Processors - Page 67

Intel has officially launched its new 12th Gen Core "Alder Lake" CPUs into the wild, but the mid-range Core i5-12400 isn't with us just yet... but you might want to wait for it.

In some new leaked benchmarks, the Core i5-12400 -- which is a 6-core, 12-thread CPU with only Golden Cove (P-cores). Intel's mid-range Core i5-12400 has 18MB of L3 cache, and will have the 6 cores and 12 threads at 3.00GHz base, and up to 4.6GHz for only 65W TDP.

Intel's mid-range Core i5-12400 will be aimed at AMD's Zen 3-powered Ryzen 5 5600X which also offers 6 cores and 12 threads, but the thing is -- the Core i5-12400 actually beats Intel's previous-gen, but flagship Core i9-11900K -- in gaming benchmarks. The Core i5-12400 is running in the MSI B660M Mortar DDR5 motherboard, cooled by the MSI MAG CoreLiquid C240 AIO liquid CPU cooler.

It doesn't feel real, but there are only a few hours left of 2021 -- which means CES 2022 is right around the corner -- and AMD has a big show planned.

AMD will be detailing a bunch of new products, technologies, and more at CES 2022 -- which will include some new details on their next-gen Zen 4 CPU architecture. In a new interview with AMD Chief Technology Officer, Mark Papermaster, and Forbes, we learn that we'll hear more about Zen 4 next week.

AMD CTO Mark Papermaster said: "With regards to the upcoming generation - I point to CES in January. We're excited to be revealing some additional details on our new product launches that will deliver phenomenal experiences and as we've said, later in the year as it progresses we'll share more detail on Zen 4 with some mentioned at CES and more announcements on it over the course of 2022. It will be a very exciting year for AMD".

AMD's new Ryzen 9 6900HX processor offers 8 cores and 16 threads of CPU power based on the refreshed Zen 3+ architecture, printed out on TSMC's new 6nm process node. We're looking at max CPU clocks of up to 4.6GHz, 20MB of L3 cache, and support for DDR5-4800 memory.

As for the GPU side of things, AMD will be using the purported Radeon 680M graphics which is based on the Navi2 GPU. The new Ryzen 9 6900HX processor is based on the new codename "Rembrandt" APU series, and while we don't know how many Compute Units the Radeon 680M has, we do know that the Rembrandt APU will offer up to 12 units on its GPU.

We don't know if the new Ryzen 9 6900HX will support DDR4 memory, but DDR5-4800 is supported on the new high-end Zen 3+ processor. AMD will be battling Intel and its new Alder Lake-P mobile processors, where we'll hear everything we need to know about both new families of CPUs from AMD and Intel at CES 2022 next week.

TSMC is not slowing down at all, with the company now finalizing their plans for a 2nm semiconductor fabrication plant -- with TSMC (Taiwan Semiconductor Manufacturing Company) boss C.C. Wei visiting the Taichung city government last week -- leading a team of TSMC suits in a meeting with Taichung mayor Shiow-Yen Lu.

Now that the TSMC CEO and Taichung mayor have met, we know more details of the purported new 2nm fab plant, after TSMC representatives "downplayed" the meeting to the media. TSMC is in a funny position right now -- as it needs to deploy new processes ASAP, but it is already stretched thin making the best chips for the most popular products on the planet.

TSMC doesn't want its competitors -- namely Samsung -- getting too close to them, so they have to move and they have to move now. The new super-advanced TSMC 2nm production facility will reportedly be placed in Taiwan's Hsinchu city, but if TSMC needs the room then they could move to Taichung city, where it already has facilities in the Taichung science and industrial park.

AMD could have quite the surprise up its sleeve with the delayed Ryzen Threadripper PRO series CPUs, which will be based on the current Zen 3 architecture: dual-socket Ryzen Threadripper PRO... oh boy.

We've found out recently that AMD is expected to launch 5 x Ryzen Threadripper PRO series CPUs, starting with the Ryzen Threadripper PRO 5995WX processor that will boast 64 cores and 128 threads -- but a dual-socket system would take two of those CPUs -- giving you 128 cores and 256 threads of Zen 3-based CPU processing power.

Even the current-gen Zen 2-based Ryzen Threadripper PRO 3995WX processor, in dual-socket form (64C/128T per CPU = 128C/256T in 2P. The dual Ryzen Threadripper 3995WX processors absolutely cream the competition, offering up to 44% more performance in PassMark -- let alone something that would truly flood those 128 cores and 256 threads of CPU power.

