China's largest memory chipmaker, CXMT, is reportedly considering building a second DRAM fabrication facility in Beijing, according to a Reuters report.
The proposed plant would be located in Yizhuang, around 20 kilometers southeast of central Beijing, in the same development area where CXMT already operates a DRAM fab. The company is in early-stage financing discussions with the Beijing Economic-Technological Development Area, seeking at least 60 million yuan (roughly $8.9 million).
The total investment required has not yet been determined, but building a modern leading-edge DRAM facility typically costs more than $10 billion. CXMT currently operates two 12-inch fabs in Hefei and one in Beijing, each capable of producing around 100,000 wafers per month, for a combined output of roughly 300,000 wafers per month.

Expansion plans already underway in Shanghai and Hefei are expected to more than double that figure to over 600,000 wafers per month once fully operational.
One of the more striking aspects of CXMT's expansion is its construction speed. Semiconductor cleanrooms typically take around two years to build, but CXMT has reportedly reduced that timeline to approximately 12 months. By the end of 2026, the company is on track to produce around 350,000 wafers per month, putting it close to Micron's approximately 375,000 wafers per month.
Despite that momentum, CXMT still ranks fourth in the global DRAM market behind Samsung, SK Hynix, and Micron, which together controlled nearly 90% of the market in Q1 2026. CXMT's market share reached 8% during the quarter, up from 3% a year earlier, while its DRAM revenue grew by more than 700% year over year.

Its growth has been driven in part by the gap left as Samsung and Micron redirected significant production capacity toward high-bandwidth memory for AI data centers, creating an opportunity in the standard LPDDR and DDR markets where CXMT has been steadily gaining ground.

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For the global memory market, CXMT's expansion adds capacity, but most of it is expected to be absorbed domestically. Chinese hyperscalers, smartphone manufacturers, and AI labs are consuming memory at record rates, and with U.S. export restrictions limiting China's access to foreign chips, domestic demand effectively provides a floor for nearly everything CXMT can produce.






