Toshiba Corporation today announced the development of the world's first 16-die (max.) stacked NAND flash memory utilizing Through Silicon Via (TSV) technology. The prototype will be shown at Flash Memory Summit 2015, to be held from August 11 to 13 in Santa Clara, USA.
The prior art of stacked NAND flash memories are connected together with wire bonding in a package. TSV technology instead utilizes the vertical electrodes and vias to pass through the silicon dies for the connection. This enables high speed data input and output, and reduces power consumption.
Toshiba's TSV technology achieves an I/O data rate of over 1Gbps which is higher than any other NAND flash memories with a low voltage supply: 1.8V to the core circuits and 1.2V to the I/O circuits and approximately 50%*2 power reduction of write operations, read operations, and I/O data transfers.
This new NAND flash memory provides the ideal solution for low latency, high bandwidth and high IOPS/Watt in flash storage applications, including high-end enterprise SSD.
A part of this applied technology was developed by the New Energy and Industrial Technology Development Organization (NEDO).
Recommended for You
Latest News Posts
- Oculus founder has a new company, working on VR still
- Intel Core i7-8700K overclocked reaches 4.8GHz on air
- Intel Coffee Lake-S: flagship 8700K CPU, 40 PCIe lanes
- Ethereum mining difficulty reaches lofty new heights
- NVIDIA GeForce GTX 10 series pricing to continue rising
- Intel Core i9-7980XE and i9-7960X CPU Review
- Guardians of the Galaxy Vol. 2 4K Blu-ray Review
- Upgrading USB ports on top of case
- Areca ARC-8050T3 12-Bay Thunderbolt 3 RAID DAS Review
- GA-P67A-UD3P-B3 can't change multiplier past 38, can't change turbo ratio with i5 3570k
- AOC announces retail availability of AGON curved QHD gaming monitor
- Seasonic presents the PRIME Ultra power supplies
- EVGA announces GeForce GTX 1080 Ti FTW3 ELITE video card
- G.Skill releases AMD Ryzen-optimized Trident Z RGB DDR4 memory
- Hear the difference feel the beat of the DRUM