AMD has said that TSMC's new 2nm process node (N2) is the superior to any other semiconductor foundry, highlighting that it has the first product on TSMC N2 NanoSheet technology with its upcoming EPYC "Venice" CPUs.
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TSMC's new bleeding-edge 2nm process node is far out and ahead of any other semiconductor foundry, with Samsung lagging far behind, and Intel coming up fast with billions of dollars of ASML's new High-NA EUV lithography machines purchased and being built and installed right now.
However, in a recent interview with Chosun and AMD's Senior Vice President, the company said that TSMC's new N2 process node is the most superior on the market. He said: "We are developing the processor (EPYC Venice) and will officially launch it in the market next year. TSMC is the leader in the 2nm process, so we are focusing on developing and mass producing it with the highest efficiency per watt and semiconductor performance".
- Read more: AMD says next-gen EPYC 'Venice' Zen 6 CPU: first HPC chip on TSMC's new N2 node
- Read more: TSMC's new 2nm node progressing smoothly: matching 5nm, surpassing 3nm, 7nm at similar stages
- Read more: TSMC will begin accepting 2nm wafer orders starting April 1, Apple the first customer
- Read more: TSMC's next-gen 2nm monthly production capacity to hit 80,000 wafers by the end of 2025
AMD CEO Lisa Su personally visited TSMC's new Arizona semiconductor facility, announcing it had the first HPC chip made on the company's bleeding-edge N2 process node. We should expect the new EPYC "Venice" CPU to launch later this year.




