Apple to use TSMC's advanced WMCM and SoIC packaging for A20, server chips in 2026

Apple is planning major collaborations with TSMC on advanced packaging, with reports that we will see TSMC's new advanced WMCM and SoIC packaging for its next-gen A20 and server chips.

In a new report from DigiTimes, we're hearing that TSMC's next-generation manufacturing process will be shifting into two new packaging forms in 2026. Apple will reportedly shift to WMCM (Wafer-Level Multi-Chip Module) packaging, while TSMC's new SoIC (System on Integrated Chips) will be used for Apple's new server chips.

The new WMCM packaging for Apple's next-gen A20 and A20 Pro chips has some serious flexibility using this new packaging technology, where Apple can add multiple dies -- including the CPU, GPU, memory, and other parts -- at wafer level, before they are sliced into individual chips. The new packaging will allow Apple to mass-manufacture more efficient SoCs.

TSMC will reportedly set up a dedicated production line at its Chiayi P1 facility, with an initial target of 10,000 wafers a month. It's not clear whether any other company apart from Apple will adopt the new WMCM packaging technology, but Apple will be pushing its server chips with the new packaging tech, and instead of using the same tech on its A20 and A20 Pro chips, Apple is expected to use TSMC's new SoIC packaging, combining two advanced chips stacked directly on each other.

This will allow for ultra-dense connections between the stacked chips, which will reduce latency, increase performance, and boost efficiency. TSMC and Apple have been in the headlines reportedly looking into this packaging (more on that in the links above), so we could see the new tech being used inside the new M5 Pro and M5 Max processors.