TSMC, Micron, ASE seek deals to convert old display plants into CoWoS advanded packaging plants

TSMC, Micron, and ASE are working on getting deals to secure old display panel plants in Taiwan, and convert them to CoWoS advanced semiconductor packaging facilities to meet the unstoppable AI GPU demand.

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In a new media report from Ctee, we're hearing that TSMC and Micron are interested in a HannsTouch factory near TSMC's Fab 18, which was purchased from HannsTouch affiliate, HannStar, back in 2020. TSMC could possibly rent display panel maker Innolux's Fab 5 due to delays with its construction at its new Chiayi CoWoS packaging plants.

Multiple chip makers are reportedly in discussions with Innolux over its Fab 2 which is empty, with ASE rumored to be eyeing off an Innolux plant in Kaohsiung, in southern Taiwan, but the plant is sitll in use so the deal probably won't go through.

• Read more: Intel's next-gen Falcon Shores AI chip: TSMC 3nm node, CoWoS packaging
• Read more: TSMC seeks land for CoWoS packaging plants, struggles with AI demand
• Read more: TSMC to raise 3nm manufacturing costs by 5%, CoWoS by 10-20% in 2025
• Read more: TSMC buying equipment for two CoWoS advanced packaging plants to be built in Taiwan
• Read more: TSMC to expand CoWoS orders: AI chips from NVIDIA, Amazon, Meta, Tesla
• Read more: NVIDIA's next-gen R100 AI GPU: TSMC 3nm + CoWoS-L + next-gen HBM4 in Q4 2025
• Read more: TSMC to expand advanced packaging capacity at 3 plants: CoWoS, SoIC, SoW for AI GPUs
• Read more: NVIDIA, AMD reserved all of TSMC's CoWoS and SoIC advanced packaging for 2024 + 2025

The insane AI GPU demand from mostly NVIDIA, is driving advanced packaging plant use to their max... and we're really only getting started. TSMC has been pumping out as much Hopper H100 and H200 AI GPUs as it can, and has the new Blackwell AI GPUs arriving now and many more expected to ship starting in Q4 2024, and deep into 2025.