SK hynix showcases next-gen 48GB HBM4 at 11.7Gbps, SOCAMM2, LPDDR6 for AI platforms

SK hynix showcased its next-gen memory solutions for AI at CES 2026, showing off its new 48GB HBM4, LPDDR6, SOCAMM2, and more for AI platforms of the future.

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SK hynix showed off its next-gen 16-Hi HBM4 with 48GB, newer HBM4 that will succeed the upcoming 12-Hi HBM4 with 36GB that will arrive this year. The faster 16-Hi HBM4 48GB modules are bloody fast, with 2TB/sec of memory bandwidth per stack, destined for NVIDIA's next-gen Vera Rubin AI platform.

The company had its new 16-Hi HBM4 48GB running at the industry's fastest speed of 11.7Gbps, and is still under development at SK hynix, and will be released in the nearish future.

• Read more: SK hynix internal analysis warns DRAM supply growth will be tight until 2028
• Read more: SK hynix, Samsung, Micron fighting for NVIDIA contracts for new 16-Hi HBM4
• Read more: SK hynix showcases world's first HBM4: 16-Hi, 2TB/sec bandwidth, TSMC logic die

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SK hynix also has its new SOCAMM2 memory modules at CES 2026, with the new low-power memory module specialized for AI servers, for the company to demonstrate the competitiveness of its diverse product portfolio "in response to the rapidly growing demand for AI servers".

• Read more: SK hynix teases 48Gbps/24Gb GDDR7, 14.4Gbps LPDDR6 at ISSCC 2026
• Read more: SK hynix HBM roadmap: HBM5, HBM5E, GDDR7-Next, DDR6, 400-layer 4D NAND
• Read more: SK hynix vision as Full Stack AI Memory Creator: custom HBM, AI DRAM, AI NAND

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Another new product showcased at CES 2026 is SK hynix's new LPDDR6 memory, optimized for on-device AI, offering huge data processing speed increases, as well as power efficiency gains compared to the previous-gen LPDDR5 standard.