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Samsung's next-gen 2nm-class production node will have backside power delivery, like Intel
Samsung Foundry will be using its new SF2 (2nm-class) manufacturing process as its first with a backside power delivery network (BSPDN), according to the latest reports.
Chosun.com is reporting that the promising results that were achieved by using backside power delivery changed Samsung's thoughts on the technology, seeing the company rethink the use of BSPDN into a commercial process technology. Samsung was expected to introduce a backside power delivery network with its 1.7nm-class fabrication node, but it will arrive with its SF2 process node in 2025.
As Tom's Hardware points out: there is no 1.7nm-class nodes on Samsung's current roadmaps, where we can only see SF2, SF2P, and SF1.4 process nodes. Samsung has used two Arm-based test chips with backside power delivery, achieving a 10% and 19% die area reduction without telling the world which process node it's using.
Intel's new Core i9-14900KS purchased early, full specs confirmed: 6.2GHz at 1.5V and it's HOT
Intel's new special edition Core i9-14900KS processor is barely two weeks away from launch, but the new CPU is already being purchased early and installed into a motherboard instantly.
One particular user on Overclock.net forums, "pakhtunov," purchased not one but two of Intel's new Core i9-14900KS processors, while another user replied and said they managed to purchase one and had plans to delid and install the 14900KS processor into their motherboard tomorrow.
X user "I_Leak_VN" tagged me in a bunch of pictures of Intel's new Core i9-14900KS processor, with a shot of the CPU itself, and the retail packaging they come in. As for the Core i9-14900KS processor itself, it will be the highest-clocked CPU on the planet when it launches with its 6200MHz frequency.
AMD's next-gen Zen 6 APU codenamed 'Sound Wave' teased, made on TSMC 3nm node
AMD's next-gen APUs have received some more leaked details, where after Strix Point and Kraken Point APUs arrive, the company has its new Sound Wave APU made on TSMC's new 3nm process node featuring its next-gen Zen 6 architecture and RDNA 5 graphics. Oh boy.
The next-generation AMD Strix Point APUs will arrive as the Ryzen 8050 family processors, where AI is a bigger deal with its new XDNA 2 NPU (Neural Processing Unit), otherwise known as Ryzen AI, with a huge 3x improvement in AI compute performance of up to 48 TOPs.
AMD's new Strix Point APUs will feature the latest Zen 5 CPU architecture and upgraded RDNA 3.5 GPU cores, with two versions: Strix Point with a Zen 5 monolithic design featuring up to 12 CPU cores and then Strix Point Halo with a Zen 5 chiplet design with up to 16 cores. AMD is expected to launch Strix Point APUs later this year, replacing the Ryzen 8040 series "Hawk Point" APUs that launched not too long ago.
Intel Core i9-14900KS photo leaked, suggesting 6.2GHz-toting flagship CPU is near to launch
Intel's Core i9-14900KS, the 'special edition' (limited run) of the Raptor Lake Refresh flagship rumored to be in the pipeline, has just shown up in a leaked photo.
I_Leak_VN, a leaker (you'd never guess) on X (formerly Twitter), shared an image of the packaging for the Core i9-14900KS.
It looks authentic, but as ever, we must regard any leak with a suitable degree of caution.
Intel and ASML achieve 'First Light' milestone with new High-NA lithography tech
ASML and Intel have reached the "First Light" milestone using ASML's latest High-NA lithography system, turning on its light source and making the light reach resist on the wafer.
The report is coming from Reuters, with this being a critical first step in the very latest manufacturing technology from ASM; the "first light" milestone means that one of the critical components of ASML's new Twinscan EXE-5000 system is operational, but not at its peak performance.
Marc Assinck, a spokesman for ASML, explained: "Technically, this 'first light' actually is 'first light on the wafer.' The light source was already working, now we have the photons 'in resist' on the wafer".
Intel's next-gen Lunar Lake CPUs to be in very limited supply in late 2024, more chips in 2025
Intel will launch its next-gen Lunar Lake mobile processors for new thin and light laptops later this year, but availability will be limited in Q4 2024, with higher quantities of Lunar Lake processors in the market for 2025.
Intel launched its new Core Ultra 100 series "Meteor Lake" CPUs late last year, but the new Lunar Lake CPUs will be the successor that will power the next wave of (AI) laptops in late 2024. We're expecting new CPU, GPU cores, higher AI performance, and a unique SoC design from Intel.
