IDF 2014 - Supermicro Releases X10 Server Solutions Featuring New Intel® Xeon® Processor E5-2600/1600 v3, DDR4 and NVMe at IDF 2014.
Charles Liang, President and CEO of Supermicro said "Supermicro's X10 Green Computing solutions offer the most optimized DP/UP server and storage platforms on the market supporting advanced technologies and new Intel Xeon E5-2600/1600 v3 processors. Leading the wave is our new 1U/2U Ultra SuperServers which integrate hot-swap NVMe SSDs and SAS3 storage with high bandwidth 10G/40G networking in a new thermal optimized architecture that minimizes fan count and fan power consumption to provide exactly the best platform for enterprise-class virtualization and hyper-scale computing applications. Combined with our new X10 TwinPro, MicroBlade and FatTwin systems as well as the industry's widest range of server building blocks with Titanium level high efficiency power supplies, Supermicro is delivering total solutions to address the critical power, space and cost challenges facing today's data driven businesses."
Supermicro has many new products to offer up with this new release of X10 servers. At IDF 2014, we happened to catch up with Supermicro to check out the new products they have to offer.
As you walked into the show room floor, the first display you saw was the Supermicro booth. The Supermicro team was on hand and ready to answer any questions people had.
The system that gathered a lot of attention was the new X10 DP MicroBlade server. This is an impressive server to be sure. With 28 DP Nodes, give this MicroBlade the highest density available.
X10 DP MicroBlade solutions
The X10 DP MicroBlade Features:
High-performance, high-density server featuring 28x hot-swappable MicroBlade modules supporting dual Intel® Xeon® E5-2600 v3 (up to 14 cores, 120W TDP) or E3-1200 v3, up to 196x DP nodes per 42U Rack with up to 128GB in 8x VLP DDR4 2133MHz DIMMs and 2x 2.5" 6Gb/s SATA3 HDD/SSDs and 1x SATA DOM per module. MicroBlade enclosure incorporates up to 2x Chassis Management Module (CMM) and up to 2x hot-swappable network switches with 2x 40Gb/s QSFP or 8x 10Gb/s SFP+ uplinks per module. Enclosure also features up to 8x redundant (N+1 or N+N) 1600W Platinum Level high-efficiency (95%+) Digital power supplies with cooling fans. Ideal for cloud computing, data center, enterprise, high performance computing, dedicated hosting and content delivery applications.
1U/2U Ultra SuperServers
1U/2U Ultra SuperServers Feature:
The Ultra platform offers best-in-class Enterprise server performance while maximizing value and delivering uncompromising flexibility, scalability, and manageability. Hyper-Speed Ultra adds unparalleled performance and is optimized for applications such as Low-Latency trading. Depending on configuration, systems feature dual Intel® Xeon® processor E5-2600 v3 (up to 18 cores, up to 160W TDP), 24x/16x DIMMs up to 1.5TB/1TB of DDR4 2133MHz Reg. ECC memory, hot-swap NVMe and 12Gb/s SAS3 options up to 8x PCI-E 3.0 expansion slots, dual or quad port 1G, 10GBASE-T, 10G SFP+, 40G Ethernet, and InfiniBand options and 750W/1000W Redundant Titanium Level high-efficiency (96%+) Digital Power Supplies.
2U TwinPro/ TwinPro² Servers
2U TwinPro/ TwinPro² Server Features:
2U/4U hot-plug node servers supporting dual Intel® Xeon® processor E5-2600 v3 (up to 18 cores, 145W TDP), up to 1TB of DDR4 2133MHz Reg. ECC memory in 16x R/LR DIMMs, PCI-E 3.0 and PCI-E 3.0 x16 "0" slot, Intel® Xeon® Phi support, 8x ports of Avago 3008/3108 SAS 3.0 (12Gb/s) with optional SuperCap (CacheVault), 8x ports of SATA 3.0 (6Gbps), up to 4x NVMe, single FDR (56Gb/s) InfiniBand, dual 10GBase-T and 1280W Redundant Platinum Level high-efficiency (95%+) Digital Power Supplies.