Intel has only just launched its new 12th Gen Core "Alder Lake" processors, but now it looks like we're going to be introduced to the new Core i9-12900KS -- a pre-binned CPU with 5.2GHz all-core frequency.

What this all boils down to is Intel will effectively have a pre-binned SKU, have all-core (Performance core) boost at 5.2GHz which is 200MHz higher than the 5.0GHz all-core boost on the Core i9-12900K. This means that the Core i9-12900KS should be able to pump away at 5.0GHz at a bare minimum out of the box, 5.2GHz all-core, and possibly more depending on your chip and cooling.

This would be the first pre-binned CPU in 3 generations, the last being the Core i9-9900KS -- but there was no Core i9-10900KS or Core i9-11900KS -- so the Core i9-12900K will be the first in quite some time. We should see Intel launch the unlocked, and pre-binned Alder Lake-S flagship CPU right as AMD is launching its new Ryzen CPUs with its exciting new 3D V-Cache technology.

Intel was expected to unleash its new 12th Gen Core "Alder Lake" CPUs with flashy new retail coolers, but they didn't make it in time -- and it seems they're now not too far away.

In a new tease, the Intel "Laminar RH1" cooler for Alder Lake-S processors has been teased, with a radically changed design to say the least. The new cooler is much taller than Intel's boring retail coolers over the last 10+ years, with the RH1 and RM1 coolers looking different themselves.

Side-by-side here we have the Intel RH1 cooler and RM1 cooler, the RH1 cooler is taller while the RM1 cooler is smaller. There's some gorgeous RGB lighting of course, with the boxed 12th Gen Core "Alder Lake" CPU cooler made of metal and should dissipate heat better than current designs -- at a TDP of 65W.

Russian company Baikal Electronics has officially fired up its new Baikal-S processor, which has 48 cores based on the Arm Instruction Set Architecture (ISA).

The CPU is codenamed "BE-S1000" and has its 48 cores at 2.0GHz base frequency, with boost clocks reaching 2.5GHz -- all within a 120W TDP. You can use up to 4 x sockets in a server board, offering a home-grown RISC-V processor for safe boot and management, with the entire SoC being controlled by a custom design.

In some of its own benchmark data, Baikal Electronics has the performance of its new Baikal-S in SPEC2006 CPU Integer, Coremark, Whetstone, 7Zip, and HPLinkpack. The new Baikal-S is compared against -- and keeps up with -- the Intel Xeon Gold 6148 Skylake design, and the AMD EPYC 7351 CPU which is based on the original Zen 1 core.

AMD is reportedly launching its new Ryzen Threadripper PRO 5000 series CPUs on March 8, 2022 according to VIdeoCardz.

VideoCardz reports that its source "Disclosuzen" has teased "so far very accurate information on AMD hardware in the past", and that according to this source "AMD is set to launch its Threadripper 5000 PRO series on March 8, 2022". The source continued, saying that there are 5 parts on the way, and their names have all been confirmed.

We can expect:

Intel is aiming for over 10x density improvements in packaging, as well as 30-50% logic scaling improvements, as the company looks beyond classic silicon transistors. Yeah, "classic" silicon transistors... like they're going to be ancient and have dust on them soon.

We all know about Moore's Law, but Intel doesn't just want to shift the Moore's Law goal posts, it wants to grab the goal posts and propel them into outer space with thousands of rocket ships behind it. At the recent IEEE International Electron Devices Meeting (IEDM) 2021, Intel "outlined its path toward more than 10x interconnect density improvement in packaging with hybrid bonding, 30% to 50% area improvement in transistor scaling, major breakthroughs in new power and memory technologies, and new concepts in physics that may one day revolutionize computing".

Robert Chau, Intel Senior Fellow and general manager of Components Research said: "At Intel, the research and innovation necessary for advancing Moore's Law never stops. Our Components Research Group is sharing key research breakthroughs at IEDM 2021 in bringing revolutionary process and packaging technologies to meet the insatiable demand for powerful computing that our industry and society depend on. This is the result of our best scientists' and engineers' tireless work. They continue to be at the forefront of innovations for continuing Moore's Law".

