Samsung's new low-end Exynos mobile chip leverages the 14nm FinFET process, offering sizable performance boosts and power efficiency.
Samsung is currently mass producing its new lower-end Exynos 7570 SoC (System-on-Chip) optimized for affordable mobile and IoT devices. Built on the 14nm FinFET process, the new Exynos 7570 chip is 20% smaller than its predecessor's 28nm node making the new chip's transistor's more densely packed and now require less voltage. As such, the new 14nm Exynos chip's four ARM Cortex-153 cores are 30% more power efficient and enjoy a staggering 70% increase in CPU power compared to the earlier SoC.
Perhaps the most impressive feature of the Exynos 7570 is that Samsung has integrated specific components like an LTE and Wi-Fi modem, Bluetooth, and an FM radio directly into the chip. This will reduce the amount of extra components that need to be added to a device's motherboard, allowing phone-makers to shave off some space.
"The new Exynos also offers a fully connected mobile experience by integrating a Cat. 4 LTE 2CA modem and various connectivity solutions, such as Wi-Fi, Bluetooth, FM radio and GNSS," reads Samsung's press release announcement.
As it's designed for affordable budget mobile devices, the Exynos 7570 won't support Full HD screen resolution (only up to WXGA 1280 x 800), it can record and play back full 1080p video. The chip also supports an improved image signal processor for 8MP/13MP front and back cameras.
We should start seeing phones using the new Exynos 7570 within the coming months, but Samsung hasn't revealed an official timeline just yet.
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