Samsung forms 1nm development team, 'dream semiconductor process' aims mass production in 2029

Samsung Electronics has reportedly kicked off the development of its next-generation 1nm process node, something the South Korean giant calls the "dream semiconductor process".

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In a new report from Korean media outlet SEDaily and its industry sources, Samsung Electronics Semiconductor Research Institute recently started the development process of its 1nm process, with some of its researchers who worked on the development of its cutting-edge 2nm process node, were transferred to the new 1nm project, something it calls the "dream semiconductor process".

Samsung's next-gen 1nm process node aka the dream semiconductor process, requires totally new technologies that break the mold of existing designs, as well as the use of next-gen High-NA EUV lithography machines. Samsung is reportedly aiming to have its 1nm chips hitting mass production in 2029, still lagging behind TSMC.

TSMC recently announced it would be adding 16A technology -- or 1.6nm -- to sit between its existing 14A (1.4nm) and 2nm chips that will enter mass production in the second half of 2026. TSMC's new 2nm process node yields

• Read more: TSMC plans to set up 'Giga Fabs' in Taiwan as it speeds into 1nm chip production
• Read more: Samsung Foundry will tease its 1nm process node in July 2024, mass production in 2026

TSMC's bleeding-edge 1nm process node will be fabbed at the "Fab 25" facility, expected to produce new 12-inch wafers with 6 production lines. TSMC Is also reportedly planning to build new facilities for its upcoming 2nm and 1.4nm process nodes -- also in Tainan -- as Taiwan receives government incentives, helping the process along, as TSMC runs towards being a semiconductor-focused "Silicon Valley".