Apple iPhone 17 Pro leak teases vapor chamber with thin copper plate, promises cooler operation

Apple has some big changes for its upcoming iPhone 17 family of smartphones, with its higher-end iPhone 17 Pro leaked with a vapor chamber cooler and a thin copper plate, which will help with overheating, and more.

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The new iPhone 17 Pro smartphone will have a vapor chamber cooling system that should offer lower operating temperatures, providing smoother gaming under maximum load. Majin Bu has shared a fresh image of the purported vapor chamber cooling system inside of Apple's new iPhone 17 Pro, but we still don't know how the company will be implementing the technology.

Apple will be experiencing its first time using a dedicated thermal management for the iPhone, compared to competitors like Samsung and its higher-end Galaxy S25 Ultra smartphone which has had vapor chamber cooling technology for a number of years now. Vapor chamber coolers manage and dissipate heat inside of the devices more effectively than the likes of graphite sheets used on the iPhone 16 Pro.

Apple's current fleet of A-series processors are very power efficient and effective, but when they're put under heavy loads like editing and gaming, they get hot to touch. A subpar thermal solution can be a threat to the internals of a high-end smartphone, where they can overheat and throttle, reducing its peak performance. There's also the added concerns of lowering the battery life of the smartphone, and its longevity.

The use of a vapor chamber cooling system inside of the iPhone 17 Pro could be fantastic for editing and especially gaming, keeping the CPU and GPU clocks maxed out, instead of throttling and reducing performance. Apple's next-gen A19 Pro chip should stay cool and pump more performance than ever before, which I'm sure we're going to hear all about when the company unleashes its new iPhone 17 Pro.