB DDR5 memory is already listed on the Amazon UK website, spotted by industry insider "Momomo_US" on X. Crucial's new 12GB DDR5 sticks have a part number of "CT12G56C46S5" with speeds of DDR5-5600, but it can be downclocked to 5200 and 4800 if required.

V-color has just unveiled its latest DDR5 OC R-DIMM series memory, which is optimized for AMD's new WRX90 workstation motherboards and CPUs.

The new v-color DDR5 OC R-DIMM has been engineered from the ground up to meet the demand of new AI developers, heavy render modeling, simulation tasks, and high-end performance users. The new series comes with a new technology that targets a known issue with overclocking R-DIMM memory: high temperatures.

To deal with the high temperatures, the new v-color OC R-DIMM for WRX90 features a new micro-heatsink that protects the RCD and PMIC from high temperatures without compromising room for air flow. V-color's new DDR5 OC R-DIMM has been tested with "amazing results" on the ASRock WRX90 WS EVO, ASUS PRO WRX90E-SAGE SE, and Super Micro motherboards.

ADATA has just unveiled a brand new DDR5 memory thermal coating, which, when applied to the PCB, increases cooling efficiency by over 10%.

The new coating on XPG DDR5 memory is impressive, not only does the PCB thermal coating cool the memory temperatures, but it will increase the performance and lifespan of ADATA's overclocked XPG and RAMP DDR5 memory modules. ADATA will fully launch its new Lancer Neon RGB DDR5 and Lancer RGB series memory modules with its new PCB thermal coating at Computex 2024 in a few months time.

ADATA explains: "Therefore, XPG is leading the industry in applying PCB (printed circuit board) thermal coating technology to overclocked memory, effectively reducing temperatures by more than 10%. Real-world testing demonstrated an 8.5C temperature reduction in overclocked DDR5 memory with PCB heat-dissipating coating technology compared to standard overclocked memory and an enhanced heat dissipation efficiency of 10.8%."

A new overclocking world record has been set by Soonho "SAFEDISK" Jeong in SuperPi-32M with G.SKILL DDR5 memory.

G.SKILL has announced that its Trident Z5 DDR5 memory has been used to hit a new overclocking world record in SuperPi-32m, with SAFEDISK hitting an astonishing 2 minutes 59 seconds 919 milliseconds with the use of G.SKILL's Trident Z5 RGB DDR5 memory, ASUS ROG Maximus Z790 Apex Encore motherboard, and Intel Core i9-14900KF CPU, while under liquid nitrogen cooling.

The new world record marks the first time this benchmark category has reached under 3 minutes, with SAFEDISK beating the previous record of 3 minutes, 1 second, and 156 milliseconds. Notably, with the use of liquid nitrogen, the CPU temperature reached as low as -188°C and hit 8449.2MHz. As for memory, the Trident Z5 RGB DDR5 reached as low as -60°C to reach DDR5-9052 with timings of CL32-48-45-36.

Crucial has just announced its new DDR5 Pro Memory: Overclocking Edition memory is now offered in higher speeds of up to DDR5-6000.

The new DDR5 Pro Memory: Overclocking Edition from Crucial joins their family of overclocked DDR5 RAM, which was introduced last year in 5200 and 5600MT/s speeds. They're designed for mainstream consumers, ready to rock and roll inside the latest AMD and Intel CPUs and motherboards.

Crucial's new DDR5 Pro Memory: Overclocking Edition continues the journey for the overclocked RAM, with DDR5-5200 and DDR5-5600 kits being joined by new DDR5-6000 memory kits. The new DIMMs have been designed with overclocking in mind, rocking tighter memory timings of CL36 (36-38-38-80) with up to 1.35V.

AMD's new mid-range Ryzen 8000G "Hawk Point" APU series is now out in the wild, with the fastest Hawk Point APU in the Ryzen 7 8700G being used for some new DDR5 memory overclocking world records.

We've already seen overclockers using the AMD Ryzen 7 8700G APU inside of an AORUS B650 Tachyon motherboard, pushing a DDR5-10346 memory overclock. Now, the ASUS OC team has pushed things even further, using the Ryzen 7 8700G APU inside of the ASUS ROG Crosshair X670E Gene motherboard and DDR5-10600 memory speeds.

The DDR5 memory in question is the G.SKILL Trident Z5 memory, which ut of the box will run at DDR5-7600 CL36 specs. The ASUS OC team pushed it up to DDR5-10600 speeds with CL50 at 1.4V, with no massive array of cooling the RAM or the APU needed for this new record. The team used a regular AIO liquid cooler for the test.