Toshiba Corporation today announced the development of the world's first 16-die (max.) stacked NAND flash memory utilizing Through Silicon Via (TSV) technology. The prototype will be shown at Flash Memory Summit 2015, to be held from August 11 to 13 in Santa Clara, USA.
The prior art of stacked NAND flash memories are connected together with wire bonding in a package. TSV technology instead utilizes the vertical electrodes and vias to pass through the silicon dies for the connection. This enables high speed data input and output, and reduces power consumption.
Toshiba's TSV technology achieves an I/O data rate of over 1Gbps which is higher than any other NAND flash memories with a low voltage supply: 1.8V to the core circuits and 1.2V to the I/O circuits and approximately 50%*2 power reduction of write operations, read operations, and I/O data transfers.
This new NAND flash memory provides the ideal solution for low latency, high bandwidth and high IOPS/Watt in flash storage applications, including high-end enterprise SSD.
A part of this applied technology was developed by the New Energy and Industrial Technology Development Organization (NEDO).
Recommended for You
Latest News Posts
- Pre-order Dead Cells now on Switch, receive 20% discount
- Super Smash Bros. Ultimate available at this years Evo 2018
- Sony teases 'Tombstone' villain inclusion for Spider-Man PS4
- The Hulk smashes into GTA V with new mod, download available
- Dragon Ball FighterZ for Switch, open beta starts next month
- Asrock a320m dgs eveything stuttering even cs go drops 15-20 fps
- Biostar X470GTN Gaming (AMD X470) Motherboard Review
- Asrock X399 + Watercooling help needed please
- HyperX Pulsefire Surge RGB Gaming Mouse Review
- ASRock Phantom Gaming Radeon RX 550 - can it run silent?
- Micron Launches Industry's First Enterprise SATA Solid State Drives Built on Leading 64-layer 3D NAND Technology
- Micron, Rambus, Northwest Logic and Avery Design to Deliver a Comprehensive GDDR6 Solution for Next-Generation Applications
- Toshiba Memory America Unveils UFS Devices Utilizing 64-Layer, 3D Flash Memory
- ASUS Announces GeForce GTX 1070 Ti Series Gaming Graphics Cards
- ASUS Announces ASUS Hangouts Meet Hardware Kit