TSMC plans next-gen A14 process node (1.4nm) production for 2028, while 1nm is expected in 2029

TSMC will have new 2nm production up and running later this year, while A14 (1.4nm) wafer production is expected in 2028, 1nm expected in 2029.

TSMC plans next-gen A14 process node (1.4nm) production for 2028, while 1nm is expected in 2029
Comment IconFacebook IconX IconReddit Icon
Gaming Editor
Published
2 minutes & 30 seconds read time

As an Amazon Associate, we earn from qualifying purchases. TweakTown may also earn commissions from other affiliate partners at no extra cost to you.

TL;DR: TSMC is set to begin high-volume production of its advanced N2 (2nm-class) process node with gate-all-around nanosheet transistors in late 2025, delivering up to 15% better performance or 30% lower power than previous nodes. This technology, powering AMD, Apple, and Intel products, enhances logic density and design flexibility.

TSMC says that it remains on track to begin high-volume production of next-gen chips on its new N2 (2nm-class) process node, the first production tech that uses gate-all-around (GAA) nanosheet transistors, in the second half of this year.

TSMC plans next-gen A14 process node (1.4nm) production for 2028, while 1nm is expected in 2029 406
3

The news was unveiled during TSMC's recent North American Technology Symposium 2025 event, with its new N2 node to power multiple products this year from AMD, Apple, and most recently, Intel.

TSMC's next-gen A14 process node, when compared against the upcoming N2 process, will have 15% more performance using the same power, or up to 30% power reduction at the same speed, along with over 20% more logic density. TSMC will be evolving its NanoFlex standard cell architecture to NanoFlex Pro, enabling greater performance, power efficiency, and design flexibility.

Not only can we expect TSMC's ultra-bleeding-edge N2 process node in 2028, but the Taiwanese semiconductor leader also debuted new logic, specialty, advanced packaging and 3D chip stacking technologies, all of which contribute to broad technology platforms in high-performance computing (HPC), smartphone, automotive, and Internet of Things (IoT) says TSMC.

TSMC Chairman and CEO Dr. C.C. Wei said: "Our customers constantly look to the future, and TSMC's technology leadership and manufacturing excellence provides them with a dependable roadmap for their innovations. TSMC's cutting-edge logic technologies like A14 are part of a comprehensive suite of solutions that connect the physical and digital worlds to unleash our customers' innovation for advancing the AI future".

TSMC plans next-gen A14 process node (1.4nm) production for 2028, while 1nm is expected in 2029 407
3

Kevin Zhang, senior vice president of business development and global sales and deputy COO at TSMC, said: "A14 is our full-node next generation advanced silicon technology. If you look at speed, enhancement [compared to N2] is up to 15%, power reduction is at 30%, logic density is 1.23x the overall chip density, or at least 1.2x [for mixed designs]. So, this is a very, very substantial technology".

Zhang added: "The technology also features our [...] NanoFlex Pro technology, [which is really] design technology co-optimization (DTCO) allowing designer to design their product at a very flexible fashion, allow them to achieve optimum power performance benefit. This technology is going into production by 2028. The first version of this technology does not have the backside power rail".