DDR6 development starts with Samsung, SK Hynix, and Micron aiming for shipments by 2028

A new industry report suggests that memory manufacturers are already in the early stages of DDR6 development, targeting a 2028-2029 release window.

DDR6 development starts with Samsung, SK Hynix, and Micron aiming for shipments by 2028
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TL;DR: Major memory manufacturers Samsung, Micron, and SK Hynix are developing DDR6 memory, targeting commercialization around 2028-2029. DDR6 aims to double DDR5 speeds, reaching up to 17,600 MT/s, with CAMM2 technology likely replacing DIMM to overcome physical limits. The JEDEC standard is still in draft form.
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We have heard rumblings about DDR6 in the past, mostly centered around early design plans and targets. However, it now seems the next generation of Double Data Rate (DDR) memory is moving closer to production. Apparently, major memory manufacturers have already begun initial development of DDR6 memory, and the launch window could be around two years away.

According to a report from South Korean media outlet TheElec, the memory makers have asked substrate suppliers to prepare designs for DDR6. The report states that memory manufacturers and substrate makers typically engage in this kind of joint development about 2 years before the product is supposed to launch. It is also important to note that the JEDEC DDR6 standard has not yet been finalized.

"Memory companies and substrate manufacturers typically proceed with joint development more than two years before product launch," said an official from the substrate industry. "Initial development of DDR6 has recently begun."

Via TheElec (translated)

Apparently, memory makers Samsung, Micron, and SK Hynix are working with partial design data, including substrate structure, memory thickness, and related details. This effort is supervised by JEDEC, the industry authority on memory standards. The initial DDR6 draft has been available since 2024, though it is sparse on technical details such as power envelopes and voltage ranges.

DDR6 is expected to push the boundaries of transfer rate, aiming for 8800 MT/s and scaling up to a blistering 17,600 MT/s. That is almost double the current ceiling planned for DDR5. The industry is banking on the CAMM2 technology over DIMM for DDR6, as the latter may face physical limitations in transferring data at such speeds.

CAMM2 module
CAMM2 module

We must also keep in mind the current global DRAM shortage, which is expected to last until 2030. DDR5 memory is being gobbled up by AI data centers, with DDR5 accounting for 80% of server memory market share right now, expected to reach 90% by the end of the year. It will be interesting to see how the introduction of DDR6 memory eventually changes this scenario.

Commercialization of DDR6 memory is expected between 2028 and 2029, with Samsung, Micron, and SK Hynix all working to bring their models to market first.

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News Source:thelec.kr

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Hassam is a veteran tech journalist and editor with over eight years of experience embedded in the consumer electronics industry. His obsession with hardware began with childhood experiments involving semiconductors, a curiosity that evolved into a career dedicated to deconstructing the complex silicon that powers our world. From benchmarking PC internals to stress-testing flagship CPUs and GPUs, Hassam specializes in translating high-level engineering into deep, unbiased insights for the enthusiast community.

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