AMD's next-gen EPYC "Genoa" CPU is now rolling out to customers, with new documents teasing the Zen 4-powered platform will support up to a truly bonkers 12TB of RAM. Yes, twelve freaking gigabytes of RAM.

In some new documents, first posted by Hans de Vries shows a diagram of a Titanite 2P2G system, packing not just one, but two of AMD's next-gen EPYC "Genoa" SP5 CPUs. Each of the chips supports 12 DDR5 modules, as well as having PCIe 5.0 support.

As for the AMD EPYC "Genoa" CPU and motherboard, it will support up to 384GB of DDR5-5200 RAM with RDIMMs. The CPUs will support up to 6TB of DDR5-4800 with LRDIMMs, but when 3DS RDIMMs (3DS taps through-silicon vias) is used we're looking at up to 12TB at DDR5-4000 speeds.

AMD, Intel, and NVIDIA will be hosting their CES 2022 press conferences all on the same day and we've got all of the times and details below.

AMD will be hosting its CES 2022 press conference starting January 4 @ 7AM PST / 3PM GMT, where we should see the new AMD Ryzen 6000 "Rembrandt" CPUs, AMD Ryzen CPUs with their next-gen 3D V-Cache technology, "Upcoming Graphics Solutions" and the new Radeon RX 6500 XT and Radeon 6400 series desktop GPUs.

Intel will be hosting its CES 2022 press conference starting January 4 @ 10AM PST / 6PM GMT, where they'll introduce the new 12th Gen Core "Alder Lake-P" mobile CPUs, new 12th Gen Core non-K "Alder Lake-S" desktop CPUs, and the exciting new Intel Arc Alchemist Mobile GPU.

AMD launched its interesting 4700S Desktop Kit not too long ago, packing an Ariel SoC that was used inside of the semi-custom SoC that Sony used in its next-gen PlayStation 5 console.

The AMD Ariel SoC is comprised of a Zen 2-based CPU and RDNA 2-based GPU, but now there's a new AMD 4800S Desktop Kit that has popped up and could use the beefier SoC that powers Microsoft's next-gen Xbox Series X console.

We should expect the new AMD 4800S to pack PCIe 4.0 support for a discrete GPU -- a big upgrade over the AMD 4700S which only had PCIe 2.0 support. AMD's 4700S supported entry-level and mid-range discrete GPUs, but the AMD 4800S will reportedly support the RDNA 2-based Radeon RX 6600 and is bundled with the AMD 4800S Desktop Kit.

Intel's new 12th Gen Core "Alder Lake" CPUs are literally hot off the fab lines, and now we're hearing more concrete details about Intel's next-gen 13th Gen Core "Raptor Lake" CPUs making their first roar.

In a new leak, KOMACHI_ENSAKA teased on Twitter that he spotted an Intel "Rocket Lake" CPU on BAPCO's Crossmark benchmark database. Tom's Hardware was fast and secured the result before it was obviously taken down. It confirms that Intel will be cramming in 24 cores and 32 threads into its new Raptor Lake processors.

The listing includes "RPL-S ADP-S DDR5 UDIMM OC CRB" which is a test platform for Intel's next-gen Rocket Lake CPUs, which uses the same LGA1700 socket that the 12th Gen Core "Alder Lake" CPUs use with Intel's new 600-series chipset.

Qualcomm has made its new Snapdragon 8 Gen1 platform official, announcing the new SoC during its annual Snapdragon Tech Summit in Maui, Hawaii.

The new Snapdragon 8 Gen1 SoC was thought to be fabbed on TSMC's process node, but during a Q&A session company CEO Christiano Amon announced the new chip was being fabbed by Samsung on its new 4nm process node.

Alex Katouzian, SVP and General Manager of Qualcomm's Mobile, Compute, and Infrastructure division also chimed in, saying that the flagship new Snapdragon 8 Gen1 SoC is not made by TSMC. The new Snapdragon 8 Gen1 will be a major competitor to Samsung's upcoming Exynos 2200, Apple's new A15 Bionic, and MediaTek's just-announced Dimensity 9000 SoC.

Qualcomm is hosting a bunch of influencers, analysts, and tech press at its annual Snapdragon Tech Summit 2021 in Maui, Hawaii where the company has formally announced its new Snapdragon 8 Gen1 SoC.

The new Snapdragon 8 Gen1 SoC drops the "Qualcomm" branding from the name, and while we don't have totally next-generation performance from the CPU and GPU side of things, we do have a lot of new goodies and world-firsts with the Snapdragon 8 Gen1.

