RAM - Page 7

GIGABYTE has just set a new DDR5 memory OC world record using its Z890 AORUS Tachyon ICE motherboard, with in-house overclocker "HiCookie" hitting 13,034 MT/s speeds.

As it stands, GIGABYTE is enjoying the top three positions for DDR5 OC memory speed records using its Z890 AORUS Tachyon ICE motherboard, where it was just last month that the motherboard spilled over the 13,000 MT/s barrier, and now it's done it again with 13,034 MT/s.

GIGABYTE's in-house overclocking legend, HiCookie, is behind the feat, using an Intel Core Ultra 9 285K processor installed onto a Z890 AORUS Tachyon ICE motherboard. The CPU had its E-Cores disabled, and was using just a single 24GB module of ADATA's XPG Lancer RGB DDR5 memory.

KLEVV's URBANE V RGB DDR5 Gaming OC memory not only launched with a futuristic and stylish all-white aesthetic, but with low-latency speeds of up to 8400 MT/s while running cool. In our review from earlier this year, regardless of the voltage applied, temperatures never rose above 43°C. Pair solid performance, fast speeds, tight timings, and a robust 'limited lifetime warranty', and it's no wonder the 32GB kit we reviewed earned an Editor's Choice award.

Although white PC gaming hardware is becoming increasingly popular and a go-to aesthetic for many gamers, black remains the preferred choice for many enthusiasts. And with that, it's great to see that KLEVV has finally launched a Jet Black Edition for its URBANE V RGB DDR5 Gaming OC memory. At launch, the only option was Brilliant White, with KLEVV adding black to broaden the number of builds URBANE V RGB kits can seamlessly slot into.

This is strictly a secondary color option, as you've got the same 2mm-thick aluminum heatsink, the stylish futuristic look with RGB "dual-beam" light bar, and low-profile height of 42.5mm. And yes, it remains one of the best-looking DDR5 memory kits in 'Jet Black' and one of the best-performing.

Micron has announced that it is sampling its new 192GB SOCAMM2 memory module to customers, ready for broader adoption of low-power memory for AI data centers.

The new 192GB SOCAMM2 memory module uses Micron's most advanced 1-gamma DRAM process technology which provides over a 20% improvement in power efficiency, which the company says further enables power design optimization in large data center clusters. These savings can become quite significant in full-rack AI installations, where there can be over 40TB of CPU-attached low-power DRAM main memory.

The modular design of SOCAMM2 memory improves serviceability and lays the groundwork for future capacity expansion. Micron is building on a large 5-year collaboration with NVIDIA, with Micron pioneering the use of low-power server memory inside data centers. SOCAMM2 includes the inherent advantages of LPDDR5X memory, with exceptionally low power consumption and high bandwidth, to the main memory of AI systems.

Synopsys has just announced a big milestone in its development of next-gen mobile memory, with the company unveiling the silicon bring-up of its LPDDR6 IP based on TSMC's bleeding-edge N2P process node.

The silicon bring-up stage of development is when the first power-on of a new chip happens, and in this case, it's an IP block. This involves testing a particular product in multiple stages, including hardware checks, power sequencing, and more. Synopsys has successfully developed a licensable building block of next-gen LPDDR6 memory technology, with bandwidth of up to 86GB/sec, aligning with JEDEC standards.

This is also one of the first times integrating TSMC's new N2P process node into an LPDDR6 IP block, with the IP block featuring two main components: the controller, and the PHY interface onboard. The controller works on the JEDEC protocol engine, joined with timing control and low-power states. TSMC's new N2P node will feature PHY analog and I/O circuits built on it, with N2P metal stacks and N2P I/O libraries.

G.SKILL has announced that its team has pushed its DDR5 memory up to a MemTest stable 10,600 MT/s speeds, using the AMD Ryzen 5 8500G processor and based B850M motherboard from ASUS.

In a new post on X, G.SKILL announced its EXPO-rated DDR5-6000 CL26 48GB kit (2 x 24GB sticks) was used on an ASUS B850M AYW Gaming OC motherboard and AMD Ryzen 5 8500G processor, with the RAM overclocked to an insane 10,600 MT/s.

