Apple A20 chip to skip TSMC's WMCM tech amid DRAM shortages

Apple's upcoming A20 chip, set to power the base iPhone 18, is reportedly skipping TSMC's advanced WMCM (Wafer-Level Chiplet Multi-Chip) packaging technology due to persistent DRAM shortages.

This shift underscores how supply chain constraints stemming from AI companies' supply squeezes are forcing even industry leaders like Apple to scale back ambitious hardware plans. Previously, the A20 was expected to transition from TSMC's InFO (Integrated Fan-Out) packaging to WMCM, a modular approach enabling flexible CPU/GPU core configurations.

WMCM allows chiplets, smaller, specialized components to be combined in varying ratios, optimizing performance and power efficiency for different device tiers. For example, high-end iPhone models could feature more GPU cores, while budget variants prioritize CPU efficiency. However, reports from WCCFTech, citing an X post from tipster Jukun, suggest Apple will retain InFO for the A20 to mitigate risks tied to DRAM scarcity, which has disrupted global electronics manufacturing.

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The decision highlights the fragility of even the most vertically integrated tech companies amid semiconductor supply volatility. While Apple remains a market leader in innovation, the A20's design reflects a prioritization of what works over riskier, more expensive advancements. TSMC's WMCM tech, though promising, requires complex coordination with memory suppliers, which, in today's climate, is quite difficult given that AI companies are gobbling up all the supply.

For consumers, this means the base iPhone 18 may lack the architectural flexibility seen in competing chips, at least initially. However, Apple could adopt WMCM in future A-series or M-series chips once supply stabilizes. The move also raises questions about how other manufacturers will navigate similar constraints, particularly as AI and high-performance computing demand surges.