NVIDIA still hasn't signed with Samsung HBM, but needs the company for interposers on AI GPUs

NVIDIA still hasn't signed on with Samsung for HBM chips, but NVIDIA needs Samsung's silicon interposers and advanced chip packaging technology.

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NVIDIA still hasn't signed on with Samsung for its HBM memory chips, something that will need to be resolved by NVIDIA because it requires Samsung's silicon interposers and advanced chip packaging.

NVIDIA still hasn't signed with Samsung HBM, but needs the company for interposers on AI GPUs 708

In a new report from TheElec, the huge bottleneck for NVIDIA's current-gen Hopper H100 and H200 AI GPUs is now a shortage of TSMC's CoWoS advanced packaging capacity, with an interposer shortage on the horizon. The interposer is another important key part of AI chips, with the interposer integrating multiple chips into a single package.

NVIDIA's advanced AI GPU itself, HBM memory chips, and more. H100's interposer is 3.3x the size of a lithography mask, and only 9 can be cut form a 12-inch silicon wafer (on the 40nm process). However, the more advanced GPUs like NVIDIA's new Blackwell B100 and B200 AI GPUs are even bigger, and by 2026, with Rubin R100 AI GPUs, interposers will need to be 5.5x the size of a mask... by 2027, we're looking at 8x.

TSMC is working on CoWoS-L (local interconnect) in order to shrink the interposer, but that's not an easy task, and TheElec reports that NVIDIA will eventually (and I'm sure, begrudgingly) need help from South Korean giant Samsung.

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NEWS SOURCE:thelec.net

Anthony joined the TweakTown team in 2010 and has since reviewed 100s of graphics cards. Anthony is a long time PC enthusiast with a passion of hate for games built around consoles. FPS gaming since the pre-Quake days, where you were insulted if you used a mouse to aim, he has been addicted to gaming and hardware ever since. Working in IT retail for 10 years gave him great experience with custom-built PCs. His addiction to GPU tech is unwavering and has recently taken a keen interest in artificial intelligence (AI) hardware.

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