Intel Launches H-Series Mobile Processors
Intel has finally launched their highly anticipated H-series mobile processors. These processors are actually Coffee Lake CPUs instead of Kaby Lake-R CPUs, and they utilize a new 300 series chipset.
We just reviewed a notebook with an 8750H processor that offers 6 cores and 12 threads with a 45W TDP, so if you want to see how much more performance you get, head over and read that review.
Now, Intel isn't just launching one type of H-series processor, but actually three. We get 8th-gen SKUs with Vega M graphics, similar to what we saw in Intel's latest Hades Canyon NUC.
Then we get the expected H-series replacements, they are at the same TDP as their predecessors, but they generally have 50% more cores. Intel is also launching new mobile Xeon and i5/i7 processors with vPro. For the latter two segments, we also get a new "+" SKU that refers to Optane storage included.
For the first time, Intel has produced an i9 mobile processor and has launched many 6-core processors. They have also added a new Thermal Velocity Boost and updated their chipset. For the first time, we see integrated Intel WIFI, USB 3.1, and Optane support in the mobile segment.
While ThunderBolt is not integrated into the new chipset as some had theorized, Intel has optimized the platform for ThunderBolt integration. The new 300 series chipset is basically a Cannon Lake chipset, and it totally different than the 200 and 100 series chipsets it replaces.
Now, the new Core i9 processor will Turbo up to 4.6GHz on a normal day, but with Intel's new Thermal Velocity Boost it can shoot up to 4.8Ghz single core if the system is cool enough.
These are Intel's latest processors, and as such, 6-core processors are now more mainstream. The new 6-core processors and other enhancements will greatly improve mobile device performance, and will further spread VR capability to the masses.
With two extra cores added to the i7 SKUs we find a lot better performance, and with added frequency boosts on the Core i9 mobile CPU we get even more performance. To facilitate faster processing speeds, Intel has looked to tackle the next bottleneck in the system; networking.
The new Wireless AC controllers from Intel offer 160MHz support, which can provide up to 1733Mbps of throughput, instead of the 867Mbps we find on current 80Mhz 2x2 controllers. Now, most of the NIC (like the MAC) is integrated into the new 300-series chipset, and a PHY is added that brings the physical layer support.
PRICING: You can find the product discussed for sale below. The prices listed are valid at the time of writing, but can change at any time. Click the link below to see real-time pricing for the best deal:
United States: Find other tech and computer products like this over at Amazon`s website.
United Kingdom: Find other tech and computer products like this over at Amazon UK`s website.
Canada: Find other tech and computer products like this over at Amazon Canada`s website.
- Page 1 [Intel Launches H-Series Mobile Processors]
- Page 2 [New Mobile SKUs, U-Series Upgrades, and Optane Support]
Recommended for You
- We at TweakTown openly invite the companies who provide us with review samples / who are mentioned or discussed to express their opinion of our content. If any company representative wishes to respond, we will publish the response here.
Latest News Posts
- Intel Core i9-9900K rumor: 8C/16T at a huge 5.5GHz on Aug 1
- South Park: The Fractured But Whole DLC release date unveil
- 1 hour of gameplay footage released for Forza Horizon 4
- VirtualLink: next-gen VR over a single USB Type-C cable
- World of Warcraft expansions, now only a $15 subscription
- Asrock a320m dgs eveything stuttering even cs go drops 15-20 fps
- Biostar X470GTN Gaming (AMD X470) Motherboard Review
- Asrock X399 + Watercooling help needed please
- HyperX Pulsefire Surge RGB Gaming Mouse Review
- ASRock Phantom Gaming Radeon RX 550 - can it run silent?
- Micron Launches Industry's First Enterprise SATA Solid State Drives Built on Leading 64-layer 3D NAND Technology
- Micron, Rambus, Northwest Logic and Avery Design to Deliver a Comprehensive GDDR6 Solution for Next-Generation Applications
- Toshiba Memory America Unveils UFS Devices Utilizing 64-Layer, 3D Flash Memory
- ASUS Announces GeForce GTX 1070 Ti Series Gaming Graphics Cards
- ASUS Announces ASUS Hangouts Meet Hardware Kit