Interestingly, the ASUS B850M AYW Gaming OC motherboard is a mid-range motherboard that the company designed with overclocking in mind, but it's not in many markets yet. The test involved using standard cooling, no CPU configuration tweaks, and dual DIMMs... normally for overclocking records on RAM, the CPU core configuration is changed, LN2 cooling is used, and a single DIMM is deployed. Not for this new stable record.

The massive DDR5-13000 memory frequency wall has been breached, with an overclocker using Corsair Vengeance DDR5 RAM pushed to 13,010 MT/s setting a new world record.

In a benchmark session from professional overclocker "SaltyCroissant" who used Corsair Vengeance DDR5 RAM on a GIGABYTE Z890 AORUS Tachyon ICE motherboard, overclocked it to over 13,000 MT/s... 13,010 MT/s to be precise, the first to hit that new peak frequency.

HWBot has the results, which were also verified by CPU-Z, with a DDR5 frequency of 6504.0MHz, with an effective data rate of 13,010 MT/s. We have been getting close to the 13,000 mark for a few months now, with lots of new incremental DDR5 overclocked frequencies broken, but now the mountain of 13,000+ has been reached.

US-based memory manufacturer Origin Code has just unveiled its new VORTEX DDR5 memory modules, with a high-capacity 256GB kit that features an active triple-fan cooler. Check it out:

Origin Code says its new VORTEX DDR5 memory redefines what high-end memory can be by infusing cutting-edge features with a sleek design, a breakthrough in thermal management, and a "fresh approach" to how components work together inside of today's most powerful systems. The company has its new VORTEX DDR5 memory available in four different flavors:

The DDR5 memory OC frequency world record has been broken yet again, with overclocker "SaltyCroissant" reaching over an incredible 13,000 MT/s on the GIGABYTE Z890 AORUS Tachyon ICE motherboard.

The Canadian overclocker used Corsair DDR5 Vengeance memory and an Intel Core Ultra 7 265K processor, with the new DDR5 RAM OC world record having other renowned overclockers like GIGABYTE's HiCookie, Corsair's Sofo, and Splave involved in the new record.

The entire top part of the GIGABYTE Z890 AORUS Tachyon ICE motherboard -- including the CPU socket and DDR5 DIMM slots -- were put under dedicated LN2 pots. The overclockers specifically chose the GIGABYTE Z890 AORUS Tachyon ICE motherboard as it's an overclocking board ready with just two DDR5 DIMM slots, with the motherboard previously used to reach a record DDR5 OC to 12,726 MT/s earlier this year.

We finally have RAM with a built-in OLED display thanks to v-color introducing its new XFinity+ DDR5 memory kits with OLED displays, available in various capacities and for both AMD and Intel platforms. Check it out:

V-color's new XFinity+ is the world's first DDR5 memory module that rocks a built-in display, debuting earlier this year at Computex 2025. The introduction of the new XFinity+ DDR5 memory from v-color marks a "major leap forward in visibility, system diagnostics, and personalization at the module level" says the company.

XFinity+ is the result of close collaboration between v-color and the GIGABYTE engineering team, ready for speeds of up to DDR5-9066 on both AMD and Intel platforms. The company used an Intel Core Ultra 5 245K processor inside of a GIGABYTE Z890 AORUS MASTER motherboard, using 48GB of CU-DIMM (2 x 24GB sticks) with speeds of up to 9068 MT/s with 1.4V.

32GB is becoming the new 16GB when it comes to the amount of memory that Steam gamers have inside their PCs.

Of course, for a long time, 16GB was seen as a sufficient amount of system RAM for gaming, but those times have changed, and now anyone building a new rig to enjoy big-name PC games equips it with 32GB (or even more, perhaps).

That's now being reflected in the Steam hardware survey, and as Tom's Hardware points out, there's a shift underway towards a 32GB RAM loadout - meaning this is likely to be the most popular memory configuration before too long.

When it comes to storage and memory technology, newer and faster technologies are often more expensive than older and slower ones. When it comes to PC building, selecting a motherboard, CPU, and memory combo that is one or two generations behind the current cutting-edge standard can be a great way to save money, while also achieving bang-for-your-buck performance.

