High Level Architecture
As you can see the main CPU core remains the same as the rest of the 8th generation mobile processors, and it retains its integrated graphics, but the package adds on the "discrete" Vega GPU. Both GH and GL get 4GB of HBM, which is exclusive to the CPU. The CPU is connected to the dGPU through Intel's EMIB bridge. The Embedded high-speed connector in package produces an x8 PCI-E 3.0 link. It keeps z-height down and reduces silicon footprint by 50%, making it a solid contender for slim form factors.
The HBM memory uses up to 80% less power than GDDR5, which also makes it a solid contender for slimmer notebooks and devices. At a total (dGPU + iGPU) you get nine display outputs. You also get the ability to switch between integrated and discrete graphics options.
The Radeon Display engine provides up to 6 display outputs, 4K resolution, HDMI 2.0 with HDR10 support, and DP 1.4 w/HDR. The HBM features a 1024-bit bus and low power options. With up to 24 Compute Units, the GH configuration should be one of the fastest on-package mobile gaming solutions on the market. We also get Radeon's Multi-Media Engine with 4K60 encode/decode, and HEVC. Adding the Intel CPU's capabilities into the mix creates a feature-rich product.
Intel's integrated HD graphics provide three more display outputs, 4K resolution support, and eDP/PSR for longer battery life. We also get the benefits of Intel's own multimedia engine with VP9, HEVC 10b hardware based encode/decode, and H264 hardware encode/decode.
Intel is comparing to scale the size of the new SoC and previous mobile discrete gaming solutions. The size reductions are immense, allowing for larger batteries or smaller devices.
Intel is also introducing Dynamic Power Sharing. Intel's dynamic power sharing allows for the system to understand how much of the CPU or GPU is being utilized at any given time, and then provide just the right amount of power to each device. When you play games or do other real-world tasks, you almost never engage the CPU and GPU equally or all the way at the same time and this new technology allows Intel to better balance power delivery to provide better battery life and maximize component performance when possible.
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