SK hynix HBM expansion: M10F fab re-purposing aims for up to 170,000 units per month in 2025

SK hynix has started its HBM expansion project, with its "M10F" semiconductor fab re-purposing now in operation, meaning it can make more HBM memory chips for the AI industry later this year.

In a new report from ETnews, we're learning that SK hynix has completed the re-purposing of its semiconductor fab known as "M10F" located in Icheon, South Korea. This semiconductor fab has had its existing DRAM packaging lines converted to an HBM packaging line.

An industry insider said: "They introduced and replaced some packaging equipment and modified the required materials to suit the new packing specifications. They obtained the necessary permits from the local fire department at the end of last month and have commenced mass production".

SK hynix's conversion of its DRAM packaging line to HBM means that its HBM production capacity is expected to expand significantly, from 120,000 units per month (based on wafer input) to 130,000 units per month. The HBM production capacity allocated to SK hynix's newly-converted M10F fab is estimated at around 10,000 units.

• Read more: SK hynix sold out of HBM for 2025, soon taking orders for 2026 supply of HBM
• Read more: SK hynix ships world's first 12-layer HBM4 samples, for Rubin R100 AI GPU
• Read more: SK hynix reports highest-ever yearly earnings for 2024, thanks to HBM and AI

Before the end of the year, SK hynix's HBM production capacity is expected to expand significantly, with its new M15X fab coming online by Q4 2025. This new fab will incorporate front-end and back-end process capabilities required for HBM production.

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SK hynix should have production capacity of HBM increased to 160,000 to 170,000 units per month, which is a large increase of 40,000 to 50,000 units per month compared to last year. SK hynix doesn't just have its newly-converted M10X fab site, but its new M15X fab site, and then the operational launch of its new M8 fab in the first half of 2026... so we should expect the HBM memory chip leader to only expand upwards from here.