SK Hynix and Samsung race to build the memory powering NVIDIA and AMD's next AI monsters

The AI industry boom is undoubtedly unprecedented, and consumers are feeling the pinch of supply constraints on memory and storage prices. This problem is so widespread that it isn't just consumers who are impacted by higher prices; as new Xbox CEO Asha Sharma recently outlined in a letter, the price Xbox pays for storage and memory has increased by 4x since she took office.

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With DRAM manufacturers now turning toward AI-specific memory, such as HBM production, we are beginning to hear rumblings of a race between leading DRAM manufacturers, SK Hynix and Samsung. Reports indicate that both companies are rushing to release the first HBM4E memory solutions, which will undoubtedly be gobbled up by the highest-bidding AI companies and deployed directly in data centers.

HBM4E memory will be a big part of the next generation of data centers, which powers the next generation of AI. The new generation of memory chips will be headed to leading products such as NVIDIA's Rubin Ultra, and AMD's Instinct MI500. Just these two chips, by themselves, are expected to drive millions in sales. As for specifications, it's reported the new HBM4E offering from SK Hynix will arrive in capacities of up to 48GB, and speeds of 16GBps. As for Samsung, the South Korean manufacturer showcased its latest generation, HBM5, on the showroom floor at Computex 2026.

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"The company was able to deliver samples of the 12-stack HBM4E on schedule thanks to its advanced HBM development and production expertise for HBM," said SK hynix, adding that "We will work closely with partners for mass production in a timely manner," wrote SK Hynix