I think the Z170XP-SLI looks better without heat sinks, but that's just a personal opinion, as I think all motherboards look better without heat sinks.
This motherboard carries a 4+3 phase (VCore+ VCCGT) VRM. I believe that this might be the Intel standard VRM configuration for this platform considering its very low power consumption. The VCCIO and VCCSA are derived from a linear regulator I will cover later on. Surprisingly the inductors have a custom GIGABYTE "Power" logo embedded on them which looks quite cool. The capacitors are rated at 5K, and there seems to be a decent amount of them to reduce ripple. The good thing here is that there is no phase doubling.
A single Intersil ISL95856 Hybrid-Digital PWM provides the 4+3 phase output for the VCC (VCore) and VCCGT (iGPU voltage). It has three integrated drivers, two for the 4 phase rail and a single one for the 3 phase rail. GIGABYTE adds an extra four ISL6625a drivers; two for the VCC and two for the iGPU. Each phase consists of a single high-side and low-side MOSFET. In this case, GIGABYTE opted to use one Vishay Siliconix SiRA12 and one SiRA18 for each phase. These MOSFETs have decent specifications, and each phase should output roughly 15-20A if needed, which is enough for air overclocking. The VCCSA and VCCIO are derived from a linear regulator considering their low power requirements.
The memory VRM is a single phase consisting of a Richtek RT8120D single phase PWM with integrated driver and two SiRA12 for the low-side and a single SiRA12 for the high-side to facilitate DDR4 overclocking.
GIGABYTE is using the ASMedia ASM1142 USB 3.1 controller on the Z170XP-SLI along with a Texas Instruments HDS3212 for the type-C switch since users can plug the cable in upside down or right-side up (there is a right way to plug in Type-C, so C-Type switches are used to ensure compatibility).
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- Page 1 [Introduction, Specifications, and Pricing]
- Page 2 [Packaging and Z170XP-SLI Overview]
- Page 3 [GIGABYTE Z170XP-SLI Circuit Analysis]
- Page 4 [GIGABYTE Z170XP-SLI Circuit Analysis Continued]
- Page 5 [BIOS and Software]
- Page 6 [Test System Setup]
- Page 7 [Overclocking]
- Page 8 [CPU, Memory, and System Benchmarks]
- Page 9 [System IO Benchmarks]
- Page 10 [Thermal Imaging and Power Consumption]
- Page 11 [What's Hot, What's Not & Final Thoughts]