On the back of its major QLC 3D NAND flash breakthrough, Toshiba today announced yet another milestone with the world's first 3D NAND flash memory powered by TSV technology.
Toshiba will leverage TSV (Through Silicon Via) technology to further boost data transfers and lower power consumption of its 3D BiCS VNAND TLC flash memory line. TSV's highly efficient vertical-based technology aligns with the stacked flash memory dies of Toshiba's BiCS flash line. In fact, the Japanese storage titan assets that TSV allows up to 200% more power efficiency of BiCS flash memory outfitted with traditional wire-bonding architecture.
The Tokyo-based company notes that TSV BiCS flash will enabled 1TB storage devices with 16-die stacked architecture in a single package.
Viking Technology has just announced their new Silo Sold State Drive, with two new SSDs arriving in both 25TB and 50TB capacities. 50TB is a new world record for the industry's highest capacity SSD, with the UHC-Silo SSD able to hold years worth of data for high-end datacenter deployment.
The new drives are built with energy efficiency in mind, with idle power consumption of less than 10W, and active power consumption of only 16W... not too damn bad for 50TB of SSD. Viking Technology adds that by increasing the overall storage capacity per rack, while decreasing the power required per TB. Viking's new UHC-Silo SSD will have datacenter customers saving in power, space, and cooling by up to 80% per terabyte.
Jim Handy from Objective Analysis explained: "Some system administrators are looking for a way to extend the useful life of existing hardware, since it may function perfectly but support too little overall capacity,. With ultra-high-capacity SSDs, not only can they reach beyond the capacity limits of enterprise HDDs, they can also cut power and improve performance without having to replace the entire system, by implementing a simple media change".
Hamid Shokrgozar, President of Viking Technology, explains the move to their new UHC-Silo SSDs: "There is no higher capacity SSD solution available today than the UHC-Silo SSD. These drives enable datacenter administrators to easily migrate to SSD performance, along with a tremendous increase in capacity. With space and cooling being critical drivers for todays datacenters, these advantages are a game changer".
Sledgehammer Games' new boots on the ground WWII shooter won't make the jump to Nintendo's new Switch handheld console hybrid, the developers have confirmed.
Although the Nintendo Switch has incredibly strong demand, and Nintendo expects to have a 12.74 million console install base by March 2018, some major AAA publishers aren't ready to bring their biggest properties to the handheld-console combo. Activision's Call of Duty WWII is one such game. The developers at Sledgehammer Games have officially confirmed the shooter won't arrive on the Nintendo Switch, shooting down hopeful speculation.
Last month Sledgehammer Games exec Michael Condry said that it wasn't really the studio's decision, and that "Activision business guys" would be the ones to ask. As it turns out, Activision isn't ready to take that risk just yet, especially due to the Nintendo Switch's constrained supply shortage, which is expected to last throughout 2017.
Toshiba today announced its new high-end BiCS flash memory built on QLC technology (quadruple-level cell), offering a 50% increase in per-package capacity up to 1.5TB.
Toshiba's new third-generation QLC BiCS flash is the world's first 3D NAND memory built on 4-bit-per-cell technology, enabling capacities of 96GB, the largest the memory industry offers to date. Toshiba affirms that QLC BiCS flash can be stacked in 16 dies per package, enabling up to 1.5TB of storage capacity in a single package.
Forward Insights analyst Greg Wong assets that Toshiba's new QLC flash will be tremendously beneficial for datacenters."The introduction of QLC technology sets the stage for solving many of the challenges facing datacenters today," noted Greg Wong, founder and principal analyst at Forward Insights.
Computex 2017 - Toshiba today revealed its new premium high-end XG5 solid state drive that leverages its innovative BiCS 3D flash memory for improved reliability, speeds, and capacities.
Toshiba breaks through new barriers and ushers in a new age of storage proficiency with its new XG5 NVMe SSD, the company's first SSD that uses its third-generation 64-layer BiCS 3D flash memory with 512Gb dies built with the 15nm process. Armed with 64-layer BiCS flash, the Toshiba XG5 NVMe solid state drive can hit blazing fast sequential read write speeds of 3,000 MB/sec (3GB/sec) reads and 2,100 MB/sec (2.1GB/sec) writes.
The XG5 SSD is a single-sided M.2 form factor drive that comes in capacities up to 1TB thanks to its vertically-stacked flash memory, and sports increased reliability with a Mean Time to Failure rating of 1.5 million hours. Toshiba's new high-performance SSDs will be available in the XG5 Series line, which includes drives in three capacities on matching M.2280 form factors: 256GB, 512GB, and 1024GB.
Computex 2017 - Western Digital announces two new high-end solid state drives aimed at enthusiasts and gamers.
Western Digital has revealed the world's first consumer 64-layer 3D NAND SSDs: the WD Blue 3D NAND SATA SSD, which targets DIY enthusiasts, resellers and system builders, and the SanDisk Ultra 3D SSD, which targets high-end gamers. Both premium-grade SSDs rock blazing fast speeds of up to 560 MB/sec reads and 530 MB/sec write speeds, and feature higher efficiency, reliability, and capacities thanks to the company's new 64-layer 3D NAND technology.
The WD Blue 3D NAND SATA SSDs come in 250GB, 500GB, 1TB and 2TB capacities and leverage two form factors: 2.5-inch cased drives as well as single-sided M.2 2280. The SanDisk Ultra 3D comes in similar capacities of 250GB, 500GB, 1TB and 2TB but are exclusively available in 2.5-inch cased drives.