Qualcomm's new Snapdragon 8 Gen1 has the 4th gen Snapdragon X65 5G Modem-RF System, enabling the new Snapdragon 8 to be the most advanced 5G mobile platform in the world -- and not only that -- but also the world's first 5G modem-RF solution that breaches 10Gbps download speeds. Crazy stuff for the future of mobile connectivity. The new Snapdragon 8 Gen 1 will make it into devices from the following companies: Black Shark, Honor, iQOO, Motorola, Nubia, OnePlus, OPPO, Realme, Redmi, SHARP, Sony Corporation, vivo, Xiaomi, and ZTE.

Intel's new 12th Gen Core "Alder Lake" CPUs are here but they are all the K-series variants, while the new non-K series are now on the way with a slew of new processors.

In a new leak, we're being introduced to the Intel 12th Gen Core CPU non-K series including the flagship Core i9-12900, Core i5-12600, Core i5-12500, and Core i5-12400. In the middle of these processors and missing from the lineup are the Core i7-12700, the Core i3-12300, and Core i3-12100 processors as well as the F-series variants without integrated GPUs.

The new Intel Core i9-12900 is a 16-core, 24-thread CPU (8P+8E) with a 2.4GHz base CPU clock and up to 5.1GHz boost CPU clock and there will be 30MB of L3 cache, too. The Intel Core i7-12700 has its Efficiency cores cut in half, down to 12 cores and 20 threads (8P+4E) with CPU clocks down to 2.1GHz base, and 4.9GHz boost (this only applies to the Performance cores).

Intel is just getting its new 12th Gen Core "Alder Lake" CPUs onto shelves and into gamers' hands, with the 13th Gen Core "Raptor Lake" dropping in 2022 while the next-next-gen 14th Gen Core "Meteor Lake" CPU has some new details from fresh rumors.

According to the Commercial Times, the new Intel 14th Gen Core "Meteor Lake" CPU will have a quad-tile design, which seems to point to the Meteor Lake CPUs having the GPU tile in the middle of the processor. There will be a CPU compute tile on top, and then on the bottom, we should find the SoC tile.

Intel will reportedly be using its in-house Intel 4 process which is launching in 2023, with Meteor Lake using a chip block design with some (but not all) of the chip blocks being built by TSMC. The new Intel 14th Gen Core "Meteor Lake" CPUs will integrate computing chips, graphics chips, and connection chips (SoC-LP tiles) into a single Intel Foveros advanced packaging technology.

Qualcomm is hosting its annual Snapdragon Tech Summit starting on November 30, where we'll be introduced to a new flagship Snapdragon chip, a larger 5G push, and Qualcomm's continued success on its leadership in 5G, and some big changes coming to the Snapdragon branding.

The company is making changes to how the world sees the Snapdragon branding, where it will be removing "Qualcomm" from the chip names of its new Snapdragon SoCs. Qualcomm is still there and making the chips but instead of the future "Qualcomm Snapdragon 898" or "Qualcomm Snapdragon 8 Gen1" SoC dropping the "Qualcomm" name from the chip name altogether.

Snapdragon chip naming will change as well, instead of what was expected as the purported Snapdragon 898 turning into the Snapdragon 8 Gen1 -- this is Qualcomm using a single-digit series and generation (so, Snapdragon 8 is the series and the "Gen1" is the generation). The recent rumors of the Snapdragon 8 Gen1 now make sense, and have further confirm the recent rumbles of Snapdragon branding changes.

Qualcomm is expected to unveil its next-gen flagship SoC which we've been hearing about lately, the new Snapdragon 898, but new rumors suggest it will be called the Snapdragon 8 Gen1.

The new Qualcomm Snapdragon 8 Gen1 SoC is believed to power next-gen Android-based flagships of 2022 and beyond, with a larger and faster battery -- 4500mAh to start with, and 65W fast-charging. The new Snapdragon 8 Gen1 is reportedly being made on Samsung's 4nm process.

There could be smaller batteries inside of the new smartphones, but with new abilities (faster CPU + GPU, more RAM, faster storage, better camera sensors, faster charging, and more) then the bigger battery starting point -- 4500mAh on the Snapdragon 8 Gen1 -- will be a great thing for smartphone manufacturers, and customers.