Toshiba today revealed the world's thinnest NVMe SSD designed to power the next-generation of tablets, laptops, and mobile IoT devices.
Toshiba's new BG3 line of NVMe SSDs incorporates its high-end BiCS Flash 3D NAND memory into a miniature, sleek DRAM-less package with built-in HMB technology, combining power efficiency with the speed of PCIe Gen3 x2. Tapping the PCIe Gen3 x2 interface and NVMe architecture the new BG3 drives can deliver reads of up to 1520 MB/sec--up to 2.7 times SATA 6Gbit/sec speeds--and writes of up to 840 MB/sec, providing mighty performance in a small 1.3mm-high SSD.
The ultra-slim BG3 series of SSDs is available in 128GB, 256GB and 512GB capacities, and are all available in surface-mount BGA (M.2 1620) or removable M.2230 module form factors.
"With style and portability top of mind for today's laptop and tablet manufacturers, the BG3 series was designed specifically to enable even slimmer and more power efficient devices.
"By eliminating DRAM from its design, Toshiba's BG3 series offers the world's thinnest SSDs available at just 1.3mm high and delivers lower power consumption to maximize battery life."
"Toshiba's third generation BG SSDs were designed to not spark, but fuel a revolution in mobile and IoT computing," said Jeremy Werner, vice president SSD marketing and product planning at Toshiba America Electronic Components, Inc.
"The BG3 series is not only smaller and lighter, but smarter thanks to its cost-effective DRAM-less design with HMB technology combined with Toshiba 64-layer 3D flash memory with TLC technology. These SSDs enable OEMs to reimagine what's possible for their customers."
The BG3 series is currently sampling to clients and will be shown off at the Flash Memory Summit 2017 from August 8-10 in Booth #407.
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