RAM News - Page 1

New memory module releases happen at a pretty steady clip. Still, the latest T-FORCE VULCAN ECO DDR5 Desktop Overclocking Memory from TEAMGROUP is worth highlighting for several reasons. First, there's support for the latest Intel XMP 3.0 and AMD EXPO overclocking profile features for simple and easy dual-platform overclocking. Second, you've got on-die ECC with IC error detection and correction for reliability and stability backed by a lifetime warranty.

Most importantly, though, is that the new T-FORCE VULCAN ECO DDR5 Desktop Overclocking Memory is the industry's first DDR5 OC memory module featuring an aluminum heat sink made from recycled materials. And we're not talking about a small percentage either, with the highly efficient heat spreaders made from 80% recycled aluminum.

And with that, this is the first memory product designed for gaming from T-FORCE that is sustainable, eco-friendly, and able to handle whatever workloads you can throw at it.

Micron has just announced its new 128GB DDR5 RDIMMs that are capable of operating at 8000 MT/s today, where they'll enter mass production in 2024.

The company recently started fabricating its new 32Gb monolithic DDR5 dies, with its mature 1β technology, Micron says its new 32Gb monolithic DDR5 dies have over 45% more bit density, reaching speeds of up to 8000 MT/s as well as having more aggressive timing latencies compared to the regular JEDEC specs. Micron is flexing its 1β process here, claiming it's up to 24% more energy efficient than the competitors' 3DS TSV technology.

Micron not using 3DS TSV also allows for lower AI training times, with 1β allowing Micron to optimize the data input buffers and critical I/O circuits better, as well as reducing the pin capacitance on the data lines. The benefit? Higher speeds and lower power consumption. You can see in the chart above that Micron has increased its monolithic die density by 100% every 3 years or so; where we last had 24Gb in 2022, and now at the tail end of 2023 we have 32Gb dies.

With the launch of the new Intel Core 14th Gen desktop processors, Intel's 'Raptor Lake Refresh' is paving the way for improved and simplified overclocking. This is not only for a wider audience to get the most out of each CPU Core (the 14900K offers up an out-of-the-box 6 GHz boost), but it extends to the DDR5 memory support.

The flagship Intel Core i9 14900K is one of the fastest processors in the world for gaming, productivity, and multitasking, and with a new range of motherboards hitting the scene for the new 14th Gen, memory and storage speeds will continue to rise.

Hardware support for the new gen is strong (a lot of that comes with it being a refresh of the 13th-gen architecture), with ADATA and XPG noting that its full range of memory and SSD storage solutions are ready for the new generation of Intel CPUs. The company conducted compatibility testing with Intel and motherboard brands prior to the 14th Gen launch to ensure there were no issues.

With the launch of Intel's 14th Gen 'Raptor Lake Refresh' CPUs, the overclocking potential for both the CPU's boost clock frequency and DDR5 memory has improved, and now it's possible to push the latter into the region of DDR5 10000. Throw in LN2, or liquid nitrogen, into the mix, and then that number climbs to over DDR5 11000.

Intel brought some live overclocking to SXSW Sydney, the location of this year's massive IEM Sydney Counter-Strike 2 global tournament. The OC experts of Team AU Overclocking (with the legend Hicookie himself) not only broke the world record for DDR5 memory frequency with 5809.2 MHz but managed to do so live on stage!

Intel's Dino Strkljevic let the crowd know there was a backup submission of the score in case things didn't go as planned on the day - but they did, and it was an incredible sight.

The Meta Quest 3 launched earlier this month, and sitting at the heart of Meta's latest VR and Mixed-Reality headset is the new Snapdragon XR2 Gen 2 processor, the latest extended reality (XR) platform from Qualcomm Technologies. A new APU is simply one part of the picture for bringing VR and Mixed-Reality to a broader audience; there's also memory and flash storage.

On that front, Micron is leading the pack with its low-power double data rate 5X (LPDDR5X) DRAM and Universal Flash Storage (UFS) 3.1, designed to deliver next-gen speeds and performance in the smallest form factors for true untethered VR and Mixed-Reality devices. One of the reasons why Meta's Quest range has become so popular is because it delivers a wire-free experience that feels like the next step forward for VR/AR and Mixed-Reality tech.

Micron's LPDDR5X uses cutting-edge 1-alpha process node technology in addition to featuring JEDEC power advancements, where it can deliver speeds of up to 8.533 Gbps with full backward compatibility with LPDDR5 - a 33% increase in data access speeds. The company's UFS 3.1 storage is the world's first UFS powered by Micron's 176-layer NAND.