4U FatTwin Servers
4U FatTwin Servers Feature:
High-density 8/4/2 hot-plug node SuperServer® systems available with a variety of memory capacities, HDD technologies, PCI-E alternatives, networking capabilities, and Intel® Xeon® Phi support options. Systems support dual Intel® Xeon® processor E5-2600 v3 (up to 18 cores and 145W TDP) up to 1TB of DDR4 2133MHz Reg. ECC in 16x DIMMs, 1x PCI-E 3.0 x16 and 1x PCI-E 3.0 x8 Micro LP card, 8x ports of LSI® 3008/3108 SAS 3.0 (12Gbps) with software/hardware RAID, 10x ports of SATA 3.0 (6Gbps) with Intel® C612 controller, dual 10GBase-T or dual GbE ports, redundant Titanium Level (96%+) Digital power supplies, integrated IPMI 2.0 with KVM over dedicated LAN.
7U SuperBlade® - TwinBlade®
7U SuperBlade® - TwinBlade® Servers Feature:
Datacenter Blade (SBI-7428R-C3/-T3, CPUs 145W TDP) and StorageBlade (SBI-7128R-C6, CPUs 160W TDP) modules support dual Intel® Xeon® processors E5-2600 v3 (up to 18 cores) per node, optional InfiniBand or 10G mezzanine HCA, optional PCI-E 3.0 expansion card, support for NVMe or 12Gb/s SAS3 (StorageBlade/Datacenter Blade) and Platinum Level high-efficiency (94%+), N+1 redundant power supplies.
1U/2U Data Center Optimized (DCO) Solutions
1U/2U Data Center Optimized (DCO) Solutions Feature:
Enhanced thermal architecture featuring power efficient components and offset processors eliminate CPU preheating allowing higher operating temperatures. Supports dual Intel® Xeon® processor E5-2600 v3 (up to 18 cores and 145W TDP), up to 1TB DDR4 2133MHz memory in 16x DIMM slots, 4x AoC option including SAS mezzanine card, 10x SATA 3.0 (6Gbps) ports with Intel® C612 controller, up to 2x GbE LAN, 4x internal NVMe ports, and 7+ year product life cycle with Platinum level (95%+) high-efficiency Digital power supplies.
1U/2U WIO SuperServer Solutions
1U/2U WIO SuperServer Solutions Feature:
Wide range of I/O options to optimize the storage and networking alternatives for General Purpose, ERP/MRP, and Network and Security Appliance Applications. Supports dual or single Intel® Xeon® processor E5-2600/1600 v3 (up to 18 cores, 145W TDP), up to 1TB of DDR4 2133MHz in 16x DIMMs, 2/6x Add-on Cards (AOC) in 1U/2U, 10x SATA 3.0 (6Gbps) ports with Intel® C612 controller, optional NVMe and 12Gb/s SAS3 support, LAN options up to 2x 10GBase-T or 2x GbE ports, redundant Platinum Level high-efficiency (95%+) Digital power supplies, integrated IPMI 2.0 with KVM over dedicated LAN.
1U/2U/4U/Tower GPU/Intel® Xeon® Phi Solutions
1U/2U/4U/Tower GPU/Intel® Xeon® Phi Solutions Feature:
support dual Intel® Xeon® processors E5-2600 v3 (up to 18 cores, 145W TDP) per node up to 1TB of DDR4 2133MHz memory in 16x DIMMs, 4/6x Intel® Xeon Phi coprocessors in 1U/2U, 10 SATA 3.0 (6Gbps) ports with Intel® C612 controller, LAN options up to 2x 10GBase-T or 2 GbE ports, redundant Platinum Level high-efficiency (95%+) Digital power supplies, integrated IPMI 2.0 with KVM over dedicated LAN.
