AMD's next-generation Zen 6 architecture will debut this year, with its CCD packing more density, more CPU cores, more cache, and it'll only be a bit bigger than the CCDs on the Zen 5 and Zen 4 chips, all fabbed on TSMC's fresh new N2 process node.
In a new post on X by leaker "HXL" who provided the Zen CCD die sizes starting from Zen 2 through to the next-gen Zen 6 CCD, you can see that the new Zen 6 CCDs will feature 50% more cores (12 cores per CCD versus 8 cores on Zen 3/4/5), 50% more cache (48MB per CCD versus 32MB on Zen 3/4/5) and fabbed on TSMC's latest N2 process node using NanoSheet technology.
AMD is expected to use TSMC's new N2P process node for all of its Zen 6 processors, with the IOD fabbed on N3P, which we heard about in leaks previously (more on that in the links below). The CCD die size is only a bit bigger with Zen 6 coming in at around 76mm2, compared to 71mm2 for Zen 5's CCD and 72mm2 for Zen 4, but smaller than Zen 3's CCD which is 83mm2.
- Read more: AMD confirms Zen 6 on TSMC 2nm, confirms future-gen Zen 7 on even newer node
- Read more: AMD's next-gen Zen 6 CPUs: TSMC 2nm 'N2P' CCD with TSMC 3nm 'N3P' IOD
AMD Zen CPU core counts, die sizes, cache, process node details:
- Zen 2 CCD: 2*4 Core 2*16 MB L3 TSMC N7 ~77 mm2
- Zen 3 CCD: 8 Core 32MB L3 TSMC N7 ~83 mm2
- Zen 4 CCD : 8 Core 32MB L3 TSMC N5 ~72 mm2
- Zen 5 CCD : 8 Core 32MB L3 TSMC N4 ~71 mm2
- Zen 6 CCD : 12 Core 48MB L3 TSMC N2 ~76 mm2




