SK hynix preps 16-Hi HBM3E memory mass production in 2025, just before HBM4 makes its debut

SK hynix has begun preparations for the mass production of its new 16-Hi HBM3E memory, weeks after unveiling the world's first 48GB 16-Hi HBM3E memory at the SK AI Summit in Seoul.

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In a new report from ETNews, we're learning that SK hynix is now integrating new equipment for 16-Hi HBM3E memory production, and optimizing its existing facilities. Production tests have reportedly already begun, with supply of the new 16-Hi HBM3E memory expected to flow in 1H 2025.

An industry insider told ETNews: "It is the initial line preparation process for 16-layer HBM3E mass production. I understand that the results of the major process tests are also coming out well".

SK hynix expediting its new 16-Hi HBM3E memory before product development news reached the world is strange, but with news that NVIDIA CEO Jensen Huang called the SK hynix boss asking him to bring forward next-gen HBM4 memory by 6 months... it makes sense. HBM is the key part of AI GPUs, and without it... there are no AI GPUs... and NVIDIA can't have that happen, ever.

• Read more: SK hynix unveils the industry's first 16-Hi HBM3E: up to 48GB per stack
• Read more: SK hynix: most of its HBM for 2025 sold out, 16-Hi HBM4 coming in 2028
• Read more: JEDEC chills on next-gen HBM4 thickness: 16-Hi stacks with current bonding tech allowed

SK hynix is expected to use its 16-Hi stack with its next-gen HBM4 memory, so it will continue to dominate the AI memory market far into 2025, 2026, and beyond. NVIDIA's next-gen Rubin R100 AI GPU is expected to debut in 2025, rocking next-gen HBM4 memory.