However, as we reported a month ago, DDR4 and GDDR6 memory pricing are increasing because these end-of-life products are facing supply issues due to shifting production priorities to DDR5 and GDDR7. As highlighted in a recent report by Digitimes (via Tom's Hardware), the pricing for DDR4 memory kits is now more expensive than that of their newer and faster DDR5 counterparts.

Although it makes sense for companies like Samsung, SK hynix, and Micron to wind down DDR4 production as DDR5 becomes the standard, one of the key reasons for the price increases is the insatiable demand from the AI market, leading to a situation where DDR4 demand far exceeds supply.

Samsung is losing its grip on the DRAM market as SK Hynix continues to eat away at what was once a completely Samsung-dominated sector of the industry.

A new report from Korean media has claimed SK Hynix has now stolen away the DRAM crown from Samsung, a position the company held strongly for approximately 10 years. What has SK Hynix done to achieve this newfound success? HBM technologies are the driving factor behind SK Hynix climbing to the top of the DRAM market, with the company positioning itself to become the first option for any HBM needs.

Reports indicate that Samsung has experienced the most significant drop in market share since the company began sharing its records in 1999, with the Korean giant dropping from 41.5% to 32.7%.

SK hynix has officially dethroned Samsung as the biggest memory chip supplier in the world for the first time ever, with SK hynix posting slightly higher memory sales for Q2 2025.

In a new report from Counterpoint picked up by insider @DanNystedt on X, we see that SK hynix memory chip sales reached $15.1 billion for Q2 2025, edging out Samsung and taking more of the ever-important HBM memory chip market share. SK hynix now has 62% of the HBM chip market supply, Samsung's share fell to 17% in Q2 2025, while US-based Micron holds on stronger than Samsung with 21% HBM chip supply.

SK hynix also outperformed Samsung with memory operating profit, with Counterpoint's analysis showing that the operating profits of the South Korean firms have taken divergent paths since the first half of 2024. SK hynix has formed itself into a key partner of HBM for NVIDIA, and has been recording rising operating profits since, while Samsung's operating profits have been falling as the company trips over itself in getting its HBM into the hands of AI chip makers.

TEAMGROUP has just announced the launch of its new ultra-capacity 256GB DDR5 memory kits (4 x 64GB) under its gaming brand T-FORCE and creator brand T-CREATE.

TEAMGROUP closely collaborated with leading motherboard manufacturers and validated on AMD's latest X870 platform, with the new ultra-capacity 256GB memory kits providing stable and high-efficiency upgrade paths for users who want the "perfect balance between speed and capacity".

The TEAMGROUP T-FORCE LAB continues to strengthen its high-performance gaming memory portfolio with the launch of the new T-FORCE DELTA RGB DDR5-6000 CL32 256GB (4 x 64GB) quad-channel kit, which has been designed to reinforce the brand's leadership in the high-end gaming market.

NVIDIA is reportedly acquiring hundreds of thousands of LPDDR-based SOCAMM memory that it'll use in future AI PC products, with demand for next-gen SOCAMM 2 memory expected to boom in the years ahead.

At its recent GTC (GPU Technology Conference) event earlier this year, the company showcased SOCAMM memory because of its superior performance and lower power consumption for AI products, with NVIDIA's new GB300 AI platform using SOCAMM memory developed by Micron. SOCAMM is very different to HBM and LPDDR5X memory used on current AI products including servers and mobile platforms.

SOCAMM memory is based on LPDDR DRAM, which is traditionally used inside of mobile and low-power devices, but SOCAMM memory is upgradable, unlike HBM and LPDDR5X memory. SOCAMM is not soldered onto the PCB, and can be secured by just three screws.

G.SKILL and ASUS have broken the DDR5 memory OC world record, with overclocker bl4ckdot pushing G.SKILL Trident Z5 DDR5 RAM up to a huge 12872MT/s on an ASUS ROG Maximus Z890 Apex motherboard.

It was only a couple of months ago in May 2025 that overclocker "bl4ckdot" hit a record at the time with 12774MT/s, but now the overclocker is back with another world record, hitting 12872MT/s. The overclocker holds his world record for the highest DDR5 memory speed once again, using Intel Core Ultra 9 285K processor and ASUS ROG Maximus Z890 Apex motherboard, a combo used multiple times for DDR5 memory speed world records.

