KIOXIA's groundbreaking LC9 Series 245TB NVMe SSD wins 'Best of Show' at FMS 2025

KIOXIA's new LC9 Series offers the industry's first 245.76 TB NVMe SSD built for the enterprise data center market and the AI era. With PCIe 5.0 speeds and KIOXIA's advanced 8th Gen BiCS FLASH with CBA (CMOS directly Bonded to Array) technology delivering density, performance, and power efficiency, nearly 250 TB of storage capacity in 2.5-inch and Enterprise and Datacenter Standard Form Factors (EDSFF) is an impressive achievement.

2

At the FMS: the Future of Memory and Storage event this week, KIOXIA showcased its new high-capacity LC9 Series SSD with a live demonstration as part of a Dell PowerEdge 7715 system. And with attendees getting to see the SSD in action, the KIOXIA LC9 Series 245.76 TB enterprise SSD won the 'Best of Show' award in the 'SSD Technology' category.

With sequential read speeds of up to 12,000 MB/sec and sequential write speeds of up to 3,000 MB/sec, it's a storage solution designed to meet the demands of cutting-edge generative AI systems head-on thanks to its speed and low power consumption. In addition to winning a 'Best of Show' award, KIOXIA has confirmed that it's now sampling KIOXIA LC9 Series SSDs to select customers.

"When customers evaluate SSDs, important consideration is given to storage that scales to high capacities while delivering high performance and low power consumption," said Jay Kramer, Chair of the Awards Program and President of Network Storage Advisors Inc. "We are proud to recognize KIOXIA for its BiCS FLASH 3D flash memory and KIOXIA LC9 Series SSD. This solution is enabled by their CBA (CMOS directly Bonded to Array) technology and the innovation of a 32-die stacked architecture in a package - delivering the capacity, power, and density required for transformational SSDs. Creating the highest capacity PCIe 5.0 enterprise SSD is a remarkable achievement and a clear reflection of KIOXIA's leadership position."

KIOXIA notes that being able to deliver high-speed 245.76 TB in a compact, low-power form was due to the efforts of its engineering team, advanced wafer processing, design, and "wire bonding technologies" delivering 8TB in a small 154 BGA package.

"Achieving multiple industry firsts with the KIOXIA LC9 Series reflects the depth of innovation across our engineering, manufacturing, and design teams," said Scott Nelson, Executive Vice President and Chief Marketing Officer for KIOXIA America, Inc. "As AI workloads grow more demanding, we're committed to delivering the flash memory technologies that will power the data infrastructure of tomorrow and accelerate progress across industries."