I think all motherboards are more interesting when their heat sinks come off.
The Z170X-Gaming 6 has an 8+3 phase VRM for the CPU core and iGPU, identical to that of the Z170X-Gaming 7. The Intersil ISL95856 hybrid-digital PWM controller provides 4+3 phases with multiple integrated drivers. To provide all 4+3 phases, GIGABYTE added a few Intersil ISL6625A ("5AZ") to supplement the integrated drivers. Each driver controls the equivalent hardware of two separate phases, so GIGABYTE can market it as 8+3 phases.
This type of virtual phase doubling is common, and since Intel Skylake CPUs do not eat power up, it will not impede overclocking. For MOSFETs, GIGABYTE is using Vishay SiRA12 for the low-side and SiRA18 for the high-side MOSFETs. These MOSFETs are in the PowerPAK package, and they work just fine on the Z170X-Gaming 7, so I expect the same on the Z170X-Gaming 6. GIGABYTE is using their custom "Power" inductors and their 10K polymer black capacitors.
The VCCSA and VCCIO come from a simple linear circuit. The memory is a single phase made up of a Realtek RT8120 single phase PWM with integrated driver and the same Vishay MOSFETs as the CPU VRM, but with two low-side MOSFETs instead of one.
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- Page 1 [Introduction, Specifications, and Pricing]
- Page 2 [Packaging and Z170X-Gaming 6 Overview]
- Page 3 [GIGABYTE Z170X-Gaming 6 Circuit Analysis]
- Page 4 [GIGABYTE Z170X-Gaming 6 Circuit Analysis Continued]
- Page 5 [BIOS and Software]
- Page 6 [Test System Setup]
- Page 7 [Overclocking]
- Page 8 [CPU, Memory, and System Benchmarks]
- Page 9 [System IO Benchmarks]
- Page 10 [Thermal Imaging and Power Consumption]
- Page 11 [What's Hot, What's Not & Final Thoughts]