The news is coming from leaker "Golden Pig Upgraed" on Weibo, who teases that, like Meteor Lake, Lunar Lake is still an "EEP project" and the "purpose is naturally the same, to rush to the market this year". The leaker added: "Of course, if everything goes well, it will definitely be much earlier than MTL's EEP. In other words, Lunar Lake products will still have to wait until 2025 to be launched in large quantities. After all, EEP still only has a few specific projects that are eligible".
Intel's special edition Core i9-14900KS processor with 6.2GHz, 150W TDP confirmed by retailer
Intel is just weeks away from launching its new special edition Core i9-14900KS processor, rocking 6.2GHz CPU clocks out of the box, and now it's been confirmed by another retailer.
Intel's upcoming Core i9-14900KS processor packs 24 cores and 32 threads of CPU power spread across 8 P-Cores and 16 E-Cores, matching the Core i9-14900K and Core i9-14900KF (KF variant drops the integrated GPU). Intel's upcoming Core i9-14900KS processor packs 24 cores and 32 threads of CPU power spread across 8 P-Cores and 16 E-Cores, matching the Core i9-14900K and Core i9-14900KF (KF variant drops the integrated GPU).
Retailers expect to have the new Core i9-14900KS processor in the next weeks, whereas a Canadian retailer has the new special edition CPU listed for $1004 CAD, which works out to around $970. We only have a few weeks to wait for Intel's new Core i9-14900KS processor, which will be the processor of choice for many overclockers and enthusiasts across the planet.
Intel pencils in 2027 for when it'll have next-gen chips made on Intel 10A, or 1nm process node
Intel has just teased that it will have its first next-generation 1nm process node (Intel 10A) out of the gate and into production in late 2027.
The company recently detailed its new Intel 18A process node and Intel 14A process nodes, where Microsoft became the first customer to announce a next-generation chip on Intel's new 18A process node. The previously unannounced Intel 10A (1nm) is now going into production in 2027 to fight TSMC in a big, big way.
The news is coming from the Mobile World Congress (MWC) this week in Barcelona, Spain, where Intel EVP and GM of Foundry Manufacturing and Supply, Keyvan Esfarjani, revealed Intel's latest developers, showing a roadmap of how it will all play out over the coming years.
Intel plans to have fully AI-automated chip factories powered by 'Cobots' in the future
Intel has announced it plans to use AI in all of its foundries, from production flows, capacity planning, forecasting, yield improvements, and floor-level production operations, which will be done by AI and what it's calling "Cobots" of the future.
The company is referring to this as a "10X moonshot" program, where it wants to impact each and every segment of its operations in the future. Intel plans to use AI-powered Cobots, which will be robots that can work with humans side-by-side, as well as extensive robot automation in manufacturing. It won't happen overnight, but Intel is planning this "10X moonshot" for the future of AI-powered chip production.
NVIDIA first announced its "AI factories" in 2022, teaming up with Chinese manufacturer Foxconn on the AI factories project. NVIDIA CEO Jensen Huang said the "production of intelligence" would be the new wave of manufacturing, managed by huge AI-powered data centers filled with NVIDIA hardware, technologies, and software.
Intel vPro technology is coming to Core Ultra 100 'Meteor Lake' AI mobile processors
Intel has just confirmed that its new Core Ultra 100 "Meteor Lake" CPU family is getting vPro technology for a new business laptop series that'll be called vPro.
The news comes from the MWC (Mobile World Congress) that's happening in Barcelona, Spain, right now... where, over the last few years, we've seen Intel move its approach with vPro technologies. The company shifted away from physical changes to the processors to software locking. Intel's new Core Ultra 100 series "Meteor Lake" processors officially support the vPro feature set, which is split into Enterprise and Essential tiers.
Intel's new Core Ultra 100 series "Meteor Lake" CPUs will be getting vPro technology, but its recent 14th Gen Core "Raptor Lake Refresh" processors will NOT be getting vPro, at least none of the mobile processors in the wild. Intel says if you want -- or need -- vPro technology, they recommend their new Meteor Lake-powered laptops that are spreading onto the market.
Intel Core i9-14900K sets new OC world record: first CPU to finish SuperPi in under 3 minutes
SAFEDISK has broken a totally new world record, finishing a SuperPi benchmark run in under 3 minutes using Intel's flagship Core i9-14900K processor.
