Xiaomi has officially unveiled the XRing O3, its latest in-house flagship processor. Built on TSMC's 3nm N3P node, it is positioned as the world's first smartphone SoC to support next-generation LPDDR6 RAM. The chip packs 24 billion transistors, up from 19 billion on last year's XRing O1. Much of that extra silicon goes toward a larger 16MB SLC cache and a redesigned CPU.
The CPU now uses an all-big-core design, ditching efficiency cores entirely. It combines two ARM C1-Ultra cores running at up to 4.35GHz with four C1-Premium cores at 3.68GHz and four C1-Pro cores at 3.15GHz. Xiaomi claims Geekbench 6.5 scores of 3,945 single-core and 15,221 multi-core, representing 31% and 61% gains over the O1. That multi-core result reportedly even edges out Apple's M4 desktop chip, while the chip also scored more than 5.2 million in AnTuTu V11.
Graphics get a major upgrade too. The O3 uses a 16-core Mali-G2 Ultra NX GPU with dedicated neural cores for frame generation and upscaling. These features run directly within the GPU's cache hierarchy instead of sending data back and forth to system memory. Xiaomi claims this delivers 85% higher graphics performance, 182% better ray tracing, and 64% lower power consumption compared with the O1.
The other major upgrade is LPDDR6 support. The O3 runs the new memory at 10,667Mbps across a 4x24-bit bus, providing 113.8GB/s of peak bandwidth, or 48% more than the O1. According to Cailian Press, Chinese memory maker CXMT is supplying the LPDDR6, making this the first flagship mobile chip to use domestically developed Chinese LPDDR6. CXMT is reportedly targeting mass production in the second half of 2026, putting it in early competition with SK Hynix, which completed development of its own 16Gb LPDDR6 chips in March.
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The XRing O3 will debut in the Xiaomi 18 Fold and Xiaomi Pad 9 Pro Max, both expected in September, with initial shipments reportedly targeting 200,000 to 300,000 units. The launch is another step in Xiaomi's broader push toward chip self-sufficiency. The company has pledged at least 50 billion yuan, roughly $7 billion, over the next decade to reduce its reliance on outside suppliers such as Qualcomm and MediaTek.