1U/2U/4U/Tower Mainstream SuperServer Solutions
1U/2U/4U/Tower Mainstream SuperServer Solutions Feature:
Entry-level or volume solutions for Enterprise IT, optimized to save significant amounts on CAPEX/OPEX. Supports dual or single Intel® Xeon® processor E5-2600/1600 v3 (up to 18 cores,145W TDP), up to 1TB of DDR4 2133MHz Reg. ECC in 16x DIMMs, 6x PCI-E (3x PCI-E 3.0 x8 in x16, 3x PCI-E 3.0 x8) slots, 10x SATA 3.0 (6Gbps) ports with Intel® C612 controller, LAN supports 2x 10GBase-T or 2x GbE ports and redundant Platinum Level high-efficiency (94%+) Digital power supplies.
2U/4U SuperStorage Features:
From low-latency SSD applications to the massive capacity needed for large media files, these systems support node based deployment strategies where CPU and HDD capacity scale together, or deployments can be expanded using JBODs for improved economy. Supports single Intel® Xeon® processor E5-2600/1600 v3 (up to 18 cores,145W TDP), up to 512GB of DDR4 2133MHz Reg. ECC in 8x DIMMs, 12x 3.5" Hot-swap SAS3 HDD Bays (SAS3 via onboard Avago Technologies 3008 to SAS3 backplane) (SSG-5028R-E1CR12L) or 36x 3.5" Hot-swap SAS3 HDD Bays (SAS3 via onboard Avago Technologies 3008 to SAS3 backplane); optional 2x rear 2.5" Hot-swap HDD Bays.
4U/Tower SuperWorkstations Feature:
Server grade SuperWorkstations support up to: 1TB of DDR4-2133MHz memory in 16 DIMM slots, 6x PCI-E 3.0 slots including 3x PCI-E 3.0 x16 slots for GPU/Intel® Xeon® Phi coprocessors, 8x ports of Avago Technologies 3008 SAS3 (12Gb/s) with software RAID, and dual GbE LAN ports. Workstations also feature 7.1 HD audio, 11 USB ports (6 USB 3.0), SLI, Thunderbolt 2.0 AoC, Hyper-Speed hardware acceleration, 7+ year product life cycle and 160W CPU support.
DP/UP Motherboards Feature:
X10 motherboards, the basis of Supermicro's Server Building Blocks are available in dual-processor (DP) and uni-processor (UP) server and SuperWorkstation configurations supporting the new Intel® Xeon® processor E5-2600/1600 v3 product family. DP/UP motherboards also feature advanced technologies including DDR4 2133MHz memory, hot-swap NVMe, 12Gb/s SAS3, 10GBase-T/10G SFP+/56Gbps FDR IB networking options, SATA Disk-on-Module (DOM), Thunderbolt 2.0 are offered in a variety of form factors, including ATX, E. ATX, E.E. ATX. (DP) X10DRC-T4+, X10DRC-LN4+, X10DRi-T4+, X10DRi-LN4+, X10DRi/-T, X10DRW-i/-iT, X10DDW-i, X10DDW-iN, X10DRG-Q, X10DRL-I, X10DAi, X10DAC, X10DAX; (UP) X10SRL-F, X10SRi-F, X10SRW-F, X10SRH-CF, C7X99-OCE.
Supermicro will also debut its new compact Internet-of-Things (IoT) Gateway.
SYS-E100-8Q Gateway Features:
4.1"x4" ultra-low power motherboard supporting Intel® Quark X1021 (2.2W TDP) SoC, onboard 512MB DDR3 ECC memory, 1x Micro SDHC up to 32GB, 2x Mini-PCI-E slots, 1x ZigBee module socket, TPM 1.2, 2x 10/100Mbps RJ45, 1x RS-232 via DB9, 1x RS485 via screw terminal interface, 2x USB 2.0 (device & host), 1x Analog Input 8 channel 12-bit and 1x DIO. This new compact low-power system is optimized for embedded applications such as Smart Building/Home Gateway, Retail store or Warehouse Hub and Smart Factory IoT Gateways
The new line up of X10 solutions that Supermicro has just released is very impressive. The new offerings feature the new generation X10 green computing solutions that maximize performance, density and efficiency with the latest Intel Xeon processors E5-2600/1600 v3 line.
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