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CXMT is considering a second Beijing DRAM fab as it targets Micron-level output by late 2026

The proposed Beijing fab would add to ongoing expansions in Shanghai and Hefei, pushing CXMT's output beyond 600,000 wafers per month.

CXMT is considering a second Beijing DRAM fab as it targets Micron-level output by late 2026
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TL;DR: CXMT is weighing a second DRAM fab in Beijing's Yizhuang while expanding in Shanghai and Hefei to push output beyond 600,000 wafers/month. Rapid construction and rising shipments lifted its Q1 2026 market share to 8% and DRAM revenue over 700% year-on-year, with most new capacity serving domestic demand.
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China's largest memory chipmaker, CXMT, is reportedly considering building a second DRAM fabrication facility in Beijing, according to a Reuters report.

The proposed plant would be located in Yizhuang, around 20 kilometers southeast of central Beijing, in the same development area where CXMT already operates a DRAM fab. The company is in early-stage financing discussions with the Beijing Economic-Technological Development Area, seeking at least 60 million yuan (roughly $8.9 million).

The total investment required has not yet been determined, but building a modern leading-edge DRAM facility typically costs more than $10 billion. CXMT currently operates two 12-inch fabs in Hefei and one in Beijing, each capable of producing around 100,000 wafers per month, for a combined output of roughly 300,000 wafers per month.

CXMT is considering a second Beijing DRAM fab as it targets Micron-level output by late 2026 2

Expansion plans already underway in Shanghai and Hefei are expected to more than double that figure to over 600,000 wafers per month once fully operational.

One of the more striking aspects of CXMT's expansion is its construction speed. Semiconductor cleanrooms typically take around two years to build, but CXMT has reportedly reduced that timeline to approximately 12 months. By the end of 2026, the company is on track to produce around 350,000 wafers per month, putting it close to Micron's approximately 375,000 wafers per month.

Despite that momentum, CXMT still ranks fourth in the global DRAM market behind Samsung, SK Hynix, and Micron, which together controlled nearly 90% of the market in Q1 2026. CXMT's market share reached 8% during the quarter, up from 3% a year earlier, while its DRAM revenue grew by more than 700% year over year.

CXMT is considering a second Beijing DRAM fab as it targets Micron-level output by late 2026 3

Its growth has been driven in part by the gap left as Samsung and Micron redirected significant production capacity toward high-bandwidth memory for AI data centers, creating an opportunity in the standard LPDDR and DDR markets where CXMT has been steadily gaining ground.

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Question #1

What is the planned location and funding stage for CXMT's proposed second Beijing DRAM fab in Yizhuang?

Question #2

How quickly has CXMT reportedly reduced cleanroom construction time compared with typical semiconductor build timelines?

Question #3

What portion of the global DRAM market did CXMT hold in Q1 2026 and how much did its DRAM revenue grow year over year?

Question #4

Which memory segments benefited CXMT as Samsung and Micron shifted capacity toward HBM for AI, and how did that affect CXMT's bookings?

Have a question not listed here? Ask below and TweakBot will answer it.

For the global memory market, CXMT's expansion adds capacity, but most of it is expected to be absorbed domestically. Chinese hyperscalers, smartphone manufacturers, and AI labs are consuming memory at record rates, and with U.S. export restrictions limiting China's access to foreign chips, domestic demand effectively provides a floor for nearly everything CXMT can produce.

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News Source:reuters.com

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Tech Reporter

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Hassam is a veteran tech journalist and editor with over eight years of experience embedded in the consumer electronics industry. His obsession with hardware began with childhood experiments involving semiconductors, a curiosity that evolved into a career dedicated to deconstructing the complex silicon that powers our world. From benchmarking PC internals to stress-testing flagship CPUs and GPUs, Hassam specializes in translating high-level engineering into deep, unbiased insights for the enthusiast community.

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