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Toshiba's 64-layer XG5 SSD rocks 2GB/sec write speeds

Toshiba's new XG5 M.2 SSD leverages 64-layer 3D NAND to deliver insanely fast read and write speeds
By: Derek Strickland | Storage News | Posted: May 30, 2017 1:30 pm

Computex 2017 - Toshiba today revealed its new premium high-end XG5 solid state drive that leverages its innovative BiCS 3D flash memory for improved reliability, speeds, and capacities.

 

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Toshiba breaks through new barriers and ushers in a new age of storage proficiency with its new XG5 NVMe SSD, the company's first SSD that uses its third-generation 64-layer BiCS 3D flash memory with 512Gb dies built with the 15nm process. Armed with 64-layer BiCS flash, the Toshiba XG5 NVMe solid state drive can hit blazing fast sequential read write speeds of 3,000 MB/sec (3GB/sec) reads and 2,100 MB/sec (2.1GB/sec) writes.

 

The XG5 SSD is a single-sided M.2 form factor drive that comes in capacities up to 1TB thanks to its vertically-stacked flash memory, and sports increased reliability with a Mean Time to Failure rating of 1.5 million hours. Toshiba's new high-performance SSDs will be available in the XG5 Series line, which includes drives in three capacities on matching M.2280 form factors: 256GB, 512GB, and 1024GB.

 

Toshiba's ultra-fast, high-capacity M.2 SSD is being shipped to key OEMs and optimized for a myriad of targets including mainstream PC computing, thin performance notebooks, and enthusiast desktops and laptops.

 

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"We are proud to introduce the first ever NVMe SSD equipped with 64-layer BiCS FLASH technology, and we expect broad adoption from our major PC OEM customer base," said Jeremy Werner, vice president SSD marketing and product planning at Toshiba America Electronic Components, Inc.

 

"The XG5 Series demonstrates Toshiba's ability to deliver a cutting-edge, high performance and low power solution for client PC applications that can also be leveraged as a server or boot drive storage solution."

 

Toshiba will be showcasing the XG5 series at Computex in Taipei, Taiwan from May 30 to June 3.

 

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