The PlayStation 5 teardown reveal is finally here. Now we get a proper look at the PS5's cooling solution.
The PS5 features a massive 120mm fan that can pull air from both sides of the console, a new teardown video reveals. The PS5's strange chassis is specifically designed to pull air in a certain way through the intake vents, and the powerful 120mm centrifugal fan is 45mm thick and features sharp fins to direct the airflow. The entire rear of the PS5 is devoted to heat exhaust.
The PS5's cooling solution is somewhat similar to the Xbox Series X's insofar as size, but not in specificity. The Series X's fan is 130mm and pulls air from bottom to top, and the PS5 pulls air from the sides to push out the back.
Sony also confirms the PlayStation 5 uses liquid metal compound to cool the SoC, which will reduce temperatures quite a bit. Liquid metal compound increases thermal conductivity by 86%, meaning the heat sink will absorb nearly 90% more heat, which is then exhausted thanks to the powerful fan.
This is the first console to ever use liquid metal thermal compound to cool a chip. Sony spent two years developing its liquid metal solution.
The fan and liquid cooling compound are also complemented by a massive heat sink. The heat sink features a huge copper plate and copper heat pipes, but it's positioned in a way to mimic the performance of a vapor chamber cooler. The heat sink takes up a huge portion of the system's real estate and is a vital component to ensure the PS5 stays quiet and cool even under blistering 4K 60FPS processing loads.
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