We all know there are countless DDR5 memory options out in the wild now, with v-color teasing its new DDR5 memory kit for some truly extreme performance. The new unparalleled DDR5 memory specification is designed to push the boundaries of what's possible with low-latency performance, with v-color's new DDR5-5600 and DDR5-5800 memory kits.

The new v-color ultra-low latency kits come in 32GB and 64GB kits (32GB = 2 x 16GB and 64GB = 2 x 32GB sticks) with latencies of CL26, which will usher in super-fast performance for gamers and enthusiasts alike. The new v-color Ultra-Low-Latency XSky series DDR5 memory kits are operating at 32GB (2x16GB) DDR5 5600MHz CL26-36-36-76 1.4V, 32GB (2x16GB) DDR5 5800MHz CL26-36-36-76 1.4V and 64GB (2x32GB) DDR5 5600MHz CL26-36-36-76 1.4V.

The company explains that its dedication to technological innovation is evident in the new Ultra-Low-Latency XSky series DDR5 memory kits, with its CL26 latency, setting new benchmarks in the DDR5 memory performance landscape. V-Color's new DDR5-5600 CL26 and DDR5-5800 CL26 memory kist showcase their performance in action by working seamlessly with Intel's Core desktop CPU family, and Intel's range of chipsets across a family of motherboards.

T-FORCE XTREEM DDR5 memory is the latest high-speed RAM from TeamGroup designed specifically for gamers and overclocking with speeds starting from 7600 MHz to an impressive 8200 MHz. Compatible with Intel 700 series motherboards, these premium memory kits will be available in 48GB (2 x 24GB) and 32GB (2 x 16GB) capacities when they launch later this month in North America.

With impressive specs and design features, like the 2mm-thick aluminum alloy fin heatsinks to improve thermal performance and the use of special heat-conducting silicon in the construction, each stick also arrives decorated with a T-FORCE logo badge to signify its place as one of the most powerful overclocking DDR5 memory modules available.

T-FORCE XTREEM DDR5 memory also sports a two-piece metallic heat spreader with a matte black finish and texture that looks stylish and rugged. T-FORCE calls the design "elegant," and we agree. Here's a breakdown of the kits coming, with details on speed, capacity, timing, and more.

Samsung has announced that it has developed the world's first Low Power Compression Attached Memory Module (LPCAMM) form factor for laptop memory, which could transform the DRAM and DDR5 market across PCs, laptops, and even data centers.

Samsung notes that LPDDR5X-based LPCAMM modules can improve performance by 50% and power efficiency by up to 70% while taking up 60% less space when compared to So-DIMM technology. This is exciting news for the mobile market, especially for compact gaming devices, as you're looking at speed, efficiency, and a small physical footprint.

Look at the animated gif above; you'll see how much of a space saver it can be. Speed-wise, Samsung confirms that it has successfully tested 7.5 gigabits-per-second (Gbps) LPCAMM through Intel's platform - so it'll be fast too.

TEAMGROUP has announced a new range of high-speed DDR5 memory under the company's T-CREATE brand for creators, designed for workstations and servers. According to the press release, the T-CREATE MASTER DDR5 OC R-DIMM series is a great option for "large-scale projects, analyzing large data sets, and running multiple specialized applications concurrently."

As the latest overclocking ECC Registered DIMM memory from TEAMGROUP, speed-wise, you're looking at some capable kits with 6000 MHz, 6400 MHz, and 6800 MHz frequencies.

And when paired with the right workstation motherboard, it can reach a massive 384GB of total memory. With on-die ECC, there's also the promise of stability to match the excellent performance. T-CREATE MASTER DDR5 OC R-DIMM memory is compatible with the latest Intel Xeon processors and W790 series motherboards. It is set to hit the market sometime in October - arriving with a lifetime warranty.

About a month ago, Samsung announced that it had completed development on the world's first GDDR7 ( Graphics Double Data Rate 7) DRAM for GPUs and that it would be putting the technology in the hands of key customers sometime this year for use in next-generation products.

Read more: https://www.tweaktown.com/news/92472/samsung-has-developed-the-first-gddr7-memory-for-gpus-with-up-to-32-gbps-speed/index.html

A new report at Business Korea states that as Samsung became the first company to develop cutting-edge GDDR7 memory, it's already supplying samples to NVIDIA "for the verification of its integration into next-gen systems." If NVIDIA chooses to adopt GDDR7 for the upcoming GeForce RTX 50 Series, it would significantly change from using Micron - which supplies NVIDIA GDDR6X memory for the GeForce RTX 40 Series.