RAM News - Page 2
Samsung has announced that development has started on its next-generation DDR5 memory modules, with a gigantic 1TB DDR5 capacity coming in the very near future.
You and I might not need 1TB DDR5 memory modules, at least not right now, but Samsung is not making it for consumers: the next-generation DDR5 memory modules are aimed at next-gen servers and HPC (high-performance computing) systems.
In the regular world, we have the heights of 32GB per DIMM, so you can fill a system with 128GB of DDR5 RAM pretty easily (4 x 32GB = 128GB) but Samsung has been making gigantic DIMMs for a while now. We have 64GB, 128GB, 256GB, 512GB, and even mammoth 768GB DIMMs that we were reporting on this time last year... but now Samsung is entering the world of 1TB capacities on DDR5 memory.
PassMark is building its big update of MemTestX86, the first update since January 2022, which will support next-gen DDR5 memory.
The creator of MemTestX86 took to Twitter to tease "a new era of memory testing is coming to MemTestX86", with a follow-up tweet explaining: "direct identification of the bad memory module and the chip (for specifically selected DDR5 reference systems" he added.
In the photo provided, we have some Crucial DDR5-4800 memory modules being tested with MemTestX86, which spoiler alert: they'll be supported as the "specifically selected DDR5" modules. Intel already has its 12th Gen Core "Alder Lake" CPUs with 600-series motherboards supporting DDR5 memory, but AMD is about to launch its Ryzen 7000 series "Zen 4" CPUs and X670E + X670 motherboards that will also have DDR5, so MemTestX86's big new update couldn't come at a better time.
TEAMGROUP has just announced its new ELITE+ DDR5 RAM, with a new simple design that looks rather dapper I must say.
The new TEAMGROUP ELITE+ DDR5 RAM comes in DDR5-4800, DDR5-5600, and DDR5-6000 speeds with prices starting at $92 for a 16GB kit (2 x 8GB) of TEAMGROUP ELITE+ DDR5-4800 memory up to $352 for a 64GB kit (2 x 32GB). The fastest speed ELITE+ DDR5-6000 memory starts with a single 16GB stick for $135, while a 32GB kit of DDR5-6000 will cost $270.
TEAMGROUP says that its new ELITE+ DDR5 memory launches in early September 2022, which should be right alongside AMD's new Zen 4-based Ryzen 7000 series and X670E + X670 motherboards, which will be compatible with DDR5 memory.
ADATA has just revealed its new kit of limited edition ACE DDR5-6400 memory, which features a beautiful one-of-a-kind pattern design that was created in collaboration with a designer from Germany.
The new ADATA ACE DDR5-6400 limited edition memory has support for Intel XMP, which means you'll have hassle-free overclocking, while ADATA is tapping high-quality, low-latency chips for its DDR5 memory. You'll be able to use ADATA's new DDR5 memory on either Intel or AMD's latest platforms.
ADATA's custom modules feature bold colors and a lively pattern that "represent the unique brand personality of the ADATA brand". ADATA worked with German designer and illustrator Mister Fred, with his work characterized by crooked lines, bold colors, and quirky expressions. ADATA explains that "through illustrations and patterns, he aspires to project to the world how beautiful diversity and individuality are".
SK hynix has just unveiled its first DDR5 DRAM-based CXL sample, with expandable CXL (Compute Express Link) memory to strengthen its presence in the next-generation memory solutions market.
The new SK hynix CXL memory ecosystem arrives in the EDSFF (Enterprise & Data Center Standard Form Factor) E3.S form factor, with support for next-gen PCIe 5.0 x8 and standard DDR5 memory that packs CXL controllers. As for CXL: it's based on PCIe and is a new standardized interface that boosts efficiency by utilizing CPUs, GPUs, accelerators, and memory.
SK hynix is stepping in, participating in the CXL consortium from the early days, and is "looking to secure CXL memory market leadership". CXL memory will be huge for expandability, where it allows for flexible memory expansion compared to current server market offerings, where memory capacity and performance are fixed once the server platform is chosen.
