PlayStation 6 will reportedly ditch the PS5's liquid metal cooling in favor of something else

Q: What does Sony's new patent describe as the core components of the PlayStation 6's proposed vaporization-based cooling system?

The patent describes a proprietary vaporization-based cooling solution built around advanced heat pipes with tapered sections to enhance efficiency and facilitate fluid or liquid cooling, combined with a more traditional water-like liquid that vaporizes for heat transfer. It is designed to work effectively in both horizontal and vertical orientations.

Q: How does the vaporization-based liquid cooling in the patent differ from the PS5's liquid metal solution?

The patent describes a vaporization-based system that uses advanced heat pipes with tapered sections and a more traditional, water-like liquid that vaporizes to carry heat, versus the PS5’s use of liquid metal as a thermal interface. Unlike liquid metal, the patented design is described as working effectively in both horizontal and vertical orientations and is intended to avoid the complex assembly and leak-related component damage that plagued the PS5’s liquid metal solution.

Q: Will the patented cooling design support both horizontal and vertical console orientations without the PS5's liquid metal risks?

According to the article, Sony's patent describes a vaporization-based liquid cooling system using advanced heat pipes with tapered sections that is designed to work effectively regardless of the console's orientation, supporting both horizontal and vertical use. The design is said to use a more traditional water-like liquid rather than liquid metal, which could mitigate the liquid metal assembly complexity and leak risks seen with the PS5.

Q: Does the patent indicate Sony plans to keep a rectangular form factor for the PlayStation 6?

Yes. The patent indicates Sony is considering a PlayStation 6 design and form factor that will retain the rectangular shape of both the PS4 and PS5 while supporting multiple orientations.

Sony has a new patent that suggests that the PlayStation 6 will adopt a custom vaporization-based liquid cooling solution, and not liquid metal.

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Kosta Andreadis

Senior Editor

Published Jul 16, 2026 12:33 AM CDT

1 minute & 15 seconds read time

TL;DR: A Sony patent suggests PlayStation 6 may replace PS5's liquid metal with a proprietary vaporization-style liquid cooling system using tapered heat pipes, aiming to work horizontally or vertically, preserve a rectangular form factor, improve efficiency and reduce liquid-metal leak and manufacturing risks, though it may not be final.

Voice: Kosta AndreadisSpeed

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When Sony announced that the PlayStation 5 would adopt liquid metal as part of its cooling solution, the consensus was positive: it's the sort of cutting-edge thermal solution you'd expect on a high-end piece of hardware. Unfortunately, the result wasn't entirely successful, with several instances of inconsistent heat transfer, overheating, and even leaks.

PlayStation 6 will reportedly ditch the PS5's liquid metal cooling in favor of something else 1

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Some of the blame for this has been attributed to those who kept their consoles in a vertical orientation, with Sony going so far as to make revisions to mitigate the risk of liquid metal issues with the PlayStation 5 Slim and Pro refreshes. According to a new patent and a new report over at Tech4Gamers, Sony is ditching liquid metal for a new advanced cooling system for the PlayStation 6 that will support both horizontal and vertical orientations.

The design appears to be a proprietary solution that includes advanced heat pipes with tapered sections to enhance efficiency and facilitate fluid or liquid cooling. It appears to be a vaporization-based cooling system with a more traditional, water-like liquid, and it's designed to work effectively regardless of the console's orientation.

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This also indicates that Sony is considering a PlayStation 6 design and form factor that will retain the rectangular shape of both the PS4 and PS5, while supporting multiple orientations. The new thermal solution could also mitigate risks in manufacturing the console, as liquid metal requires a complex assembly process, and any leaks often cause component damage that requires a full replacement.

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Question #1

What does Sony's new patent describe as the core components of the PlayStation 6's proposed vaporization-based cooling system?

Question #2

How does the vaporization-based liquid cooling in the patent differ from the PS5's liquid metal solution?

Question #3

Will the patented cooling design support both horizontal and vertical console orientations without the PS5's liquid metal risks?

Question #4

Does the patent indicate Sony plans to keep a rectangular form factor for the PlayStation 6?

Have a question not listed here? Ask below and TweakBot will answer it.

Of course, this patent might not end up being the cooling system for the PlayStation 6, but based on the listing, it certainly suggests it's at least one that has been tested and is in the running.