Samsung's new 8-layer HBM3E memory chips pass NVIDIA tests, deal expected to be signed soon

Samsung's new 8-layer HBM3E memory has passed NVIDIA's qualification tests to be used in its AI GPUs.

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In a new report from Reuters, the outlet says that the qualification clears a "major hurdle" for Samsung -- which is the world's largest memory manufacturer -- and has been struggling to catch up to South Korean rival, SK hynix, which has been providing its bleeding-edge HBM3E memory to NVIDIA for its AI GPUs.

Samsung still hasn't signed a supply deal for the approved 8-layer HBM3E memory chips with NVIDIA, but "will do so soon" according to Reuters' sources, who declined to be identified as the matter remains confidential. The new 8-layer HBM3E memory ships from Samsung would be supplied to NVIDIA in Q4 2024, which is not far away now.

• Read more: Samsung needs to wait 2-4 months for its HBM3E to be approved for NVIDIA
• Read more: NVIDIA B200 Blackwell Ultra: 288GB HBM3E, B200A Blackwell Ultra 144GB
• Read more: Samsung tells Taiwan supply chain its HBM3E memory qualified by NVIDIA
• Read more: AMD to source HBM3E memory from Samsung, starts with Instinct MI325X
• Read more: Samsung denies claims its HBM3E failed NVIDIA's quality tests for AI GPUs
• Read more: Samsung reportedly FAILS HBM3E memory qualification tests by NVIDIA

In a statement to Reuters, Samsung explains that the testing of its products (8-layer HBM3E memory chips here) was "proceeding as planned" and that the South Korean giant was "in the process of optimizing its products through collaboration with various customers".