Intel's new Core i9-14900K processor was installed into an ASUS ROG Maximus Z790 APEX Encore motherboard. Then, SAFEDISK disabled all but 4 cores and 4 threads of the Raptor Lake Refresh CPU power (of its maximum 24 cores and 32 threads). The 14900K was overclocked to an incredible 8449.22MHz using 1.79V and some exotic LN2 cooling to keep the 14900K processor at sub-zero temperatures.
RAM inside of this build was in the form of G.SKILL DDR5-7800 CL36 memory that was overclocked to an incredible 9000+ with CL32-48-45-36-2T timings. In the end, SAFEDISK completed the SuperPi benchmark run in 2 minutes and 59.919 seconds, the first-ever SuperPi benchmark run in under 3 months... which is mind-blowing. A new world record.
Intel Arrow Lake-S rumored with Xe-LPG GPU, Arrow Lake-H receives Xe-LPG+ GPU
Intel will announce and release its next-gen Arrow Lake processors later this year, representing the first top-to-bottom client CPU architecture featuring totally new CPU and GPU architectures in many years from the company.
Intel's current-gen Core Ultra 100 series "Meteor Lake" processors feature brand new GPU cores in Xe-LPG, but Arrow Lake CPUs will come with either Xe-LPG or Xe-LPG+ graphics, something we're learning today in some new leaks.
Intel engineer Haridhar Kalvala, explained: "Some SKUs of Arrow Lake use slightly newer Xe-LPG+ graphics IP (version 12.74). Add some additional PCI IDs and extend the code to support the newer IP version. The general code flow should continue to match existing MTL and Xe-LPG code paths".
Intel CEO wants to make chips for AMD, Google, NVIDIA, and Qualcomm at Intel Foundry
Intel CEO Pat Gelsinger said he hopes to one day make chips for its competitor AMD, and that it has plans on becoming the world's leading foundry by 2030.
During the recent IFS Direct Connect event, Intel CEO Pat Gelsinger said he wants the company to enter the custom chips market -- something AMD is heavily involved in, but has its semi-custom chips made in Taiwan at TSMC -- as well as supply Intel's process nodes and "sharing" each stage of manufacturing technologies, including its exciting new packaging technology.
Intel CEO Pat Gelsinger said: "Well, if you go back to the picture I showed today, Paul, there are Intel products and Intel foundry, There's a clean line between those, and as I said on the last earnings call, we'll have a setup separate legal entity for Intel foundry this year. We'll start posting separate financials associated with that going forward. And the foundry team's objective is simple: Fill. The. Fabs. Deliver to the broadest set of customers on the planet".
Intel's next-gen Xeon 'Clearwater Forest' CPUs rumored with 3D stacking with hybrid bonding
Intel's next-gen Xeon "Clearwater Forest" CPUs will feature up to 288 cores based on the new Darkmont CPU architecture, with no P-Cores in sight with Clearwater Forest, its 288 E-Cores.
The latest information on Intel's next-gen Clearwater Forest CPUs is that they will feature Foveros Direct advanced packaging technology, with 3D stacking technology allowing Intel to drive the E-Core count up to an incredible 288 cores of processing power.
Intel's latest hybrid bonding technology is codenamed Foveros Direct for 3D stacking of the Clearwater Forest-based Xeon CPUs. This CPU packaging technology features a base time on top of the interposer, that's connected through a high-speed I/O, EMIB, and the cores will be sitting on the highest layer of the chip.
AMD CEO Lisa Su confirmed for opening Computex keynote - so prepare for a big Zen 5 CPU reveal?
AMD's CEO Lisa Su has been confirmed as giving the opening keynote at Computex 2024.
The show, which runs from June 4 to June 7 in Taipei, is themed around 'connecting AI' (to no one's surprise) and Lisa Su will be given the opportunity to open the proceedings (as VideoCardz flagged up). That opening keynote will actually happen on June 3.
What will the CEO's speech contain in the way of revelations? The immediate obvious possibility that springs to mind is an announcement of Zen 5, which in its desktop incarnation will be either Ryzen 8000 or 9000 processors.
Intel unveils its new Intel 14A process node, ready for the future of AI chip production
Intel has penciled in that it will be making the world's best chips later this year, beating TSMC, and teasing its next-gen Intel 14A process node that will go into production in 2026.
The latest Intel 18A process node is gearing up right now, with Microsoft being the first customer with a next-gen processor made on Intel 18A, but the company was confident in announcing its new Intel 14A process node that will cement its position as the fastest chip maker in the world, toppling TSMC, in 2026.
