For the first time ever, Toshiba is publicly demonstrating its new 64-layer BiCS memory at the Dell EMC World conference in Las Vegas.
To demo its third-generation 64-layer BiCS 3D TLC NAND flash technology, Toshiba outfitted a laptop with a prototype XG NVMe SSD with 1TB of BiCS memory to highlight the advantages its new memory brings to the enterprise and consumer storage markets. As Toshiba notes, the new third-gen BiCS flash memory leverages a 64-layer stacking process that offers 65% greater per-millimeter bit density than its 48-layer 256GB storage, offering maximum capacity combined with high-speeds and reliability.
Toshiba also announces that it plans to migrate all client, data center and enterprise SSDs to tap its next-gen 64-layer BiCS 3D NAND TLC memory to ensure optimum performance, capacity, and endurance. No official timeline was given for this migration, but one thing is clear: Toshiba is betting big on its BiCS flash.
"The future of SSDs is 3D," said Greg Wong, Founder and Principal Analyst of Forward Insights. "3D flash memory is enabling the production of higher capacity and more cost effective SSDs to better meet a variety of requirements across the consumer and enterprise spaces."
For more information, check the official press release.
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