Intel Crescent Island PCB leak gives us our first look at the Xe3P GPU and its 160GB LPDDR5X memory design

Back in February 2026, Intel released an introductory video indicating that its next-generation Xe3P architecture would follow the Xe2 architecture. Later, it was reported that Xe3P would not appear in consumer Celestial gaming graphics cards, and Intel canceled the product entirely. Instead, Intel plans to use the architecture in Crescent Island.

Crescent Island is Intel's next data-center GPU, targeting AI inference rather than a consumer Arc graphics card. Intel confirmed the product in October, featuring the Xe3P graphics architecture, 160GB of LPDDR5X memory, and targeting air-cooled data centers and workstations optimized for AI inference workloads.

Now, the upcoming Crescent Island accelerator has appeared in a first PCB leak from YuuKi_AnS, spotted by Wccftech. The leaked PCB gives us a look at the large Xe3P GPU die and its LPDDR5X memory configuration.

The GPU chip itself occupies a significant portion of the PCB and is notably larger than Intel's current flagship, the Xe2-based BMG-G31. The leaked PCB reportedly features 20 LPDDR5X memory sites - 12 on the front and 8 on the back - supporting a total of 160GB of LPDDR5X memory. Intel chose LPDDR5X over HBM as a cost-effective alternative that avoids the power-supply strain HBM would impose on the system.

NVIDIA and AMD are already shipping data center AI hardware with high-end HBM memory like HBM3E, and neither is shy about teasing HBM4 for upcoming chips like Rubin and MI400. But HBM is getting harder to come by thanks to surging demand, and prices are climbing. Leveraging LPDDR5X memory could give Intel a significant cost advantage without sacrificing the performance needed for inference workloads. The new architecture is also built to handle a wide mix of data types, which should be a win for tokens-as-a-service providers and anyone running inference at scale.

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Other than that, the pictures show a high-end PCB design with 18 VRM positions, 13 of which appear populated. A USB-C port is visible on the side, presumably for testing, and a 12V-2x6 power connector is located at the rear of the PCB. The PCB leak does not confirm final clocks, power limits, or performance figures. Intel has not announced pricing or launch timing, other than confirming that customer sampling is planned for the second half of 2026.