TSMC is rapidly expanding the production of its most advanced nodes, with a new report from Economic Daily News outlining the company's existing production capabilities and where it expects to end up towards the end of 2026. Naturally, with the AI boom, demand for cutting-edge chips from companies like NVIDIA, AMD, and Broadcom is ramping up.

And with that, 3nm wafer production is expected to hit an impressive 180,000 wafers by Q4 2026. Even more impressive, or ambitious, is the word that TSMC is planning to reach 100,000 wafers for its 2nm production by the end of the year. With 2nm wafer production reportedly reaching around 50,000 to 60,000 in the first half of 2026, the 100,000 figure would effectively double what's currently being produced.
Although it represents the company's most advanced process, TSMC N2 (2nm) currently accounts for only 3% of the company's revenue, with its N3 (3nm) process accounting for around 30%, and the N5 (5nm) process leading with 33%.
TSMC N2 adoption will, of course, grow as the process powers Apple's A20 and A20 Pro SoCs expected to power the upcoming iPhone 18 series, on track for September. Qualcomm and MediaTek will also leverage TSMC's 2nm process for upcoming SoCs coming in 2027.

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On the data center and AI side, AMD's Instinct MI450 GPU and NVIDIA's Rubin Ultra will leverage 2nm technology, so the 3% is merely a reminder that TSMC N2 is still ramping up as yields improve and its key customers begin to release products and hardware with the new technology.






