Samsung reportedly completes basic design of second-gen 2nm GAA process, ready for Exynos 2700

Samsung Foundry hasn't been having the greatest time with its semiconductor business, but the company has reportedly completed the basic design of its 2nd generation 2nm (SF2P) process node, and has begun promotions trying to secure customers for its new 2nm GAA process node.

In a new report picked up by insider @Jukanlosreve, we're hearing that Samsung's next-gen AI computing chiplet platform is getting ready, where we heard last year that Samsung would be developing with ADTechnology, Arm, and South Korea-based Rebellions, adopting the new SF2P process node. This marks the first application beyond the internal customer, System LSI's next-gen mobile AP.

Industry sources have said that Samsung Electronics Foundry and Design House (DSP) companies have recently started full-scale promotions for its in-house SF2P process. SF2P is Samsung Electronics' 2nd generation 2nm process, aiming for mass production in 2026.

When compared against their 1st generation 2nm (SF2) process, which is expected for mass production in the second half of 2025, the new SF2P has up to 12% more performance, a 25% reduction in power consumption, and an 8% smaller area.

• Read more: Samsung delays bleeding-edge 1.4nm node, puts its semiconductor eggs into its 2nm process

An industry official explains: "As the underlying technologies for the SF2P process are in place, Samsung Electronics and DSP companies have recently begun taking on SF2P process orders. Most customers looking to design 2nm chips with Samsung Electronics this year will likely use the SF2P process".