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Intel's huge LGA 3647 socket teases Knights Landing

Knights Landing teased through a new image of Intel's upcoming LGA 3647 socket
By: Anthony Garreffa | CPU, APU & Chipsets News | Posted: Oct 6, 2016 4:41 am

Intel has something truly monstrous with its upcoming Knights Landing LGA 3647 socket, with Serve the Home teasing us with some pictures of the gigantic LGA 3647 socket.

 

 

The upcoming Knights Landing platform will support 6-channel DDR4 support, as well as no dual-latch system that is used on the LGA 2011 platform. Serve the Home explains that the socket and thermal designs that they have seen "do not have latching mechanisms", and instead they're seeing "solutions that secure the CPU to the heat sink".

 

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Here we have a comparison shot of Broadwell-EP, LGA 3657 (Knights Landing), and Broadwell-DE.

 

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STH had an Intel Xeon D (Broadwell-DE) BGA package next to the massive LGA 3674 socket, and it looks super small.

 

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The entire assembly is then guided into place by the socket pins, with screws flanking the heat sink to secure it in place. Supermicro's 2U4N solution's heat sink you can see above handles 200W TDP in a 1U high chassis.

 

These new monster LGA 3647 socket CPUs won't be for most desktop users, but for those who want impossible amounts of CPU cores and RAM - then the new Knights Landing platform should be at the top of your Christmas list.

NEWS SOURCES:Wccftech.com

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