Intel has provided more details on its second-generation Xeon Phi co-processor at the annual SC conference, with the new Knights Landing beast nearly ready to be shipped.
The company has said they've already sent out various pre-production systems to clients through its early ship program, with Cray enjoying the new Xeon Phi co-processor, with it handling multiple customer applications in preparation for supercomputer deployments at Los Alamos and NERSC. Intel has said that the new Knights Landing chip has various innovative features that provide unmatched performance.
For example, Xeon Phi co-processor powered systems will be capable of delivering single-precision performance that is over 8TFlops with double-precision performance sitting at around 3TFlops. Inside, the Xeon Phi co-processor features 16GB of stacked memory that Intel says has 5x the bandwidth of DDR5, and is also 5x more power efficient and 3x denser than GDDR5 that is used on today's video cards.
Intel will be launching the new Xeon Phi co-processors in Q1 2016.
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