Samsung's new FoWLP tech doesn't need a PCB, makes smartphones thinner

Samsung unveils its new FoWLP technology, promising more efficiency from mobile SoCs, and more.

39 seconds read time

It looks like Samsung is continuing to out-innovate everyone else, announcing that Samsung and even TSMC are producing chips using the new FoWLP yield technology. What the hell is FoWLP yield technology you ask?

Samsung's new FoWLP tech doesn't need a PCB, makes smartphones thinner |

FoWLP, or Fan-Out Wafter Level Packaging platform, allows smartphone OEMs to reduce the thickness of their devices by a great degree, which has multiple benefits. FoWLP also doesn't need a PCB, and also increases the efficiency of chips by 30%, as well as reducing the thickness of smartphones by at least 0.3mm.

Apple is reportedly using TSMC as its main supplier of 10nm FinFET processors, and Samsung wants a cut of that business - which is where FoWLP comes into play. Samsung might end up winking just right at Apple, especially if TSMC can't keep up with Apple's high demand. With smartphones hitting the whole no bezel, super-thin, more battery wishlist - Samsung's impressive new FoWLP technology is going to come in handy big time over the coming years.


Anthony joined the TweakTown team in 2010 and has since reviewed 100s of graphics cards. Anthony is a long time PC enthusiast with a passion of hate for games built around consoles. FPS gaming since the pre-Quake days, where you were insulted if you used a mouse to aim, he has been addicted to gaming and hardware ever since. Working in IT retail for 10 years gave him great experience with custom-built PCs. His addiction to GPU tech is unwavering.

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