Rambus Unveils New Innovations for Main Memory
Rambus Inc., one of the world's premier technology licensing companies specializing in high-speed memory architectures, today unveiled a set of innovations that can advance computing main memory beyond current DDR3 data rate limits to 3200Mbps. These innovations, available for licensing, build on Rambus' award-winning designs and include patented and patent pending technologies. Through this collection of innovations, designers can achieve higher memory data rates, higher effective throughput, better power efficiency and the increased capacity necessary for future computing applications.
"Product advancements in multi-core computing, virtualization and chip integration put ever-increasing demands on the memory sub-system, a key performance limiter in today's performance computing systems," said Craig Hampel, Rambus Fellow. "This collection of breakthrough innovations from Rambus allows for memory systems that are better suited for the bandwidth and workloads of these throughput-oriented multi-core processors, increasing the design and solution space for future main memory to enable a new generation of computing platforms."
The Rambus key innovations to advance the main memory roadmap include:
- FlexPhase Technology - introduced in the XDR memory architecture, can enable higher data rates compared to direct strobing technology used in DDR3;
- Near Ground Signaling - supports high performance at greatly reduced IO power, allowing operation at 0.5V while still maintaining robust signal integrity;
- FlexClocking Architecture - introduced in Rambus' Mobile Memory Initiative, reduces clocking power by eliminating the need for a DLL or PLL on the DRAM;
- Module Threading - increases memory efficiency and reduces DRAM core power, and when combined with Near Ground Signaling and FlexClocking technology, can cut total memory system power by over 40%;
- Dynamic Point-to-Point (DPP) - provides a path for capacity upgrades without compromising performance through robust point-to-point signaling.
Rambus licenses its broad portfolio of patented innovations for use in its leadership and industry-standard chip interface solutions, as well as industry defined interfaces.
Latest News Posts
- Kong: Skull Island director discusses possible Zelda movie
- Blizzard teams with Hasbro for Overwatch Nerf toy guns
- Ion Maiden delayed to 2019
- Hello Games on No Man's Sky launch: we shared too much info
- Shazam's first trailer injects fun, and color into the DCEU
- HELP With a Sniper.2 Z68 bios U1C, won't boot with discrete VGA
- Z97X-SLI doesn't recognize NVME-SSD
- Design a Colorful SSD contest
- NZXT Kraken M22 CPU Cooler Review
- Question about ASROCK 970 Extreme3 1.0
- Micron Launches Industry's First Enterprise SATA Solid State Drives Built on Leading 64-layer 3D NAND Technology
- Micron, Rambus, Northwest Logic and Avery Design to Deliver a Comprehensive GDDR6 Solution for Next-Generation Applications
- Toshiba Memory America Unveils UFS Devices Utilizing 64-Layer, 3D Flash Memory
- ASUS Announces GeForce GTX 1070 Ti Series Gaming Graphics Cards
- ASUS Announces ASUS Hangouts Meet Hardware Kit