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ASRock Fatal1ty X99 (Intel X99) Professional Motherboard Review

By: Steven Bassiri | Socket LGA 2011 in Motherboards | Posted: Apr 30, 2015 2:08 pm
TweakTown Rating: 92%Manufacturer: ASRock

Temperature and Power Consumption

 

System power usage is measured at the AC/DC PSU (the Corsair AX1200i) which I have connected to another system to measure the test system and as a backup I have a wall meter to verify. The CPU power is measured through the 8-pin connect which is hooked up to a hall effect IC which measures current and puts out a voltage in proportion to the current. That voltage is logged by a National Instruments ADC which logs the DC voltage level, which I then convert into current.

 

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Note on Thermal Images: In the temperature section, we use our Seek thermal imaging camera to capture the surface temperatures of major components on the board; I look at the VRM and then all other things that light up the screen. If there is something to worry about then I will state it, otherwise I will just show the hotter running parts of the board for fun. Unless some component is over 80-90C then there really isn't anything to worry about.

 

All systems will act differently, so I will look for commonalities, such as how far from the VRM the heat spreads through the PCB and the difference in temperature between the front side and backside of the PCB. Keep in mind that the majority of the heat from the VRM goes into the PCB as it is a giant soldered on copper heat sink. A smaller difference in temperature between the back and front of the PCB points towards a more effective heat sink.

 

Thermal Testing at Stock Speeds:

 

The image on the left is always at idle and the image on the right is at load.

 

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Full frontal.

 

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Up-close of the front of the VRM.

 

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Up-close of the back of the VRM.

 

 

Thermal Testing at 4.5GHz Overclocked Speeds:

 

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Full frontal.

 

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Up-close of the front of the VRM.

 

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Up-close of the back of the VRM.

 

The VRM on the Fatal1ty X99 Professional is built for overclocking. Its 12 phases do an excellent job of providing adequate power during overclocked scenarios. Furthermore, the heat sink does an excellent job of keeping the heat away from the backside of the PCB. Even though there are backside MOSFETs, the temperature on the back of the PCB is almost always lower than the front side, indicating that the heat sink is working.

 

Temperatures never exceeded 50C, which indicates excellent thermal performance, even with a 300W 4.5GHz 5960X CPU load.

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