The news was announced at the Intel Foundry Services (IFS) Direct Connect 2024 event. Intel said its current Intel 7 and Intel 4 process nodes are in the market, with its upcoming Intel 3 preparing for high-volume manufacturing (HVM).
Microsoft announces its chosen a chip design based on the new Intel 18A process node
Intel held its first-ever Intel Foundry Direct Connect event, with the chipmaker getting customers, ecosystem partners, and leaders across the technology industry to be in person at the event.
Some of the speakers at the Intel Foundry Direct Connect event included Microsoft CEO Satya Nadella, US Secretary of Commerce Gina Raimondo, Arm CEO Rene Haas, OpenAI CEO Sam Altman, and more. At the event, Microsoft CEO Satya Nadella announced that Microsoft has chosen Intel's new 18A process node for a new chip is wants to make.
Microsoft CEO Satya Nadella explained: "We are in the midst of a very exciting platform shift that will fundamentally transform productivity for every individual organization and the entire industry. To achieve this vision, we need a reliable supply of the most advanced, high-performance and high-quality semiconductors. That's why we are so excited to work with Intel Foundry, and why we have chosen a chip design that we plan to produce on Intel 18A process".
AMD Ryzen 8040 chips to get 'Neural Processing Unit' monitoring in Windows Task Manager
AMD's just-released Ryzen 8040 series "Hawk Point" processors will have their included NPUs (Neural Processing Unit) receiving real-time monitoring inside of Windows Task Manager, according to AMD.
In a new post on its website, AMD explained: "AMD has been working with Microsoft to enable MCDM (Microsoft Compute Driver Model) infrastructure on the AMD NPU (Neural Processing Unit)-enabled Ryzen 8040 Series of mobile processors. MCDM is a derivative of Windows Display Driver Model (WDDM) that is targeting non-GPU, compute devices, such as the NPU. MCDM enables NPUs to make use of the existing GPU device management infrastructure, including scheduling, power management, memory management, and performance debugging with tools such as the Task Manager. MCDM serves as a fundamental layer, ensuring the smooth execution of AI workloads on NPU devices".
AMD explains: "One of the reasons AMD has integrated an NPU into select Ryzen 8040 processors is to help vendors create new, AI-powered apps and experiences. Being able to monitor device usage in real-time can make software development easier, so integrating this functionality makes sense for everyone, from developers and system vendors to the individual end-user".
AMD's next-gen Zen 6 'Medusa' CPUs reportedly launching with integrated RDNA 5 GPU
AMD's next-gen Zen 6-based consumer processors are sounding exciting, with new rumors suggesting the codenamed "Medusa" CPUs will feature next-gen RDNA 5 integrated GPUs and 2.5D interconnects, moving away from the traditional multi-die design.
In a new post on X, leaker Everest said that Medusa features an integrated RDNA 5 GPU, which sees AMD skipping over RDNA 4 for Zen 6. Medusa is the codename of the Zen 6 client processors, and the leaker previously teased that Medusa will be using a 2.5D interconnect with "much higher bandwidth".
AMD's next-gen Zen 5 architecture will be unleashed later this year with both the Granite Ridge and Strix Point APU families, with Granite Ridge CPUs featuring integrated RDNA 2-based GPU, as both architectures share the same I/O die where the GPU is located. AMD's next-gen Strix Point APU will feature an upgraded Navi 3.5 (RDNA 3.5) GPU design that we can't wait to see what can do on an APU.
Intel Core i9-14900KS with 6.2GHz CPU clocks spotted early at French retailer for $800+
Intel's new Core i9-14900KS processor isn't too far away now, with the limited edition CPU hitting a French retailer early and priced at over $800. Check it out:
In a retail listing by French retailer PC21.FR, the new Intel Core i9-14900KS limited edition processor costs €768.34 (&euro 640.29 without taxes), and the latter costs &euro 752.62 (&euro 627.19 without taxes) in either boxed or tray variant, respectively. This works out to around $827 USD (without taxes) and around $810 with taxes, respectively.
Intel's upcoming Core i9-14900KS processor packs 24 cores and 32 threads of CPU power spread across 8 P-Cores and 16 E-Cores, matching the Core i9-14900K and Core i9-14900KF (KF variant drops the integrated GPU). Intel's upcoming Core i9-14900KS processor packs 24 cores and 32 threads of CPU power spread across 8 P-Cores and 16 E-Cores, matching the Core i9-14900K and Core i9-14900KF (KF variant drops the integrated GPU).






