LN2 cooling was used to chill the system down, with bl4ckdot using G.SKILL Trident Z5 DDR5 memory at 12872MT/s (6431.1MHz) and cache latencies of CL68-127-127-127-2. HWBOT now lists bl4ckdot at the top, with overclocker "saltycroissant" in second place, with both of the overclockers being the only two to have broken through the 6400MHz barrier on HWBOT's Memory Frequency Hall of Fame.

As far as overclocked DDR5 desktop memory goes, DDR5-6000 is widely seen as the new sweet spot offering excellent speed and performance for both AMD and Intel CPU owners. As far as capacity goes, 32GB or 64GB kits are what you'd find in most places, with very few options pushing capacities higher than that.

This makes G.SKILL's latest announcement the sort of headline that will prompt a double-take: two new ultra-high overclocked DDR5 memory kits - DDR5-6000 CL32 256GB (64 GB x 4) and DDR5-6400 CL36 128GB (64 GB x 2) memory kits.

Yes, 256GB of fast G.SKILL DDR5 memory sounds very impressive; however, the company notes that these kits are primarily intended for content creators, high-performance computing, and AI applications where system memory makes a significant difference in the sorts of workloads a rig is capable of running.

JEDEC has just announced the publication of its new LPDDR6 memory standard dubbed "JESD209-6" which has been designed to boost memory speeds and efficiency, for the future of mobile devices and AI.

The new LPDDR6 memory standard represents a significant advancement in memory technology, increasing performance, power efficiency, and security. In order to enable AI applications and other high-performance workloads, the new LPDDR6 standard uses a dual sub-channel architecture that allows for flexible operation while maintaining a small access granularity of 32 bytes.

Mian Quddus, JEDEC's Chairman of the Board of Directors, explains: "JEDEC is proud to introduce LPDDR6, the culmination of years of dedicated effort by members of the JC-42.6 Subcommittee for Low Power Memories. By delivering a balance of power efficiency, robust security options and high performance, LPDDR6 is an ideal choice for next-generation mobile devices, AI and related applications to thrive in a power-conscious, high-performance world".

The assumption that older PC technology becomes cheaper once newer technology arrives is quickly becoming a thing of the past, as prices for DDR4 and GDDR6 memory are set to skyrocket by up to 43% in the third quarter of 2025, which is right around the corner. The news arrives via TrendForce, which has posted a new report covering its findings on the three major DRAM suppliers.

When it comes to DDR4 and mobile LPDDR4X memory, the reason for the sharp increase in pricing is that these products are nearing the end of their life cycle (EOL) as companies transition to next-generation DDR5 technology. This means that the continued demand for older DDR4 technology, alongside "potential hikes in US import tariffs," may see DDR4 pricing increase by 38 to 43% with LPDDR4X pricing increasing by up to 23 to 28% for the PC market.

The growing demand for the newer DDR5 memory technology will also lead to an increase in pricing in the third quarter, but by a significantly lower amount, ranging from 3 to 8% for the consumer market. And with NVIDIA's latest generation of GeForce RTX 50 Series GPUs shifting to cutting-edge GDDR7 memory, the shift in production capacity for the newer technology also means that GDDR6 memory is in short supply.

G.SKILL has been working closely with the ASUS ROG team to find the overclocking potential of the new DDR5 CAMM2 memory form factor, reaching a new milestone of DDR5-10000 speeds.

The company used a large 64GB capacity CAMM2 memory module on a modified custom ASUS ROG Maximus Z890 HERO CAMM2 motherboard and Intel Core Ultra 7 265K processor. G.SKILL pushed its 64GB CAMM2 memory module to DDR5-10000 CL52 and ran Memtest to 100% coverage, without a problem, creating a new overclocking milestone for the CAMM2 memory standard.

Better yet, the 64GB CAMM2 memory module from G.SKILL didn't require any cooling whatsoever. In fact, it didn't even have a heatsink, which you can see in the shot below. That's mighty impressive, DDR5-10000 speeds without a heatsink or any active cooling. Now I want to see what it can do with some active cooling.