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Samsung starts mass production of industry's first 3D TSV-based DDR4

Samsung becomes the industry's first to begin manufacture of the new 3D TSV technology 64 GB DDR4 memory modules

William Harmon | Aug 26, 2014 at 11:38 pm CDT (1 min, 18 secs time to read)

Samsung just announced today that they have begun mass production of the industry's first 3D TSV technology based DDR4 modules for enterprise related products. Samsung has said: "announcing that we have begun mass producing the industry's first 64GB DDR4 RDIMMs that use 3D 'through silicon via' (TSV) package technology. The new 64GB TSV module performs twice as fast as a 64GB module that uses wire bonding packaging, while consuming approximately half the power."

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"Samsung's volume production of 3D TSV modules marks a new milestone in the history of memory technology, following the company's initial production of 3D Vertical NAND (V-NAND) flash memory last year. While 3D V-NAND technology embraces high-rise vertical structures of cell arrays inside a monolithic die, 3D TSV is an innovative packaging technology that vertically interconnects stacked dies. With its introduction of the new TSV modules, Samsung has further strengthened its technological leadership in the '3D memory' era. Samsung has worked on improving 3D TSV technology since it developed 40nm-class* 8GB DRAM RDIMMs in 2010 and 30nm-class* 32GB DRAM RDIMMs in 2011 using 3D TSV. This year, Samsung started operating a new manufacturing system dedicated to TSV packaging, for mass producing the new server modules."

Samsung starts mass production of industry's first 3D TSV-based DDR4 02 | TweakTown.com

In order for Samsung to build these 3D TSV modules, the dies are ground down to a few dozen micrometers, and then pierced to contain hundreds of fine holes. Electrodes passing through the holes allow them to be vertically connected and stacked. In the future Samsung believes they will be able to stack more than four dies using 3D TSV technology.

Last updated: Apr 7, 2020 at 11:47 am CDT

William Harmon

ABOUT THE AUTHOR - William Harmon

William Harmon started working with computers back in 2005 and began overclocking all kinds of different setups. My focus back then and even now is extreme cooling using Single Stage Phase units, Cascades and Liquid Nitrogen. During this time I was also in several competitions that GIGABYTE had sponsored, GOOC 2009 and 2010. Using technics in overclocking and cooling that I have learned over the years I started building high speed workstations and servers for clients who needed higher performing systems. Many of these systems are used in high frequency trader companies and work stations used in all kinds of professions. At TweakTown, I provide and develop accurate test and benchmark methods for servers and other equipment to help make purchasing decisions easier.

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