AMD's new Zen 4-based Ryzen 7000 series CPU has fallen into the hands of an "unnamed overclocker" and been instantly delidded. Check it out:
TechPowerUP reported the image, noting that the "person who shared this picture should most likely not have done so and as such, we won't be posting a link to the source". The photo shows us the IHS that is pretty damn thick, but you've also got the two CCDs and the IOD soldered to it.
Popular Now: AFTERSHOCK's $14,200 Cherry Bloom gaming PC uses titanium flowers that bloom with heatThe two CCDs in question are part of a two-chiplet design: each chiplet packs up to 8 x Zen 4 CPU cores (16 cores in total for up to 16 cores and 32 threads in the flagship Zen 4 processor). The I/O die is also new, with an integrated RDNA 2 GPU, and made on TSMC's fresh 6nm process node.
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TPU notes: "Judging by the looks of the area where the CCDs and the IOD attach to the IHS, this looks like a destructive delidding, although it could just be leftovers from the soldering material. The IHS has clearly been coated with some materials for a good solder interface as well, but this is nothing new, as we've seen this on delidded, soldered CPUs in the past".
