ARM and GLOBALFOUNDRIES Establish A Strategic Partnership To Enable Application Optimized SoC Products On 28nm Highk Metal Gate (HKMG) Process
Relationship leverages synergies between ARM's leading low power processor architecture, optimized physical IP and partner Eco-system with GLOBALFOUNDRIES advanced technology, design and manufacturing excellence.
CAMBRIDGE, UK - October 6, 2009 - ARM® [(LSE: ARM); (Nasdaq: ARMH)] and GLOBALFOUNDRIES® today announces a long-term strategic relationship to provide their mutual customers with an innovative SoC enablement program. To support the long-term relationship, GLOBALFOUNDRIES and ARM have signed a broad agreement on processor implementation and circuit optimization to provide mutual customers with a robust enablement program geared towards next-generation applications.
The SoC enablement program, built around a full suite of ARM Physical IP, Fabric IP and Processor IP, will deliver customers unparalleled design flexibility on GLOBALFOUNDRIES' most advanced HKMG semiconductor manufacturing capabilities. The collaborative efforts of the partnership will initially focus on enabling SoC products which use the low power and high performance ARM Cortex -A9 processor on GLOBALFOUNDRIES 28nm HKMG process. The characteristics of GLOBALFOUNDRIES 28nm "Gate First" HKMG technology is optimized for high performance processing with minimal leakage making it an ideal choice for advanced mobile solutions.
"This announcement reflects our business value and strategy of providing best in class processor implementation by marrying our own processor and physical IP with world class manufacturing semiconductor technology," said Warren East, chief executive officer, ARM. "This collaboration with GLOBALFOUNDRIES and their commitment to delivering leading edge technology makes them an ideal partner to accelerate the adoption of ARM processor based technology at 28nm."
"This relationship further advances our strong focus to partner with industry leaders in processor design to deliver manufacturing and technology excellence at the leading edge," said Doug Grose, chief executive officer, GLOBALFOUNDRIES. "This highly complementary partnership leverages ARM's architectural leadership along with GLOBALFOUNDRIES advanced technology to enable the deployment of 28nm SoC designs with exceptional performance for next-generation consumer devices."
ARM designs the technology that lies at the heart of advanced digital products, from wireless, networking and consumer entertainment solutions to imaging, automotive, security and storage devices. ARM's comprehensive product offering includes 32-bit RISC microprocessors, graphics processors, video engines, enabling software, cell libraries, embedded memories, high-speed connectivity products, peripherals and development tools. Combined with comprehensive design services, training, support and maintenance, and the company's broad Partner community, they provide a total system solution that offers a fast, reliable path to market for leading electronics companies. More information on ARM is available at http://www.arm.com.
GLOBALFOUNDRIES is the world's first truly global leading-edge semiconductor manufacturing company. Launched in March 2009 through a partnership between AMD [NYSE: AMD] and the Advanced Technology Investment Company (ATIC), GLOBALFOUNDRIES provides a unique combination of leading-edge technology, manufacturing excellence and global operations. GLOBALFOUNDRIES is headquartered in Silicon Valley with facilities in Austin, Dresden and New York.
For more information on GLOBALFOUNDRIES, visit https://www.globalfoundries.com
Latest News Posts
- Donkey Kong Country: Tropical Freeze overview trailer reveal
- Infinity War Iron Spider Suit now comes with game pre-order
- AMD CPU hero Jim Keller leaving Tesla to join Intel
- NVIDIA GeForce 397.31 WHQL drivers enables RTX on Volta GPUs
- GeForce/Radeon GPUs shipments expected to drop by a huge 40%
- AsRock Z97 not picking up SATA drive
- GA-X79-UD3 NVMe
- MyDigitalDiscount 128GB/256GB/512GB M.2 NVMe PCIe SSD Review
- EVGA DG-77 Mid-Tower Chassis Review
- Samsung 970 EVO 1TB M.2 NVMe PCIe SSD Review
- Micron Launches Industry's First Enterprise SATA Solid State Drives Built on Leading 64-layer 3D NAND Technology
- Micron, Rambus, Northwest Logic and Avery Design to Deliver a Comprehensive GDDR6 Solution for Next-Generation Applications
- Toshiba Memory America Unveils UFS Devices Utilizing 64-Layer, 3D Flash Memory
- ASUS Announces GeForce GTX 1070 Ti Series Gaming Graphics Cards
- ASUS Announces ASUS Hangouts Meet Hardware Kit