Corsair has just launched its new Vengeance RGB series DDR5 memory, with initial kits offering DDR5-6400 speeds but Corsair has faster DDR5-6600 speeds coming soon.
The new Corsair Vengeance RGB DDR5 memory comes in both black and white color options, with beautiful RGB lighting that will make any gaming PC look awesome. Corsair is launching its new Vengeance RGB DDR5 memory in DDR5-6400 speeds with a 32GB kit (2 x 16GB sticks) but faster DDR5-6600 speeds are coming.
Corsair notes that just like with all Corsair DDR5 memory, the new Vengeance RGB DDR5 memory modules are "built with only hand-sorted, tightly-screened memory chips to ensure consistently high frequencies, atop performance PCBs for excellent signal quality and stability. Cooling these chips is a stylish solid aluminum heat spreader that efficiently conducts heat away from your memory while complementing your system's modern aesthetic".
We have some new high-end DDR5 memory unveiled by v-color, with the new v-color Manta XSky RGB DDR5 memory that comes in a 32GB DDR5-6600 CL32 kit for $399.
v-color's new Manta XSky RGB DDR5 memory comes in a 32GB kit (2 x 16GB) with CL32-39-39-102 timings at 1.4v that use 100% Hynix ICs for excellent overclocking performance. The company has also unveiled its new Advanced OC Smart Sorting System, which is a patented automated sorting system for DDR4 and DDR5 memory ICs.
The patented automated Smart Sorting System accelerates the testing process of memory ICs, with v-color being the only company to automate the testing and sorting of ICs for 30-50% more efficiency and reliability over manual sorting. v-color's impressive Smart Sorting System is configurable to test DDR4 + DDR5 memory ICs, at any speed right up to 6800MHz.
TEAMGROUP has just unveiled the world's first VC (Vapor Chamber) liquid-cooled M.2 SSD cooler, which will come more and more into play as we enter the world of PCIe 5.0 SSDs.
Vapor Chamber liquid cooling technology is commonly used in high-end mobile devices, but now TEAMGROUP's new N74V-M80 is an industrial grade VC Cooling MM.2 SSD that uses proprietary liquid cooling technology. TEAMGROUP is using specially designed VC liquid cooling tubes which pumps cooling fluid to the headzone of the PCIe M.2 SSD controller.
From there, heat is transferred to the aluminum fin heat sink, with TEAMGROUP using a convective design through gas-liquid phase transition to boost thermal performance. TEAMGROUP's new N74V-M80 combines the functions of heat absorption, conduction, and dissipation to better transfer and regulate thermal energy.
Kingston has just announced its latest FURY Renegade DDR5 family of RAM, with both the FURY Renegade DDR5 and FURY Renegade DDR5 RGB memory.
The new Kingston FURY Renegade DDR5 RAM is offered at up to DDR5-6400 speeds, with quick CL32 timings. The company is using premium components, "hard-tuned by engineers" and rigorously tested for compatibility across a wide range of motherboards.
Kingston is using a black and silver aluminum heat spreader, something that the company says is "newly designed" while you can get RGB lighting with the dynamic LED light bar with the FURY Renegade DDR5 RGB memory. If you opt-in for RGB lighting, simply tap into the Kingston FURY CTRL 3 software, which lets you tweak 16 smooth, customizable RGB lighting effects.
Samsung is already talking about being in the early development of totally next-gen DDR6 memory, where during a recent seminar in Suwon, South Korea.
During the seminar, Younggwan Ko, Samsung's Vice President for Test and System Package (TSP) said that packaging technology needs to evolve, as the performance (speed) of memory continues to skyrocket. I mean, DDR5 starts at JEDEC specs of 4800Mbps... but DDR6 flies up to 17,000Mbps.
Korean media outlet The Elec reports: "The previous tenting method only coated areas of the circular copper plate where the circuit patterns will be formed while the other areas were etched out". Ko continued: "But in MSAP, the areas besides the circuits are coated and the empty spaces plated, allowing for finer circuits. As the capacity and data processing speed of memory chips increase, packages must be designed to fit that, the VP said. As the number of layers increases and processes become more sophisticated, the memory package market is also expected to grow exponentially".