For the first time ever, Toshiba is publicly demonstrating its new 64-layer BiCS memory at the Dell EMC World conference in Las Vegas.
To demo its third-generation 64-layer BiCS 3D TLC NAND flash technology, Toshiba outfitted a laptop with a prototype XG NVMe SSD with 1TB of BiCS memory to highlight the advantages its new memory brings to the enterprise and consumer storage markets. As Toshiba notes, the new third-gen BiCS flash memory leverages a 64-layer stacking process that offers 65% greater per-millimeter bit density than its 48-layer 256GB storage, offering maximum capacity combined with high-speeds and reliability.
Toshiba also announces that it plans to migrate all client, data center and enterprise SSDs to tap its next-gen 64-layer BiCS 3D NAND TLC memory to ensure optimum performance, capacity, and endurance. No official timeline was given for this migration, but one thing is clear: Toshiba is betting big on its BiCS flash.
We can expect GIGABYTE to unveil a new AORUS-branded M.2 Thermal Guard, a new M.2 heatspreader for your M.2 SSD - and hopefully, on your GIGABYTE/AORUS motherboard.
MSI recently released their own M.2 Shield, a M.2 SSD heatspreader that wasn't as well received as they probably thought - as most people didn't report that it made their M.2 operate any cooler. Hopefully GIGABYTE does things differently with their upcoming AORUS M.2 Thermal Guard, and I'm sure we'll see a new high-end motherboard unveiled at Computex - most likely on Intel's next-gen X299 chipset, something they're expected to unveil on May 30.
Micron's new revolutionary SolidScale tech was unveiled and showcased at the 2017 Micron Summit in New York City's Freedom Tower, and TweakTown's own storage editor Jon Coulter attended the storage giant's big showcase.
Micron has revealed its new SolidScale architecture, a revolutionary platform that unlocks the full potential of NVMe SSDs.
The magic of SolidScale is that it takes the benefits of localized NVMe pools (high-speeds, large capacities) and spreads them out across an entire datacenter system. The SolidScale platform uses Micron SSDs outfitted with special high-bandwidth fabric interfaces to unlock full IOPs and speeds of the drive, and then share that performance across the entire system. SolidScale has lots of applications, but the main point takeaway is this: Micron has merged the benefits of NVMe and PCIe SSDs together with hardware and software to give datacenters a wealth of flexibility and power to help run their servers, cloud-driven analytics, and other intensive workloads.
"Do the same work with fewer servers, or do more work with your existing servers with a platform that pools the available storage together. This allows you to scale at high efficiency without sacrificing performance or driving up costs," Micron explains.
So why did Micron develop SolidScale?
Micron developed SolidScale as the first step towards empowering datacenters with sufficient resources needed for the data needs of the next generation. And the new architecture also furthers the new NVMe-over-Fabrics standard for enterprise adoption.
The tech fits a very real need in today's server market. Companies are constantly looking for low-cost solutions to their problems, especially when these solutions merge low-costs, power and speed without sacrifice. With SolidScale, companies can use their existing NVMe infrastructures and reap tangible benefits by "unlocking" the drive performance: high storage capacity, speed, and the raw IOPs power needed to drive certain workloads and applications.
And as data growth is on the rise and shows no signs of stopping, it's critical solutions like SolidState are implemented now in preparation for tomorrow's huge data creation.
Just how fast is data growing?
According to IDC, data growth will continue at a substantial rate by hitting an astronomical 163 zettabytes (163 trillion GB) by 2025. SolidScale is Micron's effort to ensure companies are ready for the massive influx of data.
IDC surveyed 800 businesses across nine countries to gauge data growth, and found that data is increasing at an average rate of 24% per year. As companies do more work such as real-time analytics, they create considerably more data--and this trend will continue on a yearly basis. Smaller companies tend to create less data, but bigger companies with 10,000 or more employees see 25% data growth.
This strong momentum of data growth poses some very real challenges for datacenters across the globe.
If the data growth continues as it has (and IDC notes that it will), 45% of surveyed companies are concerned they won't be able to meet performance needs. So Micron made SolidScale in an effort to arm IT experts, datacenters and key storage experts with the kind of high-end NVMe performance that's required for increased data flows and workloads.
Today Intel is announcing two new SSDs for the Datacenter. Both are based on Intel's 384Gbit 3D TLC flash technology. Normally TLC Flash of any flavor indicates lower performance and low endurance, but not this time. Intel has architected a brand new 12-channel controller and new firmware to power the DC P4500 and DC P4600. The result? The DC P4500 and DC P4600 are the highest performing Intel NAND-flash SSDs to date.
The DC P4500 is designed for high performance, massively scalable mainstream storage. The DC P4500 is available in capacities of 1, 2, and 4TB and two form factors; U.2 2.5"x 15mm and HHHL AIC. The DC P4500 is rated for 0.7 DWPD (Drive Writes Per Day) and is warranted for 5-years.
The DC P4600 sports the exact same physical hardware as the DC P4500. The difference between the DC P4600 and DC P4500 is the amount of overprovisioned space. With a healthy dose of OP, the DC P4600 is designed for caching and fast mixed workload storage performance. The DC P4600 in U.2 2.5"x 15mm form factor is available in capacities of 1.6, 2, and 3.2TB. The DC P4600 in HHHL AIC form factor is available in capacities of 2 and 4TB. The DC P4600 is rated for 2.9 DWPD (Drive Writes Per Day) and is